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81. 发明授权

US5073210A Method of making electrical conductors 失效
标题翻译：制造电导体的方法
公开(公告)号：US5073210A
公开(公告)日：1991-12-17
申请号：US527050
申请日：1990-05-22
申请人： Giles Humpston , David M. Jacobson
发明人： Giles Humpston , David M. Jacobson
IPC分类号： C22C5/02 , C22F1/14 , H01L21/48 , H01L23/48
CPC分类号： H01L21/4821 , C22C5/02 , C22F1/14 , H01L21/4885 , H01L23/48 , H01L2924/0002
摘要： A method of making material in the form of a fine wire or thin strip or sheet suitable for use as electrical conductors comprises: forming an ingot substantially consisting of an alloy of gold and one or more of the metals titanium, lutetium, zirconium, scandium and hafnium, the amount of the or each of said one or more of the metals in the alloy lying in the range from substantially 0.1 at % to an upper limit comprising the atomic percentage of that metal corresponding to the maximum solubility of that metal in the alloy; solution heat treating the ingot and then quenching the ingot from the solution heat treatment temperature; mechanically working the ingot to have a maximum dimension in at least one direction of not greater than 250 .mu.m; and heat treating the resulting material at a temperature below its solvus temperature from an ambient atmosphere containing oxygen and/or nitrogen in the ambient atmosphere. The conductors exhibit high tensile strength and resistance to elongation under load and retention of such properties after being heated to elevated temperatures for extended periods of time, such as to render them particularly suitable for use as bond-wires in integrated circuit packages.

82. 发明授权

US5031822A Methods of joining components 失效
标题翻译：连接组件的方法
公开(公告)号：US5031822A
公开(公告)日：1991-07-16
申请号：US472220
申请日：1990-01-30
申请人： Giles Humpston , David M. Jacobson , Brian P. Cameron
发明人： Giles Humpston , David M. Jacobson , Brian P. Cameron
IPC分类号： B23K35/00 , H01L21/60 , H01L23/492
CPC分类号： H01L24/83 , B23K35/005 , H01L23/4924 , H01L24/29 , H01L2224/29109 , H01L2224/29111 , H01L2224/8319 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01063 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/014
摘要： A method of brazing a silicon component to a molybdenum and/or tungsten component wherein prior to brazing the surface of the molybdenum and/or tungsten component is first provided with a thin gold coating and then a coating of palladium, platinum or rhodium. This allows satisfactory brazing to be effected using conventional aluminum-based brazes at temperatures below 650.degree. C.

83. 发明授权

US10147750B2 Optical imaging apparatus and methods of making the same 有权
公开(公告)号：US10147750B2
公开(公告)日：2018-12-04
申请号：US13145830
申请日：2010-02-03
申请人： Moshe Kriman , William Hudson Welch , Giles Humpston , Osher Avsian , Felix Hazanovich , Ekaterina Axelrod
发明人： Moshe Kriman , William Hudson Welch , Giles Humpston , Osher Avsian , Felix Hazanovich , Ekaterina Axelrod
IPC分类号： H04N5/232 , H01L27/146 , H04N5/225
摘要： The present invention provides optical imaging apparatus comprising solid state sensing elements and optical components operable to be manufactured and assembled at the wafer level.

84. 发明授权

US09029759B2 Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same 有权
标题翻译：紧凑型相机模块，具有降低Z高度和便于镜头对准的特征，以及制造相同的方法
公开(公告)号：US09029759B2
公开(公告)日：2015-05-12
申请号：US13445857
申请日：2012-04-12
申请人： Harpuneet Singh , Giles Humpston , Ellis Chau , Eddie Azuma , Peter Pietrangelo , Ocie Ward
发明人： Harpuneet Singh , Giles Humpston , Ellis Chau , Eddie Azuma , Peter Pietrangelo , Ocie Ward
IPC分类号： H01J5/02 , H01L31/0232 , H01L27/146 , H04N5/225
CPC分类号： H01L31/02327 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L2924/0002 , H04N5/2257 , H01L2924/00
摘要： A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.
摘要翻译：通过在保护性覆盖晶片上形成复制的透镜形状并且沉积材料以形成分别设置在其中的复制透镜形状的多个空腔而形成微型相机模块部件。载体晶片在被切割之前被耦合到保护盖晶片。中间晶片连接到保护盖晶片，并移除载体晶片。将图像传感器晶片连接到保护盖晶片，并移除中间晶片。

85. 发明授权

US08624342B2 Rear-face illuminated solid state image sensors 有权
标题翻译：背面照明固态图像传感器
公开(公告)号：US08624342B2
公开(公告)日：2014-01-07
申请号：US12940326
申请日：2010-11-05
申请人： Giles Humpston , Moshe Kriman
发明人： Giles Humpston , Moshe Kriman
IPC分类号： H01L31/02
CPC分类号： H01L27/14636 , H01L21/76898 , H01L27/14618 , H01L27/14632 , H01L27/14638 , H01L27/1464 , H01L27/14687 , H01L27/14806 , H01L2224/13024
摘要： A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.
摘要翻译：微电子单元包括具有附接有包装层的前表面和远离前表面的后表面的半导体元件。元件包括光检测器，其包括布置成邻近前表面设置的阵列的多个光检测器元件，并布置成通过后表面接收光。半导体元件还包括在连接到光检测器的前表面处的导电接触。导电接触包括薄区域和比薄区域更厚的较厚区域。导电互连件穿过包装层延伸到导电接触件的薄区域，并且导电互连件的一部分在微电子单元的表面处露出。

86. 发明申请

US20130314587A1 Multi-State Electrostatic Actuator and Digital Camera Therewith 审中-公开
标题翻译：多状态静电执行器和数码相机
公开(公告)号：US20130314587A1
公开(公告)日：2013-11-28
申请号：US13984275
申请日：2012-02-06
申请人： Moshe Kriman , Ephraim Goldenberg , Uri Kinrot , Gal Shabtay , Jamil Nasser , Dalit Bahar , Giles Humpston
发明人： Moshe Kriman , Ephraim Goldenberg , Uri Kinrot , Gal Shabtay , Jamil Nasser , Dalit Bahar , Giles Humpston
IPC分类号： H02N1/00 , H04N5/232
CPC分类号： H02N1/006 , H04N5/232
摘要： An actuator that operates by electrostatic attraction and repulsion and can have fixed and moving electrodes is disclosed for one or more embodiments. The fixed and moving electrodes can be inclined relative to each other at an acute angle. The actuator can be radially symmetric and mirrored about the moving electrode. The moving electrode can have a central aperture over which is placed an optical element such as a lens. The optical element can be part of an optical train that permits the focus of an electronic camera to be modified by changing the displacement of the lens along the optical axis of the camera.
摘要翻译：对于一个或多个实施例公开了一种通过静电吸引和排斥操作并且可以具有固定和移动的电极的致动器。固定和移动的电极可以相对于彼此以锐角倾斜。致动器可以围绕移动电极径向对称和镜像。移动电极可以具有中心孔，在其上放置诸如透镜的光学元件。光学元件可以是允许通过改变透镜沿着照相机的光轴的位移来修改电子照相机的焦点的光学系列的一部分。

87. 发明申请

US20130270419A1 Compact Camera Module 有权
标题翻译：小型相机模块
公开(公告)号：US20130270419A1
公开(公告)日：2013-10-17
申请号：US13445857
申请日：2012-04-12
申请人： Harpuneet Singh , Giles Humpston , Ellis Chau , Eddie Azuma , Peter Pietrangelo , Ocie Ward
发明人： Harpuneet Singh , Giles Humpston , Ellis Chau , Eddie Azuma , Peter Pietrangelo , Ocie Ward
IPC分类号： H01L27/146 , H01L31/18
CPC分类号： H01L31/02327 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L2924/0002 , H04N5/2257 , H01L2924/00
摘要： A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.
摘要翻译：通过在保护性覆盖晶片上形成复制的透镜形状并且沉积材料以形成分别设置在其中的复制透镜形状的多个空腔而形成微型相机模块部件。载体晶片在被切割之前被耦合到保护盖晶片。中间晶片连接到保护盖晶片，并移除载体晶片。将图像传感器晶片连接到保护盖晶片，并移除中间晶片。

88. 发明申请

US20130056241A1 EMITTER WIRE WITH LAYERED CROSS-SECTION 审中-公开
标题翻译：发射线与分层交叉部分
公开(公告)号：US20130056241A1
公开(公告)日：2013-03-07
申请号：US13302811
申请日：2011-11-22
申请人： Guilian Gao , Nels Jewell-Larsen , Giles Humpston
发明人： Guilian Gao , Nels Jewell-Larsen , Giles Humpston
IPC分类号： H01B5/00 , F28F13/00 , F04B19/00 , B05D5/12
CPC分类号： B03C3/60 , B03C3/41 , B03C2201/04 , B03C2201/14
摘要： By selecting different materials for each layer, a multi-layered electrode structure can be made with superior performance characteristics. For example, a multilayered electrode can include a high tensile strength tungsten core, a conductive intermediate palladium, palladium-nickel, or other platinum group metal layer for generating a corona discharge, and a hardened layer comprising rhodium or other platinum group metal or alloy of the same to resist frictional abrasion during removal of silica dendrites that accumulate on the electrode surface during operation.
摘要翻译：通过为每层选择不同的材料，可以制造具有优异性能特性的多层电极结构。例如，多层电极可以包括用于产生电晕放电的高拉伸强度钨芯，导电中间体钯，钯 - 镍或其它铂族金属层，以及包含铑或其它铂族金属或其它铂族金属的合金的硬化层同样能够抵抗在操作期间积聚在电极表面上的二氧化硅枝晶的去除期间的摩擦磨损。

89. 发明申请

US20120199857A1 Wafer-Scale Emitter Package Including Thermal Vias 审中-公开
标题翻译：包括散热片的晶圆发射器封装
公开(公告)号：US20120199857A1
公开(公告)日：2012-08-09
申请号：US13500889
申请日：2010-10-07
申请人： Giles Humpston , Moshe Kriman , Marc Himel
发明人： Giles Humpston , Moshe Kriman , Marc Himel
IPC分类号： H01L27/15 , H01L33/64
CPC分类号： H01L33/642 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： Improved packages for light emitters may be fabricated at the wafer level. The package can be a single device or an array of die. The package includes a thermal via that extends through the thickness of the package substrate. The thermal via may be made of a material possessing a high thermal conductivity. The thermal via may be wider at the package exterior than at the interior to provide heat spreading between the device and its heat sink. The taper angle of the thermal via may be around 45 degrees to match the natural spread of heat in a solid. The thermal via may extend above the package interior, so its height is sufficient to position an emitter placed thereon at one foci of a parabola, where the vertex of the parabola is at the surface of the package substrate from which the thermal via extends.
摘要翻译：可以在晶片级制造用于发光体的改进的封装。该封装可以是单个器件或一个管芯阵列。该封装包括延伸穿过封装衬底的厚度的热通孔。热通孔可以由具有高导热性的材料制成。热通孔在封装外部比在内部可以更宽，以在器件和其散热器之间提供散热。热通孔的锥角可以是大约45度，以匹配固体中的热量的自然扩散。热通孔可以在封装内部延伸，因此其高度足以将放置在其上的发射器放置在抛物线的一个焦点处，其中抛物线的顶点位于热通孔延伸的封装衬底的表面处。

90. 发明申请

US20110273600A1 Optical Imaging Apparatus And Methods Of Making The Same 审中-公开
标题翻译：光学成像设备及其制作方法
公开(公告)号：US20110273600A1
公开(公告)日：2011-11-10
申请号：US13145830
申请日：2010-02-03
申请人： Moshe Kriman , William Hudson Welch , Giles Humpston , Osher Avsian , Felix Hazanovich , Ekaterina Axelrod
发明人： Moshe Kriman , William Hudson Welch , Giles Humpston , Osher Avsian , Felix Hazanovich , Ekaterina Axelrod
IPC分类号： H04N5/335 , H01L31/18
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L2224/05001 , H01L2224/05009 , H01L2224/051 , H01L2224/0557 , H01L2224/056 , H01L2224/13 , H01L2224/13025 , H04N5/2254 , H04N5/2257 , H01L2924/00014
摘要： The present invention provides optical imaging apparatus comprising solid state sensing elements and optical components operable to be manufactured and assembled at the wafer level.
摘要翻译：本发明提供了包括固态感测元件和可操作以在晶片级制造和组装的光学部件的光学成像设备。

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