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81. 发明申请

US20150000877A1 Heat-dissipating structure having suspended external tube and internally recycling heat transfer fluid and application apparatus 审中-公开
公开(公告)号：US20150000877A1
公开(公告)日：2015-01-01
申请号：US13937366
申请日：2013-07-09
申请人： Tai-Her Yang
发明人： Tai-Her Yang
IPC分类号： F28D1/053 , F28D7/12
CPC分类号： F28D7/12 , F21V29/59 , F21V29/77 , F28D1/053 , F28D15/00 , F28D15/025 , F28D15/0266 , F28D2021/0028 , F28F13/06 , F28F2250/08 , H01L23/34 , H01L23/427 , H01L23/44
摘要： The present invention is provided with a suspended external tube (101) and an inner tube (103) installed therein, wherein the diameter differentiation between the inner diameter of the external tube and the outer diameter of the inner tube is served to constitute a partitioned space as the fluid path, the front tube of the external tube is served to be installed with an electric energy application device assembly (108), and through the fluid pump (105) serially installed to the heat transfer fluid path pumping the heat transfer fluid to form a closed recycling fluid path, and through the exposed portion of the outer surface of the suspended external tube (101), temperature equalizing operation is enabled to perform with the external gaseous environment or the liquid or solid environment manually installed but not disposed in the stratum or liquid of the shallow ground natural thermal energy body.

82. 发明授权

US08913386B2 Cooling module for cooling electronic components 有权
标题翻译：用于冷却电子部件的冷却模块
公开(公告)号：US08913386B2
公开(公告)日：2014-12-16
申请号：US13432595
申请日：2012-03-28
申请人： Thomas Gradinger , Berk Yesin , Francesco Agostini
发明人： Thomas Gradinger , Berk Yesin , Francesco Agostini
IPC分类号： H05K7/20 , F28D15/02 , F28D1/03 , F28F3/14 , H01L23/427 , F28F1/00
CPC分类号： H05K7/20936 , F28D1/035 , F28D15/0266 , F28F1/00 , F28F3/14 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier.
摘要翻译：提供了一种包括冷凝器，包括冷却模块的功率模块和用于冷却电气和/或电子部件的方法的冷却模块。冷却模块的冷凝器包括用于冷却电气和/或电子部件的至少一个面板。两片板通过涉及辊粘合的方法彼此附接，使得在两片之间形成导管。导管沿着由片形成的平面的方向延伸。可以通过在面板的蒸发部分的管道中蒸发冷却剂并且通过在面板的冷凝部分处冷凝冷却剂来提供冷却。热负荷可以从热源传递到热接收单元。热接收单元适于将热负荷传递到面板，其通过热载体将热负载传递到周围环境。

83. 发明授权

US08904808B2 Heat pipes and thermoelectric cooling devices 有权
标题翻译：热管和热电冷却装置
公开(公告)号：US08904808B2
公开(公告)日：2014-12-09
申请号：US13496291
申请日：2010-07-15
申请人： Uttam Ghoshal , Ayan Guha
发明人： Uttam Ghoshal , Ayan Guha
IPC分类号： F25B21/02 , F28D15/02 , F28D15/04 , H01L35/30
CPC分类号： F28D15/0275 , F25B21/02 , F25B2321/025 , F28D15/0266 , F28D15/04 , H01L35/30
摘要： In various embodiments of the present invention, a thermoelectric cooling device with a thermoelectric device, heat pipe and a heat sink is provided. The thermoelectric device is connected to a chamber through a metal standoff. The chamber contains a fluid that needs to be cooled. The metal standoff has a shape, e.g. a bevel shape, to minimize heat leakage into the fluid. The heat pipes are preferably connected to the thermoelectric device with a Thermal Interface Material (TIM). In one embodiment, the heat pipes are attached to the thermoelectric device through screws which have an insulating standoff so as to minimize heat leakage into the fluid. In another embodiment of the present invention, two stage thermoelectric cooling devices with multiple heat pipes and common heat sink are provided to cool the fluid.
摘要翻译：在本发明的各种实施例中，提供了具有热电装置，热管和散热器的热电冷却装置。热电装置通过金属支架连接到室。该室含有需要冷却的流体。金属支座具有形状，例如一个斜面形状，以最大限度地减少流入流体的热量。热管优选地通过热界面材料（TIM）连接到热电装置。在一个实施例中，热管通过具有绝缘支架的螺钉附接到热电装置，以便使流入流体的热量最小化。在本发明的另一实施例中，提供具有多个热管和公共散热器的两级热电冷却装置以冷却流体。

84. 发明申请

US20140311176A1 PHASE TRANSFER HEAT DISSIPATING DEVICE AND PHASE TRANSFER HEAT DISSIPATING SYSTEM 审中-公开
标题翻译：相传热装置和相传传热系统
公开(公告)号：US20140311176A1
公开(公告)日：2014-10-23
申请号：US14023989
申请日：2013-09-11
申请人： MICROTHERMAL TECHNOLOGY CORP.
发明人： Hsien-Chun Meng , Chih-Chiang Ku , Che-Wei Liao , Wen-Kai Tsai
IPC分类号： F25D7/00 , F28B9/00
CPC分类号： F25D7/00 , F28B9/00 , F28D15/0266 , F28F3/022 , F28F3/12 , F28F9/0246 , F28F9/028 , H01L23/427 , H01L23/467 , H01L23/4735 , H01L2924/0002 , H01L2924/00
摘要： A volumetric phase transfer heat dissipating system includes a base, a cap and an atomizing member. The base includes a plurality of conducting members. The cap is engaged with the base to form a chamber. The conducting members are disposed in the chamber and extended toward the cap. The cap includes an inlet connecting portion for being connected to a fluid transmission tube and includes an outlet connecting portion for being connected to a vapor transmission tube. The atomizing member is sleeved to the inlet connecting portion and disposed between the fluid transmission tube and the chamber. A working fluid in the fluid transmission tube flows into the chamber via the atomizing member and forms liquid on inner walls of the chamber and outer walls of the conducting members, and the liquid is vaporized after absorbing heat and flows out via the vapor transmission tube.
摘要翻译：体积相转移散热系统包括基座，帽和雾化构件。底座包括多个导电构件。盖与基座接合以形成一个室。导电构件设置在室中并朝向盖延伸。盖包括用于连接到流体传输管的入口连接部分，并且包括用于连接到蒸气传输管的出口连接部分。雾化构件套入到入口连接部分并且设置在流体传输管和腔室之间。流体传输管中的工作流体经由雾化部件流入腔室，并且在腔室的内壁和导电构件的外壁上形成液体，并且在吸收热量后液体被蒸发并经由蒸气传输管流出。

85. 发明授权

US08839519B2 Method of making cold chassis for electronic modules 有权
标题翻译：电子模块制冷底盘的方法
公开(公告)号：US08839519B2
公开(公告)日：2014-09-23
申请号：US12590865
申请日：2009-11-16
申请人： David H. Altman , Scott R. Cheyne , Anurag Gupta
发明人： David H. Altman , Scott R. Cheyne , Anurag Gupta
IPC分类号： B21D39/06 , B23P15/26 , H05K7/20 , F28F3/12 , F28F9/02 , F28F3/02 , F28D15/02 , F28D21/00 , H01L23/473
CPC分类号： H05K7/20418 , F28D15/0266 , F28D2021/0029 , F28F3/02 , F28F3/12 , F28F9/02 , F28F2260/02 , F28F2275/04 , F28F2275/062 , H01L23/473 , H01L2924/0002 , H05K7/2029 , H05K7/20636 , H05K7/20645 , Y10T29/4935 , Y10T29/49359 , Y10T29/49366 , Y10T29/49369 , Y10T29/49373 , H01L2924/00
摘要： A scalable method of edge cooling and making a cold chassis for electronic modules. The steps include fabrication of modular cooling ribs, each including microchannels along the cooling edge and a peripheral flange. A set of adjacent ribs are secured together and assembled onto at least one face of a chassis frame member. The rib flanges are sealed (e.g. friction stir welded) with respect to the frame member. The Application includes new and retrofit environments with increased cooling needs and multi-scaled manufacturing.
摘要翻译：边缘冷却的可扩展方法，并为电子模块制造冷底盘。这些步骤包括制造模块化冷却肋，每个散热肋包括沿着冷却边缘的微通道和周边凸缘。一组相邻的肋固定在一起并组装到底盘框架构件的至少一个面上。肋凸缘相对于框架构件被密封（例如摩擦搅拌焊接）。该应用程序包括具有增加的冷却需求和多尺度制造的新的和改进的环境。

86. 发明申请

US20140262158A1 TWO-PHASE COOLING SYSTEM 审中-公开
标题翻译：两相冷却系统
公开(公告)号：US20140262158A1
公开(公告)日：2014-09-18
申请号：US13835770
申请日：2013-03-15
申请人： PARKER-HANNIFIN CORPORATION
发明人： Brandon Joseph Wegmann , Stephen John O'Shaughnessey
IPC分类号： F28D15/02 , B23P15/26
CPC分类号： F28D15/02 , B23P15/26 , F25B23/006 , F28D1/024 , F28D15/0266 , F28D15/0275 , F28D2001/0273 , H01L23/427 , H01L2924/0002 , Y10T29/49359 , H01L2924/00
摘要： Provided is a modular pumped loop cooling apparatus including a cooling module and a pumping module, wherein the pumping module has an inlet coupling for mating with a corresponding outlet coupling of the cooling module when the cooling module is placed atop the pumping module. The modular pumped loop cooling apparatus is provided as a standalone unit that can be coupled to any one of a plurality of heat sinks having different heat loads. The cooling apparatus is therefore scalable to accommodate a wide range of cooling applications so that the apparatus does not have to be redesigned to accommodate a particular system.
摘要翻译：提供了一种包括冷却模块和泵送模块的模块化泵回路冷却装置，其中当冷却模块放置在泵送模块顶部时，泵送模块具有入口联接件，用于与冷却模块的相应出口联接配合。模块化泵送回路冷却装置被提供为独立的单元，其可以耦合到具有不同热负荷的多个散热器中的任一个。因此，冷却装置是可扩展的，以适应宽范围的冷却应用，使得该装置不必重新设计以适应特定的系统。

87. 发明申请

US20140232221A1 Centrifugal Heat Dissipation Device and Motor Using Same 有权
标题翻译：离心式散热装置及电机使用相同
公开(公告)号：US20140232221A1
公开(公告)日：2014-08-21
申请号：US14259774
申请日：2014-04-23
申请人： Asia Vital Components Co., Ltd.
发明人： Shyy-Woei Chang , Kuei-Feng Chiang
IPC分类号： H02K9/20 , H02K1/32
CPC分类号： H02K9/20 , F28D15/0208 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28D15/046 , F28D2015/0291 , F28F2250/08 , H02K1/32
摘要： A centrifugal heat dissipation device and a motor using same are disclosed. The centrifugal heat dissipation device includes a main body having a shaft hole, a heat-absorption zone and a heat-transfer zone. The heat-transfer zone has a radially outer side connected to the heat-absorption zone and a radially inner side connected to the shaft hole. The shaft hole axially extends through the main body for receiving a shaft of a motor therein. A centrifugal force generated by the rotating shaft and accordingly, the heat dissipation device enables enhanced vapor-liquid circulation of a working fluid in the heat dissipation device, so that heat generated by the operating motor is absorbed by the centrifugal heat dissipation device and transferred to the shaft for guiding out of the motor, allowing the motor to have largely upgraded heat dissipation performance.
摘要翻译：公开了一种离心式散热装置及使用该离心式散热装置的电动机。离心式散热装置包括具有轴孔，吸热区域和传热区域的主体。传热区具有连接到吸热区的径向外侧和连接到轴孔的径向内侧。轴孔轴向延伸穿过主体，用于在其中容纳马达的轴。由旋转轴产生的离心力，因此散热装置能够增强散热装置中的工作流体的蒸气 - 液体循环，使得由操作电动机产生的热量被离心散热装置吸收并转移到用于引导电机的轴，允许电机大大提高散热性能。

88. 发明申请

US20140216711A1 Scalable, Multi-Vessel Distribution System for Liquid Level Control Within Immersion Cooling Tanks 有权
标题翻译：可扩展的多容器分配系统，用于浸入式冷却箱内的液位控制
公开(公告)号：US20140216711A1
公开(公告)日：2014-08-07
申请号：US13756904
申请日：2013-02-01
申请人： DELL PRODUCTS L.P.
发明人： Austin Michael Shelnutt , James D. Curlee , Edmond I. Bailey , Richard Steven Mills
IPC分类号： F28D15/00
CPC分类号： H05K7/20781 , F28D15/0266 , F28F2280/10 , H05K7/203 , H05K7/20772
摘要： A fluid level control system includes: a first immersion cooling tank having a first volume of immersion cooling liquid and an inlet/outlet pipe extending from a base wall of the tank by which immersion cooling liquid can flow into and out of the first immersion cooling tank; at least one second volume of cooling liquid held within a liquid containing unit having a corresponding inlet/outlet pipe; and a pipe distribution system that physically connects the second volume of immersion cooling liquid to the first volume of immersion cooling liquid via respective inlet/outlet pipes and which enables fluid equilibrium to be maintained between the first volume of liquid and the second volume of liquid via gravitational equilibrium and/or passive level control such that a first volume level of the first volume of immersion cooling liquid remains substantially equal to a second volume level of the second volume of immersion cooling liquid.
摘要翻译：液位控制系统包括：具有第一体积的浸没冷却液体的第一浸没冷却槽和从所述罐的底壁延伸的入口/出口管，浸没冷却液体可以通过所述入口/出口管流入和流出第一浸没冷却槽 ; 至少一个第二体积的冷却液体保持在具有相应入口/出口管的液体容纳单元内; 以及管道分配系统，其通过相应的入口/出口管将第二体积的浸没冷却液体物理地连接到第一体积的浸没冷却液体，并且使得能够在第一体积的液体和第二体积的液体经由之间保持液体平衡重力平衡和/或被动水平控制，使得第一体积的浸入式冷却液体的第一体积水平基本上等于第二体积的浸入式冷却液体的第二体积水平。

89. 发明授权

US08797741B2 Maintaining thermal uniformity in micro-channel cold plates with two-phase flows 有权
标题翻译：保持具有两相流动的微通道冷板的热均匀性
公开(公告)号：US08797741B2
公开(公告)日：2014-08-05
申请号：US12909347
申请日：2010-10-21
申请人： David H. Altman
发明人： David H. Altman
IPC分类号： H05K7/20 , F28F7/00 , F28D15/00 , B21D53/02
CPC分类号： F28F3/12 , F28D15/0266 , F28D2021/0029 , F28F9/026 , F28F2260/02 , H01L23/427 , H01L23/473 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A cold plate system including, in one embodiment, first and second flow paths extending from a common inlet to a common outlet, wherein the first and second flow paths enable two-phase coolant flow under pressure through micro-channels for cooling heat loads on the cold plate system, first and second orifices disposed in the first flow path on an inlet side of the first flow path, and a third orifice spaced from a fourth orifice, the third and fourth orifices disposed in the second flow path on an inlet side of the second flow path, wherein the first and second orifices in the first flow path and the third and fourth orifices in the second flow path minimize a difference in mass flow rate between the first and second flow paths when the first and second flow paths are exposed to different heat loads.
摘要翻译：一种冷板系统，在一个实施例中包括从公共入口延伸到公共出口的第一和第二流动路径，其中第一和第二流动路径使两相冷却剂在压力下流过微通道以冷却冷板系统，设置在第一流路中的第一和第二孔口在第一流路的入口侧，以及与第四孔口间隔开的第三孔口，第三和第四孔口设置在第二流动路径中的入口侧第二流动路径，其中第一流动路径中的第一和第二孔口和第二流动路径中的第三和第四孔口当第一和第二流动路径暴露时使得第一和第二流动路径之间的质量流量差异最小化到不同的热负荷。

90. 发明授权

US08792240B2 Heat dissipation device and radio frequency module with the same 有权
标题翻译：散热装置和射频模块相同
公开(公告)号：US08792240B2
公开(公告)日：2014-07-29
申请号：US13327059
申请日：2011-12-15
申请人： Taqing Feng , Zhijian Li , Yuping Hong , Hongliang Chen , Jian Shi
发明人： Taqing Feng , Zhijian Li , Yuping Hong , Hongliang Chen , Jian Shi
IPC分类号： H05K7/20 , F28D15/02
CPC分类号： F28D15/0266 , F28D15/0233 , F28D15/0275 , H05K7/20336
摘要： A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (1). The substrate (1) having a surface where a heat absorbing surface (5) is formed. There are multiple hollow conduits inside the substrate (1) to act as evaporating conduits (6). The heat dissipation device further comprises condensing conduits (7) intercommunicated with the evaporating conduits (6). The evaporating conduits (6) and the condensing conduits (7) form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits (6) are set in the substrate (1).
摘要翻译：提供了一种散热装置及其射频模块。散热装置包括基板（1）。具有形成有吸热面（5）的表面的基板（1）。衬底（1）内部有多个中空管道，用作蒸发管道（6）。散热装置还包括与蒸发管道（6）相通的冷凝管道（7）。蒸发管道（6）和冷凝管道（7）形成密封的管道。密封的管道充满加热时气化的液体。至少蒸发管道（6）设置在基板（1）中。

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