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    • 89. 发明申请
    • Laser annealing apparatus and semiconductor device manufacturing method
    • 激光退火装置及半导体装置的制造方法
    • US20050035095A1
    • 2005-02-17
    • US10944000
    • 2004-09-20
    • Shunpei YamazakiKoichiro TanakaMasaaki Hiroki
    • Shunpei YamazakiKoichiro TanakaMasaaki Hiroki
    • H01L21/268B23K26/08C21D1/34H01L21/20H01L21/314B23K26/00
    • H01L21/02691B23K26/0838C21D1/34H01L21/02686H01L21/2026
    • This invention is intended to provide a laser annealing method by employing a laser annealer lower in running cost so as to deal with a large-sized substrate, for preventing or decreasing the generation of a concentric pattern and to provide a semiconductor device manufacturing method including a step using the laser annealing method. While moving a substrate at a constant rate between 20 and 200 cm/s, a laser beam is radiated aslant to a semiconductor film on a surface of the semiconductor substrate. Therefore, it is possible to radiate a uniform laser beam to even a semiconductor film on a large-sized substrate and to thereby manufacture a semiconductor device for which the generation of a concentric pattern is prevented or decreased. By condensing a plurality of laser beams into one flux, it is possible to prevent or decrease the generation of a concentric pattern and to thereby improve the reliability of the semiconductor device.
    • 本发明旨在提供一种激光退火方法,其采用运行成本较低的激光退火机,以处理大尺寸基板,以防止或减少同心图案的产生,并提供一种半导体器件制造方法,包括 使用激光退火方法。 当以20-200cm / s之间的恒定速率移动衬底时,激光束被倾斜地辐射到半导体衬底的表面上的半导体膜。 因此,能够将均匀的激光束照射到大尺寸基板上的半导体膜上,从而制造防止或减少同心图案的产生的半导体器件。 通过将多个激光束聚光成一个通量,可以防止或减少同心图案的产生,从而提高半导体器件的可靠性。