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81. 发明申请

US20090002532A1 SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD THEREOF, AND CAMERA MODULE 审中-公开
标题翻译：固态成像装置及其制造方法及相机模块
公开(公告)号：US20090002532A1
公开(公告)日：2009-01-01
申请号：US12200444
申请日：2008-08-28
申请人： Kazuhiro Nishida , Hiroshi Maeda , Kiyohumi Yamamoto
发明人： Kazuhiro Nishida , Hiroshi Maeda , Kiyohumi Yamamoto
IPC分类号： H04N5/335 , H04N5/225
CPC分类号： G02B7/02 , G02B13/008 , H01L27/14618 , H01L31/02325 , H01L2224/48091 , H01L2224/48227 , H01L2924/16235 , H04N5/2253 , H04N5/2254 , H01L2924/00014
摘要： An optical filter layer composed of an infrared cut filter layer, an optical low pass filter layer and the like is formed on a glass substrate. The optical filter layer is made either by attaching or depositing. The glass substrate with the optical filter layer is attached to a semiconductor wafer, in which imaging sections are arranged in a matrix. The glass substrate and the semiconductor wafer are diced along each imaging section to separate individual solid state imaging device.
摘要翻译：在玻璃基板上形成由红外截止滤光层，光学低通滤光层等构成的滤光层。滤光层是通过附着或沉积制成的。具有滤光层的玻璃基板安装在半导体晶片上，其中成像部分被排列成矩阵。沿着每个成像部分切割玻璃基板和半导体晶片以分离单独的固态成像装置。

82. 发明申请

US20080049127A1 SOLID-STATE IMAGING DEVICE, CAMERA MODULE, AND CAMERA-MODULE MANUFACTURING METHOD 审中-公开
标题翻译：固态成像装置，摄像机模块和摄像机模块制造方法
公开(公告)号：US20080049127A1
公开(公告)日：2008-02-28
申请号：US11843821
申请日：2007-08-23
申请人： Hiroshi Maeda , Shigehisa Shimizu , Kazuhiro Nishida
发明人： Hiroshi Maeda , Shigehisa Shimizu , Kazuhiro Nishida
IPC分类号： H04N5/335
CPC分类号： H04N5/2257 , H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L31/02325 , H01L2924/0002 , H04N5/2253 , H01L2924/00
摘要： A cover glass covers only light-receiving elements formed on a semiconductor substrate of a solid-state imaging device. The other area of the substrate except the light-receiving elements is exposed. An FPC interposed between an optical unit and the solid-state imaging device is formed with an opening for exposing the cover glass and an assembly reference surface of the solid-state imaging device. When the solid-state imaging device is attached to the optical unit, the center of the light-receiving elements is determined as a reference position. The optical unit is directly attached to the assembly reference surface so as to make the reference position coincide with a photographic optical axis of the optical unit.
摘要翻译：盖玻璃仅覆盖形成在固态成像装置的半导体衬底上的光接收元件。除了光接收元件之外的基板的另一个区域被暴露。插入在光学单元和固态成像装置之间的FPC形成有用于暴露盖玻璃和固态成像装置的组件参考表面的开口。当固态成像装置附接到光学单元时，光接收元件的中心被确定为基准位置。光学单元直接附接到组件参考表面，以使参考位置与光学单元的摄影光轴重合。

83. 发明申请

US20070182843A1 Solid-state imaging device and electronic endoscope using the same 有权
标题翻译：固态成像装置和使用其的电子内窥镜
公开(公告)号：US20070182843A1
公开(公告)日：2007-08-09
申请号：US11702221
申请日：2007-02-05
申请人： Hitoshi Shimamura , Kazuaki Takahashi , Kazuhiro Nishida
发明人： Hitoshi Shimamura , Kazuaki Takahashi , Kazuhiro Nishida
IPC分类号： H04N5/225
CPC分类号： H01L27/14618 , A61B1/018 , A61B1/05 , A61B1/051 , G02B23/2484 , H01L31/0203 , H01L2224/05553 , H01L2224/45144 , H01L2224/48091 , H01L2224/49175 , H01L2924/16235 , H01L2924/3025 , H04N5/2252 , H04N5/2253 , H01L2924/00014 , H01L2924/00
摘要： A solid-state imaging device comprises: a solid-state imaging element comprising a solid-state imaging element body; a first substrate one end face of which is bonded to and integrated with one end face of a solid-state imaging element substrate of the solid-state imaging element, the first substrate comprising on its one surface an electrode for establishing electrical contact with a bonding wire led from a pad provided on one surface of the solid-state imaging element, a frame that seals the solid-state imaging element so as to surround outer peripheral surfaces of the solid-state imaging element substrate excluding its the one end face; and a sealing resin portion that covers a region extending from a portion including the electrode on the one surface of the first substrate to a portion including the pad on the one surface of the solid-state imaging element.
摘要翻译：固态成像装置包括：固态成像元件，包括固态成像元件本体; 第一基板，其一个端面与固态成像元件的固态成像元件基板的一个端面接合并与其一体化，第一基板在其一个表面上包括用于建立与接合的电接触的电极从设置在固态成像元件的一个表面上的焊盘引导的线，将固态成像元件密封以围绕除了其一个端面之外的固态成像元件基板的外周表面的框架; 以及密封树脂部分，其覆盖从在第一基板的一个表面上的包括电极的部分延伸到在固态成像元件的一个表面上的包括该焊盘的部分的区域。

84. 发明授权

US07156521B2 Projector for compensating chromatic aberration of magnification 有权
标题翻译：用于补偿倍率色差的投影仪
公开(公告)号：US07156521B2
公开(公告)日：2007-01-02
申请号：US10500571
申请日：2003-10-29
申请人： Fumie Kawai , Kazuhiro Nishida , Shuji Narimatsu
发明人： Fumie Kawai , Kazuhiro Nishida , Shuji Narimatsu
IPC分类号： G03B21/14 , G03B21/00 , G03B21/20
CPC分类号： H04N9/3105 , G02B27/0025 , G02B27/1046 , G02B27/149 , G02B27/288 , G03B21/005
摘要： A projector having a cross-dichroic prism (260) synthesizing three kinds of red, green, and blue light emitted from liquid crystal panels (250, 252, 254); and a projection lens (270) projecting the synthesized light and also having polarizing plates (251, 253, 255) disposed on the optical paths between the corresponding liquid crystal panels (250, 252, 254) and the cross-dichroic prism (260) includes a lens element (256), serving as an optical element for compensating chromatic aberration of magnification, which is formed on and integrally with one surface of the polarizing plate (251) disposed on the light path of the red light and which adjusts the size of the projected image screen of the red light extending along at least a predetermined direction so as to be nearly equal to those of the projected image screens of the other kinds of color light extending along the predetermined direction.
摘要翻译：一种具有合成从液晶面板（250,252,254）发射的三种红色，绿色和蓝色光的交叉二向色棱镜（260）的投影仪; 投影合成光的投影透镜（270），还具有设置在相应的液晶面板（250,252,254）和交叉二向色棱镜（260）之间的光路上的偏振片（251,253,255）包括用作补偿倍率倍数的光学元件的透镜元件（256），所述透镜元件形成在设置在红光的光路上的偏振片（251）的一个表面上并与其一体地形成，并且调整尺寸所述投影图像屏幕沿着至少预定方向延伸的所述红色光的投影图像屏幕几乎等于沿着所述预定方向延伸的所述另一种颜色光的投影图像屏幕。

85. 发明申请

US20060252174A1 Solid-state imaging device and method of manufacturing said solid-state imaging device 失效
公开(公告)号：US20060252174A1
公开(公告)日：2006-11-09
申请号：US11404897
申请日：2006-04-17
申请人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
发明人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
IPC分类号： H01L21/00
CPC分类号： H01L27/14636 , H01L27/14618 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L27/148 , H01L27/14806 , H01L2224/4847 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/3025
摘要： It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

86. 发明申请

US20060186499A1 Solid-state imaging device and method of manufacturing said solid-state imaging device 失效
公开(公告)号：US20060186499A1
公开(公告)日：2006-08-24
申请号：US11404898
申请日：2006-04-17
申请人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
发明人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
IPC分类号： H01L31/0232 , H01L31/0203
CPC分类号： H01L27/14636 , H01L27/14618 , H01L27/14625 , H01L27/14632 , H01L27/14687 , H01L27/148 , H01L27/14806 , H01L2224/4847 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/3025
摘要： It is an object to provide solid-state imaging device, which can easily be manufactured and has a high reliability, and a method of manufacturing the solid-state imaging device. In the present invention, a manufacturing method comprises the steps of forming a plurality of IT-CCDs on a surface of a semiconductor substrate, bonding a translucent member to the surface of the semiconductor substrate in order to have a gap opposite to each light receiving region of the IT-CCD, and isolating a bonded member obtained at the bonding step for each of the IT-CCDs.

87. 发明申请

US20060154075A1 Multilayered structure and method of manufacturing the same, and ultrasonic transducer 失效
标题翻译：多层结构及其制造方法及超声波换能器
公开(公告)号：US20060154075A1
公开(公告)日：2006-07-13
申请号：US11030069
申请日：2005-01-07
申请人： Toshiaki Kuniyasu , Hiroshi Maeda , Kazuhiro Nishida , Takayuki Fujiwara
发明人： Toshiaki Kuniyasu , Hiroshi Maeda , Kazuhiro Nishida , Takayuki Fujiwara
IPC分类号： B32B9/00
CPC分类号： H01L41/083 , B06B1/064 , G01N29/2437 , G01N29/28 , G01N2291/106 , H01L41/0474 , H01L41/27 , H01L41/314 , Y10T29/42 , Y10T29/49005 , Y10T428/268 , Y10T428/31504
摘要： A multilayered structure which includes insulating layers and electrode layers and can be easily arrayed. The multilayered structure is manufactured by using a substrate on which first and second groups of columnar structures are arranged in a predetermined arrangement, and includes: a first electrode layer formed by forming a film of a conducting material on the substrate or an insulating layer except for portions around the first group of columnar structures; an insulating layer formed by spraying powder of an insulating material on the first electrode layer to deposit the powder thereon; a second electrode layer formed by forming a film of a conducting material on the insulating layer except for portions around the second group of columnar structures; and interconnections formed by filing, with a conducting material, holes formed by removing the columnar structures from the substrate.
摘要翻译：包括绝缘层和电极层并且可以容易排列的多层结构。多层结构通过使用其上以预定布置布置第一和第二组柱状结构的基板来制造，并且包括：第一电极层，其通过在基板上形成导电材料的膜或除了围绕第一组柱状结构的部分; 绝缘层，其通过在第一电极层上喷涂绝缘材料的粉末而形成，以在其上沉积粉末; 第二电极层，其通过在第二组柱状结构周围的部分除了在绝缘层上形成导电材料的膜而形成; 以及通过用导电材料填充通过从基板除去柱状结构而形成的孔而形成的互连。

88. 发明申请

US20050236621A1 Solid-state imaging device and method of manufacturing the same 失效
公开(公告)号：US20050236621A1
公开(公告)日：2005-10-27
申请号：US11165133
申请日：2005-06-24
申请人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
发明人： Hiroshi Maeda , Kazuhiro Nishida , Yoshihisa Negishi , Shunichi Hosaka
IPC分类号： H01L27/14 , H01L23/04 , H01L23/12 , H01L27/146 , H01L29/04 , H01L29/20 , H01L31/02 , H01L31/0203 , H01L31/036 , H01L31/0376 , H01L31/20 , H04N5/225 , H04N5/335
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2924/0002 , H01L2924/00
摘要： There are provided a semiconductor substrate 101 on which solid-state imaging devices are formed, and a translucent member 201 provided onto a surface of the semiconductor substrate such that spaces are provided to oppose to light receiving areas of the solid-state imaging devices, wherein external connecting terminals are arranged on an opposing surface of the semiconductor substrate 101 to a solid-state imaging device forming surface, and the external connecting terminals are connected to the solid-state imaging devices via through-holes provided in the semiconductor substrate 101.

89. 发明申请

US20050190558A1 Method for manufacture of reflecting mirror, reflecting mirror, illumination device, and projector 审中-公开
标题翻译：反射镜，反射镜，照明装置和投影仪的制造方法
公开(公告)号：US20050190558A1
公开(公告)日：2005-09-01
申请号：US11067656
申请日：2005-02-28
申请人： Hirotaka Yanagisawa , Kazuhiro Nishida
发明人： Hirotaka Yanagisawa , Kazuhiro Nishida
IPC分类号： G02B5/08 , C03B23/049 , C03B23/07 , C03B33/06 , C03C17/00 , C03C17/09 , C03C17/36 , F21S2/00 , F21V7/00 , F21V7/09 , F21V7/22 , F21V13/00 , F21Y101/00 , G02B5/10 , G02B27/00 , G03B21/00 , G03B21/14 , G03B21/20 , H01J61/02
CPC分类号： H01J9/20 , C03B23/0493 , C03B23/07 , C03B33/06 , C03C17/001 , C03C17/09 , C03C17/36 , C03C17/3663 , F21V7/0025 , F21V7/10 , G02B5/0808 , G02B5/10 , G03B21/2026 , G03B21/2066 , H01J9/247 , H01J61/025 , H01J61/35 , H04N9/315
摘要： An auxiliary reflecting mirror is manufactured by heating the central portion of a quartz glass tube and compressing the central portion by pushing two end portions of the quartz glass tube so that the wall thickness of the central portion thickens, accommodating the quartz glass tube after thickening the wall thickness of the central portion in a mold having inner surfaces formed to the reflecting surface shape, which is to be formed in an auxiliary reflecting mirror, and forming an expanded portion by expanding the central portion, of which the wall thickness was thickened, by introducing a gas from the two ends of the quartz glass tube, cutting the quartz glass tube in at least the central portion of the expanded portion, evaporating a reflecting film on the outer surface of the expanded portion and forming a reflecting surface.
摘要翻译：通过加热石英玻璃管的中心部分并且通过推动石英玻璃管的两个端部来压缩中心部分来制造辅助反射镜，使得中心部分的壁厚增厚，在增厚石墨玻璃管之后容纳石英玻璃管在具有形成为反射面形状的内表面的模具中的中心部分的壁厚，其将形成在辅助反射镜中，并且通过使壁厚变厚的中心部分膨胀而形成扩张部分从石英玻璃管的两端引入气体，至少在膨胀部分的中心部分切割石英玻璃管，蒸发膨胀部分的外表面上的反射膜并形成反射表面。

90. 发明授权

US06886945B2 Projector 有权
标题翻译：投影机
公开(公告)号：US06886945B2
公开(公告)日：2005-05-03
申请号：US10795330
申请日：2004-03-09
申请人： Kazuhiro Nishida , Katsuyuki Uehara
发明人： Kazuhiro Nishida , Katsuyuki Uehara
IPC分类号： G02F1/13 , G02B3/00 , G02B5/00 , G02F1/13357 , G03B21/00 , G03B21/14
CPC分类号： G02B27/0961 , G02B3/0056 , G02B5/005 , G02B27/0927 , G03B21/005
摘要： A projector is provided to ensure the enhancement of contrasts while reducing the needs for alignment accuracy. The projector includes a light source, a first lens array, a second lens array, a superimposing lens, and a projection lens. The first lens array splits light emitted by the light source into a plurality of partial light beams with a plurality of small lenses that are arranged in a matrix. The second lens array includes a plurality of small lenses corresponding to the plurality of small lenses of the first lens array. The superimposing lens superimposes a plurality of partial light beams emitted by the first lens array and the second lens array on a liquid crystal panel. The projection lens projects light modulated by the liquid crystal panel. In the projector, a diaphragm having an opening that is shaped to be nearly similar to the outline of the second lens array is provided in the vicinity of an area conjugated with the second lens array.
摘要翻译：提供投影仪以确保增强对比度，同时减少对准精度的需要。投影仪包括光源，第一透镜阵列，第二透镜阵列，叠加透镜和投影透镜。第一透镜阵列将由光源发射的光分成多个部分光束，其中多个小透镜被布置成矩阵。第二透镜阵列包括与第一透镜阵列的多个小透镜相对应的多个小透镜。叠加透镜将由第一透镜阵列和第二透镜阵列发射的多个部分光束叠加在液晶面板上。投影透镜投射由液晶面板调制的光。在投影仪中，在与第二透镜阵列共轭的区域的附近设置有具有与第二透镜阵列的轮廓几乎相似的形状的开口的隔膜。

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