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81. 发明申请

US20110316080A1 FIN TRANSISTOR STRUCTURE AND METHOD OF FABRICATING THE SAME 有权
标题翻译： FIN晶体管结构及其制造方法
公开(公告)号：US20110316080A1
公开(公告)日：2011-12-29
申请号：US12937486
申请日：2010-06-24
申请人： Zhijiong Luo , Huilong Zhu , Haizhou Yin
发明人： Zhijiong Luo , Huilong Zhu , Haizhou Yin
IPC分类号： H01L29/772 , H01L21/28
CPC分类号： H01L29/7851 , H01L29/66795
摘要： There is provided a fin transistor structure and a method of fabricating the same. The fin transistor structure comprises a fin formed on a semiconductor substrate, wherein an insulation material is formed between a portion of the fin serving as the channel region of the transistor structure and the substrate, and a bulk semiconductor material is formed between remaining portions of the fin and the substrate. Thereby, it is possible to reduce the current leakage while maintaining the advantages such as low cost and high heat transfer.
摘要翻译：提供鳍式晶体管结构及其制造方法。翅片晶体管结构包括形成在半导体衬底上的鳍片，其中在用作晶体管结构的沟道区域的鳍片的一部分和衬底之间形成绝缘材料，并且在半导体衬底的剩余部分之间形成体半导体材料翅片和底物。由此，可以在保持低成本，高热传递等优点的同时，减小电流泄漏。

82. 发明申请

US20110298018A1 TRANSISTOR AND MANUFACTURING METHOD OF THE SAME 审中-公开
标题翻译：晶体管及其制造方法
公开(公告)号：US20110298018A1
公开(公告)日：2011-12-08
申请号：US12937502
申请日：2010-06-28
申请人： Haizhou Yin , Zhijiong Luo , Huilong Zhu
发明人： Haizhou Yin , Zhijiong Luo , Huilong Zhu
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L29/4983 , H01L21/28105 , H01L29/512 , H01L29/513 , H01L29/517 , H01L29/66545
摘要： The invention provides a transistor, including: a substrate having a channel region; a source region and a drain region on two ends of the channel region of the substrate respectively; a gate high-K dielectric layer on a top surface of the substrate above the channel region between the source region and the drain region; an interfacial layer under the gate high-K dielectric layer, including a first portion near the source region and a second portion near the drain region, wherein an equivalent oxide thickness of the first portion is larger than that of the second portion. An asymmetric replacement metal gate forms an asymmetric interfacial layer, which is thin at the drain region side and thick at the source region side. At the thin drain region side, the short channel effect is significant and the asymmetric interfacial layer advantageously suppresses the short channel effect. At the thick source region side, the carrier mobility has a large influence on the device, and the asymmetric interfacial layer prevents the carrier mobility from decreasing. Further, the asymmetric replacement metal gate implements an asymmetric metal work function.
摘要翻译：本发明提供一种晶体管，包括：具有沟道区的衬底; 分别在所述衬底的沟道区域的两端上的源极区域和漏极区域; 位于源极区域和漏极区域之间的沟道区域上方的衬底顶表面上的栅极高K电介质层; 在栅极高K电介质层下面的界面层，包括靠近源区的第一部分和靠近漏极区的第二部分，其中第一部分的等效氧化物厚度大于第二部分的等效氧化物厚度。不对称替代金属栅极形成不对称界面层，其在漏极区侧较薄，在源极区侧较厚。在薄漏极侧，短沟道效应显着，不对称界面层有利地抑制了短沟道效应。在较厚的源极侧，载流子迁移率对器件的影响较大，不对称界面层阻止载流子迁移率降低。此外，不对称替代金属栅极实现了非对称金属功能。

83. 发明申请

US20110291184A1 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体结构及其制造方法
公开(公告)号：US20110291184A1
公开(公告)日：2011-12-01
申请号：US13062911
申请日：2010-09-26
申请人： Haizhou Yin , Zhijiong Luo , Huilong Zhu
发明人： Haizhou Yin , Zhijiong Luo , Huilong Zhu
IPC分类号： H01L29/78 , H01L21/336 , B82Y99/00
CPC分类号： H01L29/78687 , H01L29/66545 , H01L29/66621 , H01L29/66772
摘要： The present application discloses a semiconductor structure and a method for manufacturing the same. The semiconductor structure comprises a semiconductor substrate; an epitaxial semiconductor layer formed on two side portions of the semiconductor substrate; a gate stack formed at a central position on the semiconductor substrate and abutting the epitaxial semiconductor layer, the gate comprising a gate conductor layer and a gate dielectric layer which is sandwiched between the gate conductor layer and the semiconductor substrate and surrounding the lateral surfaces of the gate conductor layer; and a sidewall spacer formed on the epitaxial semiconductor layer and surrounding the gate. The method for manufacturing the above semiconductor structure comprises forming raised source/drain regions in the epitaxial semiconductor layer utilizing the sacrificial gate. The semiconductor structure and the method for manufacturing the same can simplify the fabrication process for an ultra-thin SOI transistor and reduce the ON-state resistance and power consumption of the transistor.
摘要翻译：本申请公开了一种半导体结构及其制造方法。半导体结构包括半导体衬底; 形成在所述半导体衬底的两个侧面上的外延半导体层; 形成在所述半导体衬底上的中心位置并与所述外延半导体层邻接的栅极叠层，所述栅极包括栅极导体层和栅极电介质层，所述栅极介电层夹在所述栅极导体层和所述半导体衬底之间，栅极导体层; 以及形成在外延半导体层上并围绕栅极的侧壁间隔物。制造上述半导体结构的方法包括利用牺牲栅极在外延半导体层中形成凸起的源/漏区。半导体结构及其制造方法可以简化超薄SOI晶体管的制造工艺，并降低晶体管的导通电阻和功耗。

84. 发明申请

US20110266677A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译：其半导体结构及其制造方法
公开(公告)号：US20110266677A1
公开(公告)日：2011-11-03
申请号：US12990990
申请日：2010-09-19
申请人： Huilong Zhu , Haizhou Yin , Zhijong Luo
发明人： Huilong Zhu , Haizhou Yin , Zhijong Luo
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L23/522 , H01L21/32051 , H01L21/76823 , H01L21/76838 , H01L21/76873 , H01L21/76886 , H01L23/53238 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a semiconductor structure and a manufacturing method thereof. The method comprises; providing a semiconductor substrate comprising semiconductor devices; depositing a copper diffusion barrier layer on the semiconductor substrate; forming a copper composite layer on the copper diffusion barrier layer; decomposing the copper composite at corresponding positions, where copper interconnection is to be formed, into copper according to the shape of the copper interconnection; and etching off the undecomposed copper composite and the copper diffusion barrier layer underneath, to interconnect the semiconductor devices. The present invention is adaptive for manufacturing interconnection in integrated circuits.
摘要翻译：本发明提供一种半导体结构及其制造方法。该方法包括：提供包括半导体器件的半导体衬底; 在所述半导体衬底上沉积铜扩散阻挡层; 在铜扩散阻挡层上形成铜复合层; 根据铜互连的形状，将要形成铜互连的相应位置处的铜复合物分解成铜; 并且在下面蚀刻未分解的铜复合物和铜扩散阻挡层，以使半导体器件互连。本发明适用于制造集成电路中的互连。

85. 发明申请

US20110260258A1 FIELD EFFECT TRANSISTOR DEVICE WITH IMPROVED CARRIER MOBILITY AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：具有改进的载波移动性的场效应晶体管装置及其制造方法
公开(公告)号：US20110260258A1
公开(公告)日：2011-10-27
申请号：US13063731
申请日：2010-06-22
申请人： Huilong Zhu , Zhijiong Luo , Haizhou Yin
发明人： Huilong Zhu , Zhijiong Luo , Haizhou Yin
IPC分类号： H01L27/092 , H01L21/8238 , H01L21/336 , H01L29/78
CPC分类号： H01L21/823807 , H01L21/823842 , H01L21/823857 , H01L29/7845
摘要： The devices are manufactured by replacement gate process and replacement sidewall spacer process, and both tensile stress in the channel region of NMOS device and compressive stress in the channel region of PMOS device are increased by forming a first stress layer with compressive stress in the space within the first metal gate layer of NMOS and a second stress layer with tensile stress in the space within the second metal gate layer of PMOS, respectively. After formation of the stress layers, sidewall spacers of the gate stacks of PMOS and NMOS devices are removed so as to release stress in the channel regions. In particular, stress structure with opposite stress may be formed on sidewalls of the gate stacks of the NMOS device and PMOS device and on a portion of the source region and the drain region, in order to further increase both tensile stress of the NMOS device and compressive stress of the PMOS device.
摘要翻译：器件通过更换栅极工艺和替换侧壁间隔工艺制造，NMOS器件的沟道区域中的拉伸应力和PMOS器件的沟道区域中的压应力均增加，在第一应力层内形成压缩应力 NMOS的第一金属栅极层和在PMOS的第二金属栅极层内的空间中具有拉伸应力的第二应力层。在形成应力层之后，去除PMOS和NMOS器件的栅叠层的侧壁间隔物，以释放沟道区中的应力。特别地，具有相反应力的应力结构可以形成在NMOS器件和PMOS器件的栅极堆叠的侧壁上，并且在源极区域和漏极区域的一部分上形成，以便进一步增加NMOS器件的拉伸应力和 PMOS器件的压应力。

86. 发明申请

US20110169088A1 STRUCTURE AND METHOD HAVING ASYMMETRICAL JUNCTION OR REVERSE HALO PROFILE FOR SEMICONDUCTOR ON INSULATOR (SOI) METAL OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR (MOSFET) 失效
标题翻译：具有绝缘体（SOI）金属氧化物半导体场效应晶体管（MOSFET）的半导体的非对称结或反向HALO分布的结构和方法
公开(公告)号：US20110169088A1
公开(公告)日：2011-07-14
申请号：US12686402
申请日：2010-01-13
申请人： Huilong Zhu , Zhijiong Luo , Qingqing Liang , Haizhou Yin
发明人： Huilong Zhu , Zhijiong Luo , Qingqing Liang , Haizhou Yin
IPC分类号： H01L27/12 , H01L21/762
CPC分类号： H01L27/1207 , H01L21/76251 , H01L21/8221 , H01L27/0688 , H01L29/66545
摘要： A device and method is provided that in one embodiment provides a first semiconductor device including a first gate structure on a first channel region, in which a first source region and a first drain region are present on opposing sides of the first channel region, in which a metal nitride spacer is present on only one side of the first channel region. The device further includes a second semiconductor device including a second gate structure on a second channel region, in which a second source region and a second drain region are present on opposing sides of the second channel region. Interconnects may be present providing electrical communication between the first semiconductor device and the second semiconductor device, in which at least one of the first semiconductor device and the second semiconductor device is inverted. A structure having a reverse halo dopant profile is also provided.
摘要翻译：提供了一种装置和方法，在一个实施例中提供了第一半导体器件，其包括在第一沟道区上的第一栅极结构，其中第一源区和第一漏区存在于第一沟道区的相对侧上，其中金属氮化物间隔物仅存在于第一沟道区的一侧。该器件还包括在第二沟道区上包括第二栅极结构的第二半导体器件，其中第二源区和第二漏区存在于第二沟道区的相对侧上。可以存在互连件，其提供第一半导体器件和第二半导体器件之间的电连通，其中第一半导体器件和第二半导体器件中的至少一个被反转。还提供了具有反向卤素掺杂剂分布的结构。

87. 发明授权

US07977712B2 Asymmetric source and drain field effect structure 有权
标题翻译：不对称源极和漏极场效应结构
公开(公告)号：US07977712B2
公开(公告)日：2011-07-12
申请号：US12059059
申请日：2008-03-31
申请人： Huilong Zhu , Hong Lin , Katherine L. Saenger , Kai Xiu , Haizhou Yin
发明人： Huilong Zhu , Hong Lin , Katherine L. Saenger , Kai Xiu , Haizhou Yin
IPC分类号： H01L29/04
CPC分类号： H01L21/823807 , H01L21/28132 , H01L21/823814 , H01L21/823864 , H01L29/045 , H01L29/6659 , H01L29/66659 , H01L29/7835
摘要： A semiconductor structure, such as a CMOS semiconductor structure, includes a field effect device that includes a plurality of source and drain regions that are asymmetric. Such a source region and drain region asymmetry is induced by fabricating the semiconductor structure using a semiconductor substrate that includes a horizontal plateau region contiguous with and adjoining a sloped incline region. Within the context of a CMOS semiconductor structure, such a semiconductor substrate allows for fabrication of a pFET and an nFET upon different crystallographic orientation semiconductor regions, while one of the pFET and the nFET (i.e., typically the pFET) has asymmetric source and drain regions.
摘要翻译：诸如CMOS半导体结构的半导体结构包括具有不对称的多个源区和漏区的场效应器件。通过使用包括与倾斜斜面区域相邻并相邻的水平平台区域的半导体衬底制造半导体结构来诱导这种源区和漏区不对称。在CMOS半导体结构的上下文中，这种半导体衬底允许在不同的晶体取向半导体区域上制造pFET和nFET，而pFET和nFET（即，通常为pFET）中的一个具有不对称的源极和漏极区域。

88. 发明授权

US07977178B2 Asymmetric source/drain junctions for low power silicon on insulator devices 有权
标题翻译：低功率硅绝缘体器件的不对称源极/漏极结
公开(公告)号：US07977178B2
公开(公告)日：2011-07-12
申请号：US12395904
申请日：2009-03-02
申请人： Seong-Dong Kim , Zhijiong Lou , Huilong Zhu
发明人： Seong-Dong Kim , Zhijiong Lou , Huilong Zhu
IPC分类号： H01L21/336 , H01L21/8234
CPC分类号： H01L29/0847 , H01L21/26586 , H01L29/165 , H01L29/66659 , H01L29/78 , H01L29/7848
摘要： A semiconductor device includes a buried insulator layer formed on a bulk substrate; a first type semiconductor material formed on the buried insulator layer, and corresponding to a body region of a field effect transistor (FET); a second type of semiconductor material formed over the buried insulator layer, adjacent opposing sides of the body region, and corresponding to source and drain regions of the FET; the second type of semiconductor material having a different bandgap than the first type of semiconductor material; wherein a source side p/n junction of the FET is located substantially within whichever of the first and the second type of semiconductor material having a lower bandgap, and a drain side p/n junction of the FET is located substantially entirely within whichever of the first and the second type of semiconductor material having a higher bandgap.
摘要翻译：半导体器件包括形成在本体衬底上的掩埋绝缘体层; 形成在所述掩埋绝缘体层上并对应于场效应晶体管（FET）的体区的第一类型半导体材料; 形成在所述掩埋绝缘体层上，邻近所述本体区域的相对侧并且对应于所述FET的源极和漏极区域的第二类型的半导体材料; 所述第二类型的半导体材料具有与所述第一类型的半导体材料不同的带隙; 其中FET的源极p / n结基本上位于具有较低带隙的第一和第二类型的半导体材料中的任何一个中，并且FET的漏极侧p / n结基本上完全位于第一和第二类型的具有较高带隙的半导体材料。

89. 发明申请

US20110163359A1 LITHOGRAPHY FOR PRINTING CONSTANT LINE WIDTH FEATURES 有权
标题翻译：用于打印恒定线宽度特征的算法
公开(公告)号：US20110163359A1
公开(公告)日：2011-07-07
申请号：US13047037
申请日：2011-03-14
申请人： Huilong Zhu
发明人： Huilong Zhu
IPC分类号： H01L29/78
CPC分类号： H01L21/3083 , H01L21/0337 , H01L21/28132 , H01L21/30608 , H01L21/3086 , H01L21/32139 , H01L21/823437
摘要： An anisotropic wet etch of a semiconductor layer generates facets joined by a ridge running along the center of a pattern in a dielectric hardmask layer on the semiconductor layer. The dielectric hardmask layer is removed and a conformal masking material layer is deposited. Angled ion implantation of Ge, B, Ga, In, As, P, Sb, or inert atoms is performed parallel to each of the two facets joined by the ridge causing damage to implanted portions of the masking material layer, which are removed selective to undamaged portions of the masking material layer along the ridge and having a constant width. The semiconductor layer and a dielectric oxide layer underneath are etched selective to the remaining portions of the dielectric nitride. Employing remaining portions of the dielectric oxide layer as an etch mask, the gate conductor layer is patterned to form gate conductor lines having a constant width.
摘要翻译：半导体层的各向异性湿蚀刻产生由沿着半导体层上的电介质硬掩模层中的图案的中心延伸的脊接合的刻面。去除介电硬掩模层并沉积保形掩模材料层。与由脊组合的两个小平面中的每一个平行地进行Ge，B，Ga，In，As，P，Sb或惰性原子的角度离子注入，从而对掩蔽材料层的注入部分造成损害，屏蔽材料层沿着脊的未损坏部分并且具有恒定的宽度。在其下面的半导体层和电介质氧化物层对电介质氮化物的其余部分进行蚀刻选择性。使用电介质氧化物层的剩余部分作为蚀刻掩模，对栅极导体层进行构图以形成具有恒定宽度的栅极导体线。

90. 发明授权

US07960264B2 Lithography for printing constant line width features 有权
标题翻译：用于打印恒定线宽特征的平版印刷
公开(公告)号：US07960264B2
公开(公告)日：2011-06-14
申请号：US12901148
申请日：2010-10-08
申请人： Huilong Zhu
发明人： Huilong Zhu
IPC分类号： H01L21/22 , H01L21/302
CPC分类号： H01L21/3083 , H01L21/0337 , H01L21/28132 , H01L21/30608 , H01L21/3086 , H01L21/32139 , H01L21/823437
摘要： An anisotropic wet etch of a semiconductor layer generates facets joined by a ridge running along the center of a pattern in a dielectric hardmask layer on the semiconductor layer. The dielectric hardmask layer is removed and a conformal masking material layer is deposited. Angled ion implantation of Ge, B, Ga, In, As, P, Sb, or inert atoms is performed parallel to each of the two facets joined by the ridge causing damage to implanted portions of the masking material layer, which are removed selective to undamaged portions of the masking material layer along the ridge and having a constant width. The semiconductor layer and a dielectric oxide layer underneath are etched selective to the remaining portions of the dielectric nitride. Employing remaining portions of the dielectric oxide layer as an etch mask, the gate conductor layer is patterned to form gate conductor lines having a constant width.
摘要翻译：半导体层的各向异性湿蚀刻产生由沿着半导体层上的电介质硬掩模层中的图案的中心延伸的脊接合的刻面。去除介电硬掩模层并沉积保形掩模材料层。通过平行于由脊连接的两个小平面中的Ge，B，Ga，In，As，P，Sb或惰性原子的角度离子注入，导致掩蔽材料层的注入部分的损坏，屏蔽材料层沿着脊的未损坏部分并且具有恒定的宽度。在其下面的半导体层和电介质氧化物层对电介质氮化物的其余部分进行蚀刻选择性。使用电介质氧化物层的剩余部分作为蚀刻掩模，对栅极导体层进行构图以形成具有恒定宽度的栅极导体线。

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