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    • 85. 发明申请
    • Field effect transistor and method for manufacturing the same
    • 场效应晶体管及其制造方法
    • US20060157804A1
    • 2006-07-20
    • US11287482
    • 2005-11-28
    • Tetsuzo Ueda
    • Tetsuzo Ueda
    • H01L29/76
    • H01L29/8122H01L29/2003H01L29/66856
    • A first SiO2 thin film, a tungsten gate electrode, and a second SiO2 thin film are selectively formed on a first n+-type GaN contact semiconductor layer in that order and in a multilayer film structure having the three layers, a stripe-shaped opening is formed. Via the opening, an undoped GaN channel semiconductor layer and the second n+-type GaN contact semiconductor layer are formed so that both the layers are regrown by, for example, metal organic chemical vapor deposition. A source electrode and a drain electrode are formed so as to contact the corresponding second and first n+-type GaN contact semiconductor layers. The regrown undoped GaN channel semiconductor layer and the regrown second n+-type GaN contact semiconductor layer are horizontally grown portions and hence, the contact area of the electrode can be made larger than the area of the opening.
    • 第一个SiO 2薄膜,钨栅电极和第二SiO 2薄膜选择性地形成在第一n + + / GaN接触半导体层,并且在具有三层的多层膜结构中形成条形开口。 通过开口,形成未掺杂的GaN沟道半导体层和第二n + + + GaN接触半导体层,使得这两个层通过例如金属有机化学气相沉积而再生长。 源电极和漏电极形成为与相应的第二和第n + +型GaN接触半导体层接触。 再生未掺杂的GaN沟道半导体层和再生长的第二n + + + GaN接触半导体层是水平生长的部分,因此可以使电极的接触面积大于开口的面积。