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    • 83. 发明申请
    • Memory Cells
    • 记忆细胞
    • US20110095256A1
    • 2011-04-28
    • US12983757
    • 2011-01-03
    • Jun Liu
    • Jun Liu
    • H01L47/00
    • H01L27/115B60G11/27B60G21/067B60G21/073B60G2500/202B60G2800/01G11C11/5678G11C13/0004G11C16/0475G11C2213/53G11C2213/71H01L29/1033H01L29/685
    • In some embodiments, a memory cell includes a transistor gate spaced from a channel region by gate dielectric; a source region on one side of the channel region; and a drain region on an opposing side of the channel region from the source region. The channel region has phase change material adjacent the drain region. In some embodiments, the phase change material may be adjacent both the source region and the drain region. Some embodiments include methods of programming a memory cell that has phase change material adjacent a drain region. An inversion layer is formed within the channel region adjacent the gate dielectric, with the inversion layer having a pinch-off region within the phase change material adjacent the drain region. Hot carriers (for instance, electrons) within the pinch-off region are utilized to change a phase within the phase change material.
    • 在一些实施例中,存储器单元包括通过栅极电介质与沟道区间隔开的晶体管栅极; 在沟道区一侧的源区; 以及在源极区域的沟道区域的相对侧上的漏极区域。 沟道区域具有与漏极区域相邻的相变材料。 在一些实施例中,相变材料可以与源极区域和漏极区域相邻。 一些实施例包括编程具有与漏极区相邻的相变材料的存储单元的方法。 在邻近栅极电介质的沟道区域内形成反型层,反型层在相变材料内具有与漏极区相邻的夹断区域。 使用夹断区域内的热载体(例如电子)来改变相变材料内的相位。
    • 88. 发明授权
    • Memory devices and formation methods
    • 记忆装置和形成方法
    • US07858468B2
    • 2010-12-28
    • US12261948
    • 2008-10-30
    • Jun LiuGurtej S. Sandhu
    • Jun LiuGurtej S. Sandhu
    • H01L21/8239
    • H01L21/02225H01L27/2409H01L27/2472H01L27/2481H01L45/06H01L45/12H01L45/1233H01L45/144H01L45/16
    • A method includes forming an electrical insulator material over an integrated circuit having a metal-containing conductive interconnect and activating a dopant in a semiconductor material of a substrate to provide a doped region. The doped region provides a junction of opposite conductivity types. After activating the dopant, the substrate is bonded to the insulator material and at least some of the substrate is removed where bonded to the insulator material. After the removing, a memory cell is formed having a word line, an access diode, a state-changeable memory element containing chalcogenide phase change material, and a bit line all electrically connected in series, the access diode containing the junction as a p-n junction. A memory device includes an adhesion material over the insulator material and bonding the word line to the insulator material.
    • 一种方法包括在具有含金属的导电互连的集成电路上形成电绝缘体材料,并激活衬底的半导体材料中的掺杂剂以提供掺杂区域。 掺杂区域提供相反导电类型的结。 在激活掺杂剂之后,衬底被结合到绝缘体材料上,并且至少部分衬底在与绝缘体材料接合的情况下被去除。 在移除之后,形成具有字线,存取二极管,含有硫族化物相变材料的状态可变存储元件和全部电连接的位线的存储单元,该存储二极管包含该结作为pn结 。 存储器件包括绝缘体材料上的粘合材料并将字线连接到绝缘体材料上。