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81. 发明申请

US20080236473A1 METHOD AND APPARATUS FOR CONTROLLING FRICTION BETWEEN A FLUID AND A BODY 有权
标题翻译：用于控制流体和体液之间的摩擦的方法和装置
公开(公告)号：US20080236473A1
公开(公告)日：2008-10-02
申请号：US11518694
申请日：2006-09-11
申请人： Avinoam Kornblit , Timofei Nikita Kroupenkine , Mary Louise Mandich , Tobias Manuel Schneider , Joseph Ashley Taylor , Donald Weiss , Shu Yang
发明人： Avinoam Kornblit , Timofei Nikita Kroupenkine , Mary Louise Mandich , Tobias Manuel Schneider , Joseph Ashley Taylor , Donald Weiss , Shu Yang
IPC分类号： B63B1/34
CPC分类号： B63B1/34 , B63H25/00 , Y02T70/121
摘要： A method and apparatus is disclosed wherein nanostructures or microstructures are disposed on a surface of a body (such as a submersible vehicle) that is adapted to move through a fluid, such as water. The nanostructures or microstructures are disposed on the surface in a way such that the contact between the surface and the fluid is reduced and, correspondingly, the friction between the surface and the fluid is reduced. In an illustrative embodiment, the surface is a surface on a submarine or other submersible vehicle (such as a torpedo). Illustratively, electrowetting principles are used to cause the fluid to at least partially penetrate the nanostructures or microstructures on the surface of the body in order to selectively create greater friction in a desired location of the surface. Such penetration may be used, for example, to create drag that alters the direction or speed of travel of the body.
摘要翻译：公开了一种方法和装置，其中将纳米结构或微结构布置在适于移动通过诸如水的流体的主体（例如潜水车辆）的表面上。纳米结构或微结构以这样的方式设置在表面上，使得表面和流体之间的接触减小，并且相应地减小了表面和流体之间的摩擦。在说明性实施例中，表面是潜艇或其他潜水车辆（例如鱼雷）上的表面。说明性地，使用电润湿原理使流体至少部分地穿透身体表面上的纳米结构或微结构，以便在表面的期望位置选择性地产生更大的摩擦。例如，可以使用这种穿透来产生改变身体行进方向或速度的阻力。

82. 发明申请

US20070278699A1 Microelectronic element chips 失效
标题翻译：微电子元件芯片
公开(公告)号：US20070278699A1
公开(公告)日：2007-12-06
申请号：US11445072
申请日：2006-05-31
申请人： Vladimir A. Aksyuk , Nagesh R. Basavanhally , Avinoam Kornblit , Warren Yiu-Cho Lai , Joseph Ashley Taylor , Robert Francis Fullowan
发明人： Vladimir A. Aksyuk , Nagesh R. Basavanhally , Avinoam Kornblit , Warren Yiu-Cho Lai , Joseph Ashley Taylor , Robert Francis Fullowan
IPC分类号： H01L23/48
CPC分类号： H01L21/6835 , B81B7/0006 , B81B7/04 , H01L21/486 , H01L21/6836 , H01L23/147 , H01L23/5384 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L25/0655 , H01L2221/68318 , H01L2221/68327 , H01L2221/68372 , H01L2224/0401 , H01L2224/0557 , H01L2224/05572 , H01L2224/1147 , H01L2224/11472 , H01L2224/13025 , H01L2224/13099 , H01L2224/13109 , H01L2224/13111 , H01L2224/16 , H01L2224/81001 , H01L2224/81801 , H01L2924/0002 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2224/05552
摘要： Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip substrate and fully spanning a distance between the first and second chip surfaces. Process including: providing an apparatus including a chip substrate having a first chip surface facing away from a second chip surface, an array of microelectronic elements being on the first chip surface, an array of conductors each being in communication with one of the microelectronic elements and partially spanning an average distance between the first and second chip surfaces; bonding a temporary support carrier onto the array of microelectronic elements; removing a portion of the chip substrate, thereby reducing the average distance between the first and second chip surfaces; and forming an under bump metallization pad at the second chip surface in electrical communication with a conductor.
摘要翻译：一种装置，包括具有背离第二芯片表面的第一芯片表面的芯片衬底; 第一芯片表面上的微电子元件阵列; 以及每个与所述微电子元件中的一个连通的导体阵列，所述导体穿过所述芯片基板并且完全跨越所述第一和第二芯片表面之间的距离。该方法包括：提供包括芯片衬底的装置，该芯片衬底具有背离第二芯片表面的第一芯片表面，位于第一芯片表面上的微电子元件阵列，每个导体阵列与微电子元件中的一个连接，部分跨越第一和第二芯片表面之间的平均距离; 将临时支撑载体接合到微电子元件阵列上; 去除所述芯片基板的一部分，从而减小所述第一和第二芯片表面之间的平均距离; 以及在所述第二芯片表面处形成与导体电连通的凸块下金属化焊盘。

83. 发明授权

US07227235B2 Electrowetting battery having a nanostructured electrode surface 有权
标题翻译：具有纳米结构电极表面的电润湿电池
公开(公告)号：US07227235B2
公开(公告)日：2007-06-05
申请号：US10716084
申请日：2003-11-18
申请人： Timofei Nikita Kroupenkine , Joseph Ashley Taylor , Donald Weiss
发明人： Timofei Nikita Kroupenkine , Joseph Ashley Taylor , Donald Weiss
IPC分类号： H01M4/60
CPC分类号： H01M6/36 , F42C19/00 , H01M6/30 , H01M6/32
摘要： A method and apparatus are disclosed wherein a battery comprises an electrode having at least one nanostructured surface. The nanostructured surface is disposed in a way such that an electrolyte fluid of the battery is prevented from contacting the electrode, thus preventing discharge of the battery when the battery is not in use. When a voltage is passed over the nanostructured surface, the electrolyte fluid is caused to penetrate the nanostructured surface and to contact the electrode, thus activating the battery. In one illustrative embodiment, the battery is an integrated part of an electronics package. In another embodiment, the battery is manufactured as a separate device and is then brought into contact with the electronics package. In yet another embodiment, the electronics package and an attached battery are disposed in a projectile that is used as a military targeting device.
摘要翻译：公开了一种方法和装置，其中电池包括具有至少一个纳米结构表面的电极。纳米结构表面被设置成使得电池的电解质流体被防止接触电极，从而防止当电池不使用时电池的放电。当电压通过纳米结构表面时，使电解液渗入纳米结构表面并与电极接触，从而启动电池。在一个说明性实施例中，电池是电子封装的集成部分。在另一个实施例中，电池被制造为单独的装置，然后与电子封装件接触。在另一个实施例中，电子封装和附接的电池被设置在用作军事瞄准装置的射弹中。

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