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    • 81. 发明申请
    • Field effect transistor and method for manufacturing the same
    • 场效应晶体管及其制造方法
    • US20060157804A1
    • 2006-07-20
    • US11287482
    • 2005-11-28
    • Tetsuzo Ueda
    • Tetsuzo Ueda
    • H01L29/76
    • H01L29/8122H01L29/2003H01L29/66856
    • A first SiO2 thin film, a tungsten gate electrode, and a second SiO2 thin film are selectively formed on a first n+-type GaN contact semiconductor layer in that order and in a multilayer film structure having the three layers, a stripe-shaped opening is formed. Via the opening, an undoped GaN channel semiconductor layer and the second n+-type GaN contact semiconductor layer are formed so that both the layers are regrown by, for example, metal organic chemical vapor deposition. A source electrode and a drain electrode are formed so as to contact the corresponding second and first n+-type GaN contact semiconductor layers. The regrown undoped GaN channel semiconductor layer and the regrown second n+-type GaN contact semiconductor layer are horizontally grown portions and hence, the contact area of the electrode can be made larger than the area of the opening.
    • 第一个SiO 2薄膜,钨栅电极和第二SiO 2薄膜选择性地形成在第一n + + / GaN接触半导体层,并且在具有三层的多层膜结构中形成条形开口。 通过开口,形成未掺杂的GaN沟道半导体层和第二n + + + GaN接触半导体层,使得这两个层通过例如金属有机化学气相沉积而再生长。 源电极和漏电极形成为与相应的第二和第n + +型GaN接触半导体层接触。 再生未掺杂的GaN沟道半导体层和再生长的第二n + + + GaN接触半导体层是水平生长的部分,因此可以使电极的接触面积大于开口的面积。
    • 88. 发明授权
    • Organic acid scrubber and methods
    • 有机酸洗涤器和方法
    • US06190629B1
    • 2001-02-20
    • US09293443
    • 1999-04-16
    • Glenn S. SolomonDavid J. MillerTetsuzo Ueda
    • Glenn S. SolomonDavid J. MillerTetsuzo Ueda
    • C01C112
    • B01D53/18B01D53/14B01D53/1493B01D2251/70C23C16/4412Y02C20/30
    • A scrubber assembly for removal of water soluble and/or alkaline gases from an exhaust stream uses a scrubber mixture contained within at least one scrubber vessel. Preferably the scrubber mixture include a liquid phase including an aqueous acid solution, and solid phase including a solid organic acid. Preferably, the scrubber mixture includes a solid carboxylic acid having low toxicity and low corrosiveness to system components. In one embodiment, a plurality of scrubber vessels, each containing the scrubber mixture are connected in series. The scrubber assembly may further include an indicator tank containing an indicator mixture. The pH of the scrubber mixture and/or indicator mixture may be monitored, thereby making operation of the system not only simpler and more reliable, but also more efficient. A method for removal of water soluble and/or alkaline gases from an exhaust stream is also disclosed.
    • 用于从排气流中除去水溶性和/或碱性气体的洗涤器组件使用包含在至少一个洗涤器容器内的洗涤器混合物。 优选地,洗涤器混合物包括含有酸水溶液的液相和包含固体有机酸的固相。 优选地,洗涤器混合物包括对系统组分具有低毒性和低腐蚀性的固体羧酸。 在一个实施例中,每个含有洗涤器混合物的洗涤器容器串联连接。 洗涤器组件还可以包括含有指示剂混合物的指示器罐。 可以监测洗涤器混合物和/或指示剂混合物的pH,从而使系统的操作不仅更简单和更可靠,而且更有效。 还公开了一种从废气流中除去水溶性和/或碱性气体的方法。
    • 90. 发明授权
    • Semiconductor device including separated gate electrode and conductive layer
    • 半导体器件包括分离的栅电极和导电层
    • US08692292B2
    • 2014-04-08
    • US13356156
    • 2012-01-23
    • Hidekazu UmedaTetsuzo Ueda
    • Hidekazu UmedaTetsuzo Ueda
    • H01L29/66
    • H01L29/7786H01L29/1029H01L29/1066H01L29/2003H01L29/402H01L29/66462
    • A semiconductor device includes: a substrate 101, a first nitride semiconductor layer 104S which includes a plurality of nitride semiconductor layers formed on the substrate 101, and has a channel region; a second semiconductor layer 105 which is formed on the first nitride semiconductor layer 104S, and has a conductivity type opposite a conductivity type of the channel region; a conductive layer which is in contact with the second semiconductor layer 105, and includes a metal layer 107 or a high carrier concentration semiconductor layer having a carrier concentration of 1×1018 cm−3 or higher; an insulating layer 110 formed on the conductive layer; a gate electrode 111 formed on the insulating layer 110; and a source electrode 108 and a drain electrode 109 formed to laterally sandwich the second semiconductor layer 105.
    • 半导体器件包括:衬底101,包括形成在衬底101上的多个氮化物半导体层的第一氮化物半导体层104S,并具有沟道区; 第二半导体层105,其形成在第一氮化物半导体层104S上,并且具有与沟道区的导电类型相反的导电类型; 与第二半导体层105接触的导体层,具有载流子浓度为1×1018 cm -3以上的金属层107或高载流子浓度半导体层; 形成在导电层上的绝缘层110; 形成在绝缘层110上的栅电极111; 以及形成为横向夹持第二半导体层105的源电极108和漏电极109。