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81. 发明授权

US07605344B2 Laser beam machining method, laser beam machining apparatus, and laser beam machining product 有权
标题翻译：激光束加工方法，激光束加工装置和激光束加工产品
公开(公告)号：US07605344B2
公开(公告)日：2009-10-20
申请号：US10564840
申请日：2004-07-16
申请人： Kenshi Fukumitsu
发明人： Kenshi Fukumitsu
IPC分类号： B23K26/38 , H01L21/301
CPC分类号： B23K26/032 , B23K26/0006 , B23K26/03 , B23K26/0643 , B23K26/0665 , B23K26/361 , B23K26/40 , B23K26/53 , B23K26/55 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D1/221 , B28D5/0011 , Y10T428/24479
摘要： It is an object to provide a laser beam machining method which can easily cut a machining target. The laser beam machining method irradiates laser light while positioning a focus point at the inside of a machining target to thereby form a treated area based on multiphoton absorption along a planned cutting line of the machining target inside the machining target and also form a minute cavity at a predetermined position corresponding to the treated area in the machining target.
摘要翻译：本发明的目的是提供一种能够容易地切割加工对象物的激光加工方法。激光束加工方法在将焦点定位在加工对象的内侧的同时照射激光，从而沿着加工对象内部的加工对象的规划切割线基于多光子吸收形成处理区域，并且还在对应于加工对象中的处理区域的预定位置。

82. 发明授权

US5121404A Optically pumped solid laser 失效
标题翻译：光学抽吸固体激光
公开(公告)号：US5121404A
公开(公告)日：1992-06-09
申请号：US701342
申请日：1991-05-09
申请人： Shinichiro Aoshima , Kenshi Fukumitsu
发明人： Shinichiro Aoshima , Kenshi Fukumitsu
IPC分类号： H01S3/06 , H01S3/08 , H01S3/094 , H01S3/0941 , H01S3/108 , H01S3/109
CPC分类号： H01S3/109 , H01S3/0602 , H01S3/09415 , H01S3/1083 , H01S3/0615 , H01S3/0621 , H01S3/0627 , H01S3/094053 , H01S3/09408
摘要： An optically pumped solid laser that uses a corner cube or rectangular prism as its solid laser medium, containing end faces through which a semiconductor pumping light beam is applied to the medium. The solid laser medium contains at least one kind of coating formed on at least a part of an end face, such that the end face acts as a resonator and/or output mirror. Optical fibers may be connected to the end faces for inputting or outputting light beams. Non-linear crystals in waveguide form may be coupled to the outputting end face of the medium, specifically crystals of either SHG, THG, FHG, or parameteric; and KTP, .beta.-BaB.sub.2 O.sub.4, KNbP.sub.3, or MgO doped LiNbO.sub.3.

83. 发明授权

US08933410B2 Three-dimensional position-sensitive radiation detector and method of identifying radiation detected positions therein 有权
标题翻译：三维位置敏感辐射检测器和识别其中辐射检测位置的方法
公开(公告)号：US08933410B2
公开(公告)日：2015-01-13
申请号：US13636936
申请日：2010-03-29
申请人： Naoko Inadama , Hideo Murayama , Taiga Yamaya , Mitsuo Watanabe , Takahiro Moriya , Kenshi Fukumitsu , Tomohide Omura
发明人： Naoko Inadama , Hideo Murayama , Taiga Yamaya , Mitsuo Watanabe , Takahiro Moriya , Kenshi Fukumitsu , Tomohide Omura
IPC分类号： G01T1/20 , G01T1/164
CPC分类号： G01T1/1644
摘要： A three-dimensional position-sensitive radiation detector is provided which has a three-dimensional array of photodetectors disposed on the surface of a scintillator block and which is capable of three-dimensionally identifying the position of light emission at which radiation has been detected within the detector. The three-dimensional position-sensitive radiation detector includes: a scintillator block including a central portion which restricts the direction of diffusion of light so as to direct the light in three axial directions and which has an optically discontinuous region, and an outer portion which is disposed on the outside of the central portion and which does not restrict the direction of diffusion of light; and photodetectors disposed on at least two outer circumferential surfaces of the scintillator block. The detector identifies three-dimensionally the position of light emission, thereby preventing deterioration in position discrimination performance even when inner scintillator elements are smaller than the photodetectors.
摘要翻译：提供了三维位置敏感的放射线检测器，其具有设置在闪烁体块的表面上的光电检测器的三维阵列，并且能够三维地识别已经在其内检测到辐射的发光的位置探测器。三维位置敏感型放射线检测器包括：闪烁体块，其包括限制光的扩散方向的中心部，以使光在三个轴向引导，并具有光学不连续区域;外部部分设置在中心部分的外侧，并且不限制光的扩散方向; 以及设置在闪烁体块的至少两个外周表面上的光电检测器。检测器三维地识别发光的位置，从而即使当内部闪烁体元件小于光电检测器时也防止位置判别性能的劣化。

84. 发明授权

US08872067B2 Laser beam working machine 有权
标题翻译：激光束加工机
公开(公告)号：US08872067B2
公开(公告)日：2014-10-28
申请号：US13143636
申请日：2009-12-04
申请人： Kenshi Fukumitsu , Shingo Oishi , Shinichiro Aoshima , Atsuko Aoshima
发明人： Kenshi Fukumitsu , Shingo Oishi , Shinichiro Aoshima
IPC分类号： B23K26/08 , B23K26/073
CPC分类号： B23K26/0732 , B23K26/0617 , B23K26/073 , B23K26/0738 , B23K26/08
摘要： A cylindrical lens (4) diverges a laser beam (L1) in the Y-axis direction (i.e., within the YZ plane) but neither diverges nor converges it in the X-axis direction (i.e., within the ZX plane). An objective lens (5) converges the laser beam (L1) emitted from the cylindrical lens (4) into a point P1 in the Y-axis direction and into a point P2 in the X-axis direction. A pair of knife edges (13) adjust the divergence angle (θ) of the laser beam (L1) incident on the objective lens (5) in the Y-axis direction. As a consequence, the cross section of the laser beam (L1) becomes an elongated form extending in the Y-axis direction at the point P2, while the maximum length in the Y-axis direction is regulated. Therefore, locating the point P2 on the front face of a work (S) can form an elongated working area extending in the Y-axis direction by a desirable length on the front face of the work (S).
摘要翻译：柱面透镜（4）在Y轴方向（即，在YZ平面内）分散激光束（L1），但是在X轴方向（即，ZX平面内）中也不会发散或会聚。物镜（5）将从柱面透镜（4）射出的激光束（L1）向Y轴方向的点P1会聚，并将X轴方向的点P2会聚。一对刀刃（13）调整在Y轴方向入射到物镜（5）上的激光束（L1）的发散角（＆amp; L）。结果，激光束（L1）的横截面变为在点P2处沿Y轴方向延伸的细长形状，同时限制Y轴方向上的最大长度。因此，将点P2定位在工件（S）的前表面上可以形成在工件（S）的正面上沿Y轴方向延伸期望长度的细长工作区域。

85. 发明申请

US20120006797A1 LASER BEAM WORKING MACHINE 有权
标题翻译：激光束工作机
公开(公告)号：US20120006797A1
公开(公告)日：2012-01-12
申请号：US13143636
申请日：2009-12-04
申请人： Kenshi Fukumitsu , Shingo Oishi , Shinichiro Aoshima , Atsuko Aoshima
发明人： Kenshi Fukumitsu , Shingo Oishi , Shinichiro Aoshima , Atsuko Aoshima
IPC分类号： B23K26/00
CPC分类号： B23K26/0732 , B23K26/0617 , B23K26/073 , B23K26/0738 , B23K26/08
摘要： A cylindrical lens (4) diverges a laser beam (L1) in the Y-axis direction (i.e., within the YZ plane) but neither diverges nor converges it in the X-axis direction (i.e., within the ZX plane). An objective lens (5) converges the laser beam (L1) emitted from the cylindrical lens (4) into a point P1 in the Y-axis direction and into a point P2 in the X-axis direction. A pair of knife edges (13) adjust the divergence angle (θ) of the laser beam (L1) incident on the objective lens (5) in the Y-axis direction. As a consequence, the cross section of the laser beam (L1) becomes an elongated form extending in the Y-axis direction at the point P2, while the maximum length in the Y-axis direction is regulated. Therefore, locating the point P2 on the front face of a work (S) can form an elongated working area extending in the Y-axis direction by a desirable length on the front face of the work (S).
摘要翻译：柱面透镜（4）在Y轴方向（即，在YZ平面内）分散激光束（L1），但是在X轴方向（即，ZX平面内）中也不会发散或会聚。物镜（5）将从柱面透镜（4）射出的激光束（L1）向Y轴方向的点P1会聚，并将X轴方向的点P2会聚。一对刀刃（13）调整在Y轴方向入射到物镜（5）上的激光束（L1）的发散角（＆amp; L）。结果，激光束（L1）的横截面变为在点P2处沿Y轴方向延伸的细长形状，同时限制Y轴方向上的最大长度。因此，将点P2定位在工件（S）的前表面上可以形成在工件（S）的正面上沿Y轴方向延伸期望长度的细长工作区域。

86. 发明申请

US20070170159A1 Laser beam machining method, laser beam machining apparatus, and laser beam machining product 有权
标题翻译：激光束加工方法，激光束加工装置和激光束加工产品
公开(公告)号：US20070170159A1
公开(公告)日：2007-07-26
申请号：US10564840
申请日：2004-07-16
申请人： Kenshi Fukumitsu
发明人： Kenshi Fukumitsu
IPC分类号： B23K26/38 , H01L21/00 , H01L21/301
CPC分类号： B23K26/032 , B23K26/0006 , B23K26/03 , B23K26/0643 , B23K26/0665 , B23K26/361 , B23K26/40 , B23K26/53 , B23K26/55 , B23K2101/40 , B23K2103/50 , B23K2103/56 , B28D1/221 , B28D5/0011 , Y10T428/24479
摘要： It is an object to provide a laser beam machining method which can easily cut a machining target. The laser beam machining method irradiates laser light while positioning a focus point at the inside of a machining target to thereby form a treated area based on multiphoton absorption along a planned cutting line of the machining target inside the machining target and also form a minute cavity at a predetermined position corresponding to the treated area in the machining target.
摘要翻译：本发明的目的是提供一种能够容易地切割加工对象物的激光加工方法。激光束加工方法在将焦点定位在加工对象的内侧的同时照射激光，从而沿着加工对象内部的加工对象的规划切割线基于多光子吸收形成处理区域，并且还在对应于加工对象中的处理区域的预定位置。

87. 发明申请

US20120061356A1 LASER MACHINING DEVICE AND LASER MACHINING METHOD 审中-公开
标题翻译：激光加工设备和激光加工方法
公开(公告)号：US20120061356A1
公开(公告)日：2012-03-15
申请号：US13322301
申请日：2010-08-06
申请人： Kenshi Fukumitsu
发明人： Kenshi Fukumitsu
IPC分类号： B23K26/38
CPC分类号： B23K26/0622 , B23K26/0006 , B23K26/0604 , B23K26/0613 , B23K26/0624 , B23K26/53 , B23K2101/40 , B23K2103/54 , B23K2103/56 , B28D5/0005 , B28D5/0011 , C03B33/0222
摘要： The controllability of modified spots is improved. A laser processing apparatus 100 comprises a first laser light source 101 for emitting a first pulsed laser light L1, a second laser light source 102 for emitting a second pulsed laser light L2, half-wave plates 104, 105 for respectively changing directions of polarization of the pulsed laser light L1, L2, polarization beam splitters 106, 107 for respectively polarization-separating the pulsed laser light L1, L2 having changed the directions of polarization, and a condenser lens 112 for converging the polarization-separated pulsed laser light L1, L2 at an object to be processed 1. When the directions of polarization of the pulsed laser light L1, L2 changed by the half-wave plates 104, 105 are varied by a light intensity controller 121 in the laser processing apparatus 100, the ratios of the pulsed laser light L1, L2 polarization-separated by the polarization beam splitters 106, 107 are altered, whereby the respective intensities of the pulsed laser light L1, L2 are adjusted.
摘要翻译：改良斑点的可控性得到改善。激光加工装置100包括用于发射第一脉冲激光L1的第一激光光源101，用于发射第二脉冲激光L2的第二激光源102，用于分别改变偏振方向的半波片104,105 脉冲激光L1，L2，用于分别偏振分离脉冲激光L1，改变偏振方向的L2的偏振分束器106,107以及用于会聚偏振分离的脉冲激光L1，L2 在由激光加工设备100中的光强度控制器121改变由半波片104,105改变的脉冲激光L1，L2的极化方向时，由偏振分束器106,107偏振分离的脉冲激光L1，L2被改变，从而调节脉冲激光L1，L2的各自的强度。

88. 发明授权

US08110422B2 Manufacturing method of semiconductor laser element 有权
标题翻译：半导体激光元件的制造方法
公开(公告)号：US08110422B2
公开(公告)日：2012-02-07
申请号：US12676666
申请日：2008-09-02
申请人： Masayoshi Kumagai , Kenshi Fukumitsu , Koji Kuno
发明人： Masayoshi Kumagai , Kenshi Fukumitsu , Koji Kuno
IPC分类号： H01L21/00
CPC分类号： B23K26/0624 , B23K26/0853 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , C03B33/0222 , H01L21/78 , H01S5/0201 , Y02P40/57
摘要： Starting point regions for cutting 8a, 8b extending along lines to cut 5a, 5b are initially formed in an object to be processed 1. The starting point regions for cutting 8b have modified regions 7b formed by irradiating the object 1 with laser light while locating a converging point within the object 1 and are formed in parts extending along the lines to cut 5b excluding portions 34b intersecting the lines to cut 5a. This makes the starting point regions for cutting 8b much less influential when cutting the object 1 from the starting point regions for cutting 8a acting as a start point, whereby bars with precise cleavage surfaces can reliably be obtained. Therefore, it is unnecessary to form a starting point region for cutting along the lines to cut 5b in each of a plurality of bars, whereby the productivity of semiconductor laser elements can be improved.
摘要翻译：最初在被加工物1中形成沿切割线5a，5b延伸的用于切割的切割8a，8b的起点区域。用于切割8b的起点区域具有通过用激光照射物体1而形成的改变区域7b，同时定位在物体1内的会聚点，并且形成为沿着切割线的线延伸的部分，除了与切割线5a相交的部分34b。这样，从切点8a的起点区域切断物体1时，能够切割8b的起点区域的影响更小，从而可以可靠地获得具有精确的切割面的条。因此，不需要在多个条中形成沿着切割线5b切割的起点区域，从而可以提高半导体激光元件的生产率。

89. 发明申请

US20110274128A1 LASER BEAM WORKING MACHINE 有权
标题翻译：激光束工作机
公开(公告)号：US20110274128A1
公开(公告)日：2011-11-10
申请号：US13143604
申请日：2009-12-04
申请人： Kenshi Fukumitsu , Shingo Oishi , Shinichiro Aoshima
发明人： Kenshi Fukumitsu , Shingo Oishi , Shinichiro Aoshima
IPC分类号： H01S3/02
CPC分类号： B23K26/0736 , B23K26/0617 , B23K26/0738 , B23K26/08 , B23K26/53
摘要： A cylindrical lens (4) diverges a laser beam (L1) in the Y-axis direction (i.e., within the YZ plane) but neither diverges nor converges it in the X-axis direction (i.e., within the ZX plane). An objective lens (5) converges the laser beam (L1) emitted from the cylindrical lens (4) into a point P1 in the Y-axis direction and into a point P2 in the X-axis direction. As a consequence, the cross section of the laser beam (L1) becomes elongated forms extending in the X- and Y-axis directions at the points P1, P2, respectively. Therefore, when the points P1, P2 are located on the outside and inside of the work (S), respectively, an elongated working area extending in the Y-axis direction can be formed in a portion where the point P2 is positioned within the work (S).
摘要翻译：柱面透镜（4）在Y轴方向（即，在YZ平面内）分散激光束（L1），但是在X轴方向（即，ZX平面内）中也不会发散或会聚。物镜（5）将从柱面透镜（4）射出的激光束（L1）向Y轴方向的点P1会聚，并将X轴方向的点P2会聚。因此，激光束（L1）的横截面分别成为在点P1，P2处沿X轴方向和Y轴方向延伸的细长形状。因此，当点P1，P2分别位于工件（S）的外侧和内部时，可以在点P2位于工件（S）内的部分中形成沿Y轴方向延伸的细长工作区域（S）。

90. 发明申请

US20100178751A1 LASER PROCESSING METHOD AND SEMICONDUCTOR CHIP 有权
标题翻译：激光加工方法和半导体芯片
公开(公告)号：US20100178751A1
公开(公告)日：2010-07-15
申请号：US12748077
申请日：2010-03-26
申请人： Takeshi SAKAMOTO , Kenshi Fukumitsu
发明人： Takeshi SAKAMOTO , Kenshi Fukumitsu
IPC分类号： H01L21/268
CPC分类号： B28D5/0011 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/172 , B23K2103/50
摘要： A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a high precision.This laser processing method irradiates a substrate 4 with laser light L while using a rear face 21 as a laser light entrance surface and locating a light-converging point P within the substrate 4, so as to form modified regions 71, 72, 73 within the substrate 4. Here, the quality modified region 71 is formed at a position where the distance between the front face 3 of the substrate 4 and the end part of the quality modified region 71 on the front face side is 5 μm to 15 μm. When the quality modified region 71 is formed at such a position, a laminate part 16 (constituted by interlayer insulating films 17a, 17b here) formed on the front face 3 of the substrate 4 is also cut along a line to cut with a high precision together with the substrate 4.
摘要翻译：提供了一种激光加工方法，即使当形成有包括多个功能元件的层叠部件的基板较厚时，也可以高精度地切割基板并层压部件。该激光加工方法使用背面21作为激光入射面，用激光L照射基板4，并且将聚光点P定位在基板4内，以在其内部形成改质区域71,72,73 这里，质量改质区域71形成在基板4的正面3与正面侧的质量改质区域71的端部之间的距离为5μm〜15μm的位置。当在这样的位置形成质量改良区域71时，也形成在基板4的正面3上形成的层叠体部16（由这里的层间绝缘膜17a，17b构成），沿着切割线切割高精度与基板4一起。

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