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    • 83. 发明授权
    • Liquid cooled system module
    • 液体冷却系统模块
    • US07236363B2
    • 2007-06-26
    • US10667714
    • 2003-09-22
    • Christian L. Belady
    • Christian L. Belady
    • H05K7/20
    • G06F1/20G06F2200/201H05K7/20763
    • Example sealed electronics modules are described. The sealed electronics module may include electronics components. The sealed electronics module may also include one or more connectors configured to provide one or more detachable liquid connections to a liquid transporting apparatus. The liquid transporting apparatus may provide liquid communication between the sealed electronics module and an external liquid cooling module. The sealed electronics module may also include an apparatus for the cooling electronics components in the electronics module using liquid that is transported between the sealed electronics module and the external liquid cooling module.
    • 描述了密封电子模块的示例。 密封电子模块可以包括电子部件。 密封电子模块还可以包括一个或多个连接器,其被配置为向液体输送装置提供一个或多个可拆卸的液体连接。 液体输送装置可以在密封电子模块和外部液体冷却模块之间提供液体连通。 密封电子模块还可以包括用于电子模块中的冷却电子部件的装置,其使用在密封电子模块和外部液体冷却模块之间传输的液体。
    • 85. 发明授权
    • Power module for multi-chip printed circuit boards
    • 多芯片印刷电路板电源模块
    • US06771507B1
    • 2004-08-03
    • US10355707
    • 2003-01-31
    • Christian L. BeladyShaun L. HarrisGary Wayne WilliamsBrent A. Boudreaux
    • Christian L. BeladyShaun L. HarrisGary Wayne WilliamsBrent A. Boudreaux
    • H05H720
    • H01L23/4338H01L23/4006H01L2924/0002H05K1/0204H01L2924/00
    • A power module assembly for multi-chip printed circuit boards: A heat distribution plate has first and second fields of receptacles integrally formed therein. The receptacles are populated with first and second fields of thermally-conductive pins. A power module printed circuit board is mounted to the heat distribution plate and has first and second clearance holes formed therein. The first and second fields of pins protrude through the first and second clearance holes. A multi-chip printed circuit board may be mounted underneath the power module such that the thermally-conductive pins contact a surface of first and second supplied chips. The supplied chips are physically close to the power module, and thermal management for the supplied chips is provided by virtue of contact between the supplied chips and the thermally-conductive pins. Space on the multi-chip printed circuit board is conserved.
    • 一种用于多芯片印刷电路板的功率模块组件:散热板具有一体地形成在其中的第一和第二接地部分。 插座上装有第一和第二导热销。 功率模块印刷电路板安装在配热板上,并在其中形成有第一和第二间隙孔。 销的第一和第二领域突出穿过第一和第二间隙孔。 多芯片印刷电路板可以安装在功率模块的下方,使得导热针接触第一和第二提供芯片的表面。 提供的芯片在物理上靠近电源模块,并且借助于所提供的芯片和导热引脚之间的接触来提供所提供的芯片的热管理。 多芯片印刷电路板上的空间是保守的。
    • 87. 发明申请
    • DATA PLANT - A RAW MATERIAL POWERED DATA GENERATOR
    • 数据设备 - 原材料供电数据发生器
    • US20130190936A1
    • 2013-07-25
    • US13357877
    • 2012-01-25
    • Christian L. BeladySean M. James
    • Christian L. BeladySean M. James
    • G05D3/12
    • H02J1/00G05B15/02H02J3/382H02J2003/001H02J2003/007Y02E60/76Y04S40/22
    • A “data plant” accepts power-generation-capable raw materials and outputs processed data. The processed data can be delivered to consumers more efficiently than other forms of power transfer, including power transfer through electricity, steam, physical motion, and the like. Consequently, data plants can be located where power-generation-capable raw materials can be obtained inexpensively, for free, or where power-generation-capable raw materials are waste products for which the operator of the data plants can be compensated for processing. Self-powered data plants need not even be continuously fed with power-generation-capable raw materials and, if such data plants receive and output data via wireless communications, the self-powered data plants can require no physical connection or attachment at all. For example, a single piece of silicon comprising a silicon solar cell that generates electrical power and silicon circuitry that consumes it to perform data processing can be a silicon self-powered data plant.
    • “数据工厂”接受发电的原材料并输出处理后的数据。 经处理的数据可以比其他形式的电力传输更有效地传递给消费者,包括通过电力,蒸汽,身体运动等的电力传输。 因此,数据工厂可以位于能够廉价,免费获得发电的原材料的地方,或者其中发电能力的原材料是可以补偿数据处理的操作者的废物的处理。 自供电的数据工厂甚至不需要连续供给具有发电能力的原材料,并且如果这样的数据工厂通过无线通信接收和输出数据,则自供电的数据工厂根本不需要物理连接或附件。 例如,包括产生电力的硅太阳能电池和消耗其进行数据处理的硅电路的单片硅可以是硅自供电的数据工厂。