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    • 81. 发明申请
    • METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    • 制造半导体器件的方法
    • US20090280583A1
    • 2009-11-12
    • US12399140
    • 2009-03-06
    • Shinichi HIRASAWAShinya Watanabe
    • Shinichi HIRASAWAShinya Watanabe
    • H01L21/3205H01L21/66
    • H01L21/28273H01L27/11521H01L29/7881
    • A method of fabricating a semiconductor device according to one embodiment includes: forming a plurality of Si-based pattern portions above a semiconductor substrate, the plurality of Si-based pattern portions being adjacent in a direction substantially parallel to a surface of the semiconductor substrate via insulating films; forming a metal film above the plurality of Si-based pattern portions and the insulating films so as to contact with the plurality of Si-based pattern portions; processing whole areas or upper portions of the plurality of Si-based pattern portions into a plurality of silicide layers by a silicidation reaction between the plurality of Si-based pattern portions and the metal film by heat treatment; and removing the plurality of silicide layers formed above the insulating films by applying planarizing treatment to the plurality of silicide layers.
    • 根据一个实施例的制造半导体器件的方法包括:在半导体衬底之上形成多个Si基图案部分,所述多个Si基图案部分在基本上平行于半导体衬底的表面的方向上相邻的方向 绝缘膜; 在所述多个Si基图案部分和所述绝缘膜之上形成金属膜以与所述多个Si基图案部分接触; 通过多个Si基图案部分和金属膜之间的硅化反应将多个Si基图案部分的整个区域或上部处理成多个硅化物层; 以及通过对所述多个硅化物层进行平坦化处理来去除在所述绝缘膜上形成的所述多个硅化物层。
    • 82. 发明申请
    • METHOD OF GRINDING WAFER
    • 研磨方法
    • US20090186562A1
    • 2009-07-23
    • US12349770
    • 2009-01-07
    • Keiichi KajiyamaTakatoshi MasudaShinya WatanabeSetsuo Yamamoto
    • Keiichi KajiyamaTakatoshi MasudaShinya WatanabeSetsuo Yamamoto
    • B24B1/00
    • B24B37/042B24B27/0076
    • A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning a grinding surface of a rough grinding wheel at a predetermined inclination angle relative to the holding surface of said chuck table, and rotating the rough grinding wheel; and a finish grinding step for performing finish grinding of the wafer by positioning a grinding surface of a finish grinding wheel in parallel to the holding surface of the chuck table, and rotating the finish grinding wheel in a grinding region of the grinding wheel in a direction toward the vertex of the contact angle between the grinding surface of the finish grinding wheel and the surface to be ground of the wafer.
    • 一种研磨晶片的方法,包括:晶片保持步骤,用于将晶片保持在具有保持表面的卡盘台的锥形保持表面上; 通过将粗磨轮的研磨面相对于所述夹盘的保持面定位成预定的倾斜角度,对保持在卡盘台的保持面上的晶片进行粗磨,粗磨加工, 轮; 以及精磨步骤,通过将精磨轮的研磨面与夹盘的保持面平行地定位,使精磨砂轮在砂轮的研磨区域中沿着方向 朝向精磨轮的磨削表面与待研磨的表面之间的接触角的顶点。
    • 84. 发明申请
    • Vehicular illumination system
    • 车载照明系统
    • US20080130302A1
    • 2008-06-05
    • US11987201
    • 2007-11-28
    • Shinya Watanabe
    • Shinya Watanabe
    • B60Q1/08
    • B60Q1/085B60Q1/143B60Q2300/056B60Q2300/122B60Q2300/42B60Q2300/45
    • A vehicular illumination system includes a vehicular illumination unit whose light distribution is changeable, a detection unit that detects an illumination target, and an acquisition unit that acquires load information representing a processing load when processing is performed to controls the light distribution of the vehicular illumination unit based on the relative displacement between the subject vehicle and the illumination target detected by the detection unit. Further, the vehicular illumination system includes a control unit that is capable of plural types of light distribution control, in each of which the processing load is different, and that controls the light distribution of the vehicular illumination unit by the light distribution control of a load corresponding to the processing load that is represented by the load information acquired by the acquisition unit.
    • 一种车辆用照明系统,其具有灯配光可变的车辆照明单元,检测照明目标的检测单元,以及获取单元,其在进行了处理时获取表示处理负荷的负载信息,以控制车辆照明单元的配光 基于由所述检测单元检测到的所述被摄体与所述照射目标之间的相对位移。 此外,车辆照明系统包括能够进行多种配光控制的控制单元,其中处理负荷不同,并且通过负载的光分布控制来控制车辆用照明单元的配光 对应于由采集单元获取的负荷信息表示的处理负荷。
    • 88. 发明授权
    • Method of producing image display device and image projector apparatus
    • 产生图像显示装置和图像投影仪的方法
    • US07128426B2
    • 2006-10-31
    • US11188516
    • 2005-07-19
    • Shinya Watanabe
    • Shinya Watanabe
    • G03B21/14G02F1/1335
    • G02B27/1046G02B26/06G02B27/145G02B27/149G02F1/133504G03B21/005H04N9/3105
    • A method of producing an image display device used for an LCD projector by providing a periodic structure of pixels arranged in a matrix and a substrate supporting the pixels, modulating light entering from an entrance surface in pixel units, and emitting the same from an exit surface. A phase shift structure for randomly changing the phase of the light is formed on a surface of the substrate. The phase shift structure has a relief structure formed, for example, by etching the surface of the substrate through which light passes to random depths. Therefore, occurrence of high-order diffracted light caused by the periodic structure of very fine pixels is prevented, and accordingly the amount of 0th order light inherently required is increased.
    • 一种制造用于LCD投影仪的图像显示装置的方法,该图像显示装置通过提供矩阵中排列的像素的周期性结构和支撑像素的基板,以像素为单位调制从入射面进入的光,并从出射表面 。 在衬底的表面上形成用于随机改变光的相位的相移结构。 相移结构具有浮雕结构,例如通过蚀刻光通过的随机深度的衬底的表面而形成。 因此,防止由非常精细的像素的周期性结构引起的高次衍射光的发生,因此增加了固有所需的0级光的量。