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    • 83. 发明申请
    • NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 非挥发性半导体存储器件及其制造方法
    • US20090230462A1
    • 2009-09-17
    • US12393509
    • 2009-02-26
    • Hiroyasu TanakaMasaru KidohRyota KatsumataMasaru KitoYoshiaki FukuzumiHideaki AochiYasuyuki Matsuoka
    • Hiroyasu TanakaMasaru KidohRyota KatsumataMasaru KitoYoshiaki FukuzumiHideaki AochiYasuyuki Matsuoka
    • H01L29/792H01L21/28
    • H01L27/11578H01L27/11582
    • Each of the memory strings includes: a first columnar semiconductor layer extending in a vertical direction to a substrate; a plurality of first conductive layers formed to sandwich an insulation layer with a charge trap layer and expand in a two-dimensional manner; a second columnar semiconductor layer formed in contact with the top surface of the first columnar semiconductor layer and extending in a vertical direction to the substrate; and a plurality of second conductive layers formed to sandwich an insulation layer with the second columnar semiconductor layer and formed in a stripe pattern extending in a first direction orthogonal to the vertical direction. Respective ends of the plurality of first conductive layers in the first direction are formed in a stepwise manner in relation to each other, entirety of the plurality of the second conductive layers are formed in an area immediately above the top layer of the first conductive layers, and the plurality of first conductive layers and the plurality of second conductive layers are covered with a protection insulation layer that is formed continuously with the plurality of first conductive layers and the second conductive layers.
    • 每个存储器串包括:在垂直方向上延伸到衬底的第一柱状半导体层; 多个第一导电层,其形成为夹着具有电荷陷阱层的绝缘层并以二维方式扩展; 第二柱状半导体层,其与所述第一柱状半导体层的顶表面接触并且在垂直方向上延伸到所述衬底; 以及多个第二导电层,其形成为与第二柱状半导体层夹着绝缘层,并且形成为沿与垂直方向正交的第一方向延伸的条纹图案。 多个第一导电层的第一方向的端部相对于彼此分步地形成,多个第二导电层的整体形成在第一导电层的顶层的正上方的区域中, 并且多个第一导电层和多个第二导电层被与多个第一导电层和第二导电层连续形成的保护绝缘层覆盖。
    • 86. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 半导体器件及其制造方法
    • US20090101969A1
    • 2009-04-23
    • US12248577
    • 2008-10-09
    • Ryota KATSUMATAMasaru KitoYoshiaki FukuzumiMasaru KidohHiroyasu TanakaHideaki AochiYasuyuki Matsuoka
    • Ryota KATSUMATAMasaru KitoYoshiaki FukuzumiMasaru KidohHiroyasu TanakaHideaki AochiYasuyuki Matsuoka
    • H01L29/78H01L21/336
    • H01L29/0847H01L29/0657H01L29/0692H01L29/4238H01L29/66666H01L29/7827H01L2924/0002H01L2924/00
    • A semiconductor device comprising: a semiconductor substrate; a first conductive layer provided on a surface of the substrate and serving as one of a source and a drain; a first insulating film provided on the first conductive layer; a gate electrode film provided on the first insulating film; a second insulating film provided on the gate electrode film; a gate opening provided so as to penetrate the second insulating film, the gate electrode film and the first insulating film to expose a part of the first conductive layer; a recess provided in the surface of the first conductive layer just below the gate opening; a gate insulator provided on the side surface of the gate opening and having a projecting shape at a portion between the first insulating film and the recess; a second conductive layer buried in the recess and in a bottom of the gate opening so as to be in contact with the gate insulator, and serving as the one of the source and the drain while being in contact with the first conductive layer; a channel which is buried in the gate opening above the second conductive layer so as to face the gate electrode film with the gate insulator therebetween, and which has a channel layer generated therein, the channel layer allowing majority carriers to flow between the source and the drain in response to a voltage applied to the gate; and a third conductive layer buried in the gate opening above the channel so as to be in contact with the gate insulator to serve as the other one of the source and the drain.
    • 一种半导体器件,包括:半导体衬底; 设置在所述基板的表面上并用作源极和漏极之一的第一导电层; 设置在所述第一导电层上的第一绝缘膜; 设置在所述第一绝缘膜上的栅电极膜; 设置在栅电极膜上的第二绝缘膜; 设置为穿透第二绝缘膜的栅极开口,栅极电极膜和第一绝缘膜,以暴露第一导电层的一部分; 设置在所述第一导电层的位于所述栅极开口正下方的表面中的凹部; 栅极绝缘体,其设置在所述栅极开口的侧表面上,并且在所述第一绝缘膜和所述凹部之间的部分处具有突出形状; 第二导电层,其被埋置在所述凹部中并且位于所述栅极开口的底部以与所述栅极绝缘体接触,并且在与所述第一导电层接触的同时用作所述源极和漏极中的一个; 埋入在第二导电层上方的栅极开口中以与门极绝缘体相对的栅极电极膜并且其中产生沟道层的沟道,该沟道层允许多数载流子在源极和源极之间流动 响应于施加到门的电压而漏极; 以及掩埋在沟道上方的栅极开口中的第三导电层,以便与栅极绝缘体接触以用作源极和漏极中的另一个。