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81. 发明授权

US07611040B2 Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition 有权
标题翻译：用于形成焊料凸块的方法和使用焊料粉末树脂组合物安装半导体器件的方法
公开(公告)号：US07611040B2
公开(公告)日：2009-11-03
申请号：US11579505
申请日：2006-04-25
申请人： Takashi Kitae , Seiichi Nakatani , Toshiyuki Kojima , Shingo Komatsu , Yoshihisa Yamashita
发明人： Takashi Kitae , Seiichi Nakatani , Toshiyuki Kojima , Shingo Komatsu , Yoshihisa Yamashita
IPC分类号： B23K31/02 , H01L21/44
CPC分类号： H05K3/3484 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/0558 , H01L2224/05639 , H01L2224/05644 , H01L2224/11003 , H01L2224/1152 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81141 , H01L2224/81193 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/15787 , H01L2924/15788 , H05K3/323 , H05K3/3436 , H05K2201/09745 , H05K2201/10977 , H05K2203/0108 , H05K2203/0113 , H05K2203/043 , H05K2203/0465 , H05K2203/167 , Y02P70/613 , H01L2924/00 , H01L2224/29099
摘要： A method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device is provided. A flat plate having a plurality of projections or recesses thereon is prepared; the flat plate is aligned to oppose an electronic component and a resin composition including a solder powder is supplied to a gap between the flat plate and the electronic component; the resin composition is annealed to melt the solder powder included in the resin composition for growing the solder powder up to the level of the surface of the flat plate by allowing the melted solder powder to self-assemble on terminals, so as to form solder bumps on the terminals; and the flat plate is removed after cooling and solidifying the solder bumps. Thus, the solder bumps having pits corresponding to the projections or having protrusions corresponding to the recesses are formed.
摘要翻译：提供一种用于形成用于实现高密度安装的焊料凸块的方法和用于安装半导体器件的高可靠性方法。制备其上具有多个突起或凹部的平板; 将平板对准电子部件，将包含焊料粉末的树脂组合物供给到平板和电子部件之间的间隙; 对树脂组合物进行退火，通过使熔融的焊料粉末在端子上自组装，将包含在树脂组合物中的焊料粉末熔化成使焊料粉末生长直至平板表面的水平，从而形成焊料凸块在终端上并且在冷却并固化焊料凸块之后去除平板。因此，形成具有对应于突起或具有与凹部对应的突起的凹坑的焊料凸块。

82. 发明授权

US08039307B2 Mounted body and method for manufacturing the same 有权
标题翻译：安装体及其制造方法
公开(公告)号：US08039307B2
公开(公告)日：2011-10-18
申请号：US12728615
申请日：2010-03-22
申请人： Toshiyuki Kojima , Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Shingo Komatsu
发明人： Toshiyuki Kojima , Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Shingo Komatsu
IPC分类号： H01L23/498
CPC分类号： H01L24/81 , H01L21/6835 , H01L23/4952 , H01L23/49524 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/24 , H01L24/25 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16058 , H01L2224/16059 , H01L2224/16105 , H01L2224/16106 , H01L2224/16238 , H01L2224/17051 , H01L2224/171 , H01L2224/24011 , H01L2224/24225 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/73204 , H01L2224/82001 , H01L2224/83385 , H01L2224/83886 , H01L2224/83888 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/19043 , H01L2924/3025 , H01L2224/16225 , H01L2924/00 , H01L2924/20752 , H01L2924/00015 , H01L2224/81805 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A mounted body (100) of the present invention includes: a semiconductor element (10) having a surface (10a) on which element electrodes (12) are formed and a rear surface (10b) opposing the surface (10a); and a mounting board (30) on which wiring patterns (35) each having an electrode terminal (32) are formed. The rear surface (10b) of the semiconductor element (10) is in contact with the mounting board (30), and the element electrodes (12) of the semiconductor element (10) are connected electrically to the electrode terminals (32) of the wiring pattern (35) formed on the mounting board (30) via solder connectors (20) formed of solder particles assembled into a bridge shape. With this configuration, fine pitch connection between the element electrodes of the semiconductor element and the electrode terminals of the mounting board becomes possible.
摘要翻译：本发明的安装体（100）包括：具有形成元件电极（12）的表面（10a）和与表面（10a）相对的后表面（10b）的半导体元件（10）。以及安装板（30），在其上形成有各自具有电极端子（32）的布线图案（35）。半导体元件（10）的后表面（10b）与安装板（30）接触，并且半导体元件（10）的元件电极（12）与电极端子（32）电连接通过由组装成桥形的焊料颗粒形成的焊料连接器（20）在安装板（30）上形成的布线图案（35）。利用这种结构，半导体元件的元件电极和安装板的电极端子之间的细间距连接成为可能。

83. 发明申请

US20080197173A1 Method for Forming Solder Bump and Method for Mounting Semiconductor Device 有权
标题翻译：形成焊料凸块的方法和安装半导体器件的方法
公开(公告)号：US20080197173A1
公开(公告)日：2008-08-21
申请号：US11579505
申请日：2006-04-25
申请人： Takashi Kitae , Seiichi Nakatani , Toshiyuki Kojima , Shingo Komatsu , Yoshihisa Yamashita
发明人： Takashi Kitae , Seiichi Nakatani , Toshiyuki Kojima , Shingo Komatsu , Yoshihisa Yamashita
IPC分类号： B23K31/02 , B23K1/20
CPC分类号： H05K3/3484 , H01L21/4853 , H01L21/563 , H01L21/6835 , H01L23/49816 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/0558 , H01L2224/05639 , H01L2224/05644 , H01L2224/11003 , H01L2224/1152 , H01L2224/13099 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81141 , H01L2224/81193 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/15787 , H01L2924/15788 , H05K3/323 , H05K3/3436 , H05K2201/09745 , H05K2201/10977 , H05K2203/0108 , H05K2203/0113 , H05K2203/043 , H05K2203/0465 , H05K2203/167 , Y02P70/613 , H01L2924/00 , H01L2224/29099
摘要： [Problem] To provide a method for forming solder bumps for realizing high density mounting and a highly reliable method for mounting a semiconductor device.[Means for Solving Problem] A flat plate 10 or 30 having a plurality of projections 12 or recesses 32 thereon is prepared; the flat plate is aligned to oppose an electronic component 14 or 34 and a resin composition 18 or 19 including a solder powder 22 or 23 is supplied to a gap between the flat plate and the electronic component; the resin composition is annealed to melt the solder powder included in the resin composition for growing the solder powder up to the level of the surface of the flat plate by allowing the melted solder powder to self-assemble on terminals 16 or 36, so as to form solder bumps 24 or 38 on the terminals; and the flat plate is removed after cooling and solidifying the solder bumps. Thus, the solder bumps 24 or 38 having pits 24a corresponding to the projections 12 or having projections 38a corresponding to the recesses 32 are formed.
摘要翻译： [问题]提供一种形成用于实现高密度安装的焊料凸块的方法和用于安装半导体器件的高可靠性方法。 [解决问题的手段]准备在其上具有多个突起12或凹部32的平板10或30; 平板对准电子部件14或34，并且包括焊料粉末22或23的树脂组合物18或19被供应到平板和电子部件之间的间隙; 对树脂组合物进行退火，通过使熔融的焊料粉末在端子16或36上自组装，将包含在用于生长焊料粉末的树脂组合物中的焊料粉末熔化至平板表面的高度，从而在端子上形成焊料凸块24或38; 并且在冷却并固化焊料凸块之后去除平板。因此，形成具有对应于突起12的凹坑24a或具有对应于凹部32的突起38a的焊料凸块24或38。

84. 发明授权

US07713787B2 Mounted body and method for manufacturing the same 有权
标题翻译：安装体及其制造方法
公开(公告)号：US07713787B2
公开(公告)日：2010-05-11
申请号：US11911144
申请日：2006-02-21
申请人： Toshiyuki Kojima , Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Shingo Komatsu
发明人： Toshiyuki Kojima , Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Shingo Komatsu
IPC分类号： H01L23/44
CPC分类号： H01L24/81 , H01L21/6835 , H01L23/4952 , H01L23/49524 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/24 , H01L24/25 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16058 , H01L2224/16059 , H01L2224/16105 , H01L2224/16106 , H01L2224/16238 , H01L2224/17051 , H01L2224/171 , H01L2224/24011 , H01L2224/24225 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/73204 , H01L2224/82001 , H01L2224/83385 , H01L2224/83886 , H01L2224/83888 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/19043 , H01L2924/3025 , H01L2224/16225 , H01L2924/00 , H01L2924/20752 , H01L2924/00015 , H01L2224/81805 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A mounted body (100) of the present invention includes: a semiconductor element (10) having a surface (10a) on which element electrodes (12) are formed and a rear surface (10b) opposing the surface (10a); and a mounting board (30) on which wiring patterns (35) each having an electrode terminal (32) are formed. The rear surface (10b) of the semiconductor element (10) is in contact with the mounting board (30), and the element electrodes (12) of the semiconductor element (10) are connected electrically to the electrode terminals (32) of the wiring pattern (35) formed on the mounting board (30) via solder connectors (20) formed of solder particles assembled into a bridge shape. With this configuration, fine pitch connection between the element electrodes of the semiconductor element and the electrode terminals of the mounting board becomes possible.
摘要翻译：本发明的安装体（100）包括：具有形成元件电极（12）的表面（10a）和与表面（10a）相对的后表面（10b）的半导体元件（10）。以及安装板（30），在其上形成有各自具有电极端子（32）的布线图案（35）。半导体元件（10）的后表面（10b）与安装板（30）接触，并且半导体元件（10）的元件电极（12）与电极端子（32）电连接通过由组装成桥形的焊料颗粒形成的焊料连接器（20）在安装板（30）上形成的布线图案（35）。利用这种结构，半导体元件的元件电极和安装板的电极端子之间的细间距连接成为可能。

85. 发明申请

US20080251894A1 Mounted Body and Method for Manufacturing the Same 有权
标题翻译：安装体及其制造方法
公开(公告)号：US20080251894A1
公开(公告)日：2008-10-16
申请号：US11911144
申请日：2006-02-21
申请人： Toshiyuki Kojima , Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Shingo Komatsu
发明人： Toshiyuki Kojima , Seiichi Nakatani , Yoshihisa Yamashita , Takashi Kitae , Shingo Komatsu
IPC分类号： H01L23/544 , H01L21/58
CPC分类号： H01L24/81 , H01L21/6835 , H01L23/4952 , H01L23/49524 , H01L23/5389 , H01L24/16 , H01L24/17 , H01L24/24 , H01L24/25 , H01L24/45 , H01L24/48 , H01L24/82 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16058 , H01L2224/16059 , H01L2224/16105 , H01L2224/16106 , H01L2224/16238 , H01L2224/17051 , H01L2224/171 , H01L2224/24011 , H01L2224/24225 , H01L2224/24226 , H01L2224/24227 , H01L2224/32225 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/73204 , H01L2224/82001 , H01L2224/83385 , H01L2224/83886 , H01L2224/83888 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15788 , H01L2924/181 , H01L2924/19043 , H01L2924/3025 , H01L2224/16225 , H01L2924/00 , H01L2924/20752 , H01L2924/00015 , H01L2224/81805 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A mounted body (100) of the present invention includes: a semiconductor element (10) having a surface (10a) on which element electrodes (12) are formed and a rear surface (10b) opposing the surface (10a); and a mounting board (30) on which wiring patterns (35) each having an electrode terminal (32) are formed. The rear surface (10b) of the semiconductor element (10) is in contact with the mounting board (30), and the element electrodes (12) of the semiconductor element (10) are connected electrically to the electrode terminals (32) of the wiring pattern (35) formed on the mounting board (30) via solder connectors (20) formed of solder particles assembled into a bridge shape. With this configuration, fine pitch connection between the element electrodes of the semiconductor element and the electrode terminals of the mounting board becomes possible.
摘要翻译：本发明的安装体（100）包括：具有形成元件电极（12）的表面（10a）和与表面（10a）相对的后表面（10b）的半导体元件（10）。以及安装板（30），在其上形成有各自具有电极端子（32）的布线图案（35）。半导体元件（10）的后表面（10b）与安装板（30）接触，并且半导体元件（10）的元件电极（12）与电极端子（32）电连接通过由组装成桥形的焊料颗粒形成的焊料连接器（20）形成在安装板（30）上的布线图案（35）。利用这种结构，半导体元件的元件电极和安装板的电极端子之间的细间距连接成为可能。

86. 发明授权

US08435842B2 Method for manufacturing flexible semiconductor device 有权
标题翻译：柔性半导体器件的制造方法
公开(公告)号：US08435842B2
公开(公告)日：2013-05-07
申请号：US12681399
申请日：2009-07-30
申请人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa
发明人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa
IPC分类号： H01L21/00
CPC分类号： H01L51/0541 , H01L51/0004 , H01L51/0022 , H01L51/0097 , H01L51/107 , Y02E10/549 , Y02P70/521
摘要： A method for manufacturing a flexible semiconductor device comprises (i) forming an insulating film on the upper surface of a resin film, (ii) forming a pattern of extraction electrodes on the upper surface of the resin film, (iii) forming a semiconductor layer on the insulating film in such a manner that the semiconductor layer is in contact with the pattern of extraction electrodes, and (iv) forming a sealing resin layer on the upper surface of the resin film in such a manner that the sealing resin layer covers the semiconductor layer and the pattern of extraction electrodes, wherein at least one of the stepsof the above steps (i) to (iv) is carried out by a printing method. With this manufacturing method, various layers can be formed by a simple printing process without using a vacuum process, photolithography, or the like.
摘要翻译：一种制造柔性半导体器件的方法包括：（i）在树脂膜的上表面上形成绝缘膜，（ii）在树脂膜的上表面上形成提取电极的图案，（iii）形成半导体层以使得半导体层与提取电极的图案接触的方式在绝缘膜上，以及（iv）在树脂膜的上表面上形成密封树脂层，使得密封树脂层覆盖半导体层和提取电极的图案，其中通过印刷方法进行上述步骤（i）至（iv）中的步骤中的至少一个。利用该制造方法，可以通过简单的印刷工艺形成各种层，而不使用真空工艺，光刻等。

87. 发明授权

US08343822B2 Flexible semiconductor device and method for manufacturing same 有权
标题翻译：柔性半导体器件及其制造方法
公开(公告)号：US08343822B2
公开(公告)日：2013-01-01
申请号：US12681445
申请日：2009-07-30
申请人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa , Takashi Ichiryu , Takeshi Suzuki
发明人： Koichi Hirano , Seiichi Nakatani , Tatsuo Ogawa , Takashi Ichiryu , Takeshi Suzuki
IPC分类号： H01L21/84 , H01L21/00
CPC分类号： H01L29/78651 , H01L27/1218 , H01L27/124 , H01L27/1266 , H01L29/41733 , H01L29/42384 , H01L29/78603 , H01L29/7869
摘要： A method for manufacturing a flexible semiconductor device includes (i) forming an insulating film on the upper surface of metal foil, (ii) forming an extraction electrode pattern on the upper surface of the metal foil, (iii) forming a semiconductor layer on the insulating film such that the semiconductor layer is in contact with the extraction electrode pattern, (iv) forming a sealing resin layer on the upper surface of the metal foil such that the sealing resin layer covers the semiconductor layer and the extraction electrode pattern, and (v) forming electrodes by etching the metal foil, the metal foil being used as a support for the insulating film, the extraction electrode pattern, the semiconductor layer, and the sealing resin layer formed in (i) to (iv) and used as a constituent material for the electrodes in (v). The metal foil need not be stripped, and a high-temperature process can be used.
摘要翻译：一种制造柔性半导体器件的方法包括：（i）在金属箔的上表面上形成绝缘膜，（ii）在金属箔的上表面上形成引出电极图案，（iii）在金属箔的上表面上形成半导体层绝缘膜，使得半导体层与引出电极图案接触，（iv）在金属箔的上表面上形成密封树脂层，使得密封树脂层覆盖半导体层和引出电极图案，和（ v）通过蚀刻金属箔形成电极，金属箔用作绝缘膜的支撑体，引出电极图案，半导体层和形成在（i）至（iv）中的密封树脂层，并用作（v）中的电极的构成材料。金属箔不需要剥离，可以使用高温工艺。

88. 发明授权

US08143617B2 Semiconductor device, semiconductor device manufacturing method and image display device 有权
标题翻译：半导体器件，半导体器件制造方法和图像显示器件
公开(公告)号：US08143617B2
公开(公告)日：2012-03-27
申请号：US12667297
申请日：2008-07-01
申请人： Yoshihisa Yamashita , Seiichi Nakatani
发明人： Yoshihisa Yamashita , Seiichi Nakatani
IPC分类号： H01L29/41 , H01L29/786 , H01L29/06 , H01L51/30 , H01L51/50 , H01L51/52
CPC分类号： H01L51/057 , B82Y10/00 , H01L27/3274 , H01L51/0004
摘要： A semiconductor device having semiconductor elements disposed with higher density and a method for manufacturing the same are provided. An image display device employing the semiconductor device is also provided. A semiconductor device comprises a resin film having a through hole; and a semiconductor element comprising a gate electrode disposed on the inner wall of the through hole, an insulating layer that covers the gate electrode within the through hole, an organic semiconductor disposed on the insulating layer within the through hole, and a source electrode and a drain electrode which are electrically connected to the organic semiconductor.
摘要翻译：提供了具有以更高密度设置的半导体元件的半导体器件及其制造方法。还提供了采用半导体器件的图像显示装置。半导体器件包括具有通孔的树脂膜; 以及半导体元件，包括设置在通孔的内壁上的栅电极，覆盖通孔内的栅电极的绝缘层，设置在通孔内的绝缘层上的有机半导体，以及源电极和电极与有机半导体电连接。

89. 发明授权

US07981528B2 Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the same 有权
标题翻译：具有带状磁性颗粒的磁性片，RFID磁性片，磁屏蔽片及其制造方法
公开(公告)号：US07981528B2
公开(公告)日：2011-07-19
申请号：US11848407
申请日：2007-08-31
申请人： Seiichi Nakatani , Yoshihisa Yamashita , Takashi Ichiryu , Koichi Hirano
发明人： Seiichi Nakatani , Yoshihisa Yamashita , Takashi Ichiryu , Koichi Hirano
IPC分类号： B32B15/00
CPC分类号： G06K19/07749 , G06K19/07771 , Y10T428/24355 , Y10T428/32
摘要： A water-repelling layer is formed on a resin film, and a stripe pattern region is formed so as to be positioned within a surface region of the water-repelling layer and so as to be relatively hydrophilic with respect to water repellency of the water-repelling layer. A magnetic stripe pattern is formed of needle-shaped magnetic grains oriented and aggregated in the stripe pattern region. The needle-shaped magnetic grains are arranged in a desirable state in a predetermined stripe pattern, with a high magnetic permeability and a magnetic sheet with stripe-arranged magnetic grains that is thin and flexible is obtained.
摘要翻译：在树脂膜上形成防水层，并且形成条纹图案区域，以便位于防水层的表面区域内，并且相对于水溶性防水层的防水性而相对亲水，排斥层。磁条图案由在条纹图案区域中定向和聚集的针状磁性颗粒形成。针状磁性颗粒以预定的条纹图案被布置成期望的状态，具有高磁导率，并且获得薄且柔性的带状排列的磁性颗粒的磁性片。

90. 发明申请

US20110121298A1 MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE 有权
标题翻译：柔性半导体器件的制造方法
公开(公告)号：US20110121298A1
公开(公告)日：2011-05-26
申请号：US13054049
申请日：2010-02-05
申请人： Takashi Ichiryu , Seiichi Nakatani , Koichi Hirano
发明人： Takashi Ichiryu , Seiichi Nakatani , Koichi Hirano
IPC分类号： H01L29/786 , H01L21/336
CPC分类号： H01L29/78603 , H01L27/1218 , H01L27/1266 , H01L29/458 , H01L29/4908 , H01L29/78681 , H01L29/7869 , H01L2224/24195 , H01L2224/32245 , H01L2224/73267 , H01L2224/82 , H01L2224/92244 , H01L2924/3511 , H01L2924/3512
摘要： A method includes the steps of preparing a multilayer film 80 formed by sequentially stacking a first metal layer 10, an inorganic insulating layer 20, a semiconductor layer 30, and a second metal layer 40; forming a source electrode 42s and a drain electrode 42d comprised of the second metal layer 40 by etching the second metal layer 40; pressure-bonding a resin layer 50 onto a surface of the multilayer film 80 provided with the source electrode 42s and the drain electrode 42d to burry the source electrode 42s and the drain electrode 42d in the resin layer 50; and forming a gate electrode 10g comprised of the first metal layer 10 by etching the first metal layer 10. The inorganic insulating layer 20g functions as a gate insulating film. The semiconductor layer 30 functions as a channel.
摘要翻译：一种方法包括制备通过顺序堆叠第一金属层10，无机绝缘层20，半导体层30和第二金属层40而形成的多层膜80的步骤; 通过蚀刻第二金属层40形成由第二金属层40构成的源电极42s和漏电极42d; 将树脂层50压接到设置有源电极42s和漏电极42d的多层膜80的表面，以将树脂层50中的源电极42s和漏电极42d嵌入; 以及通过蚀刻第一金属层10形成由第一金属层10构成的栅极电极10g。无机绝缘层20g用作栅极绝缘膜。半导体层30用作沟道。

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