会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 82. 发明授权
    • High frequency module
    • 高频模块
    • US07711389B2
    • 2010-05-04
    • US10595782
    • 2004-10-21
    • Koji FurutaniShinya Watanabe
    • Koji FurutaniShinya Watanabe
    • H04M1/00
    • H04B1/0057H04B1/005H04B1/406H04B1/48
    • A high frequency module for transmitting and receiving, for example, communication signals of GSM/DCS/PCS/WCDMA systems through a single antenna, is provided at a relatively small size and low cost. The high frequency module includes a diplexer arranged to separate communication signals from the antenna into GSM communication signals in lower frequency bands and POS/DOS/WODMA communication signals in higher frequency bands, a diode switch circuit that is connected to a input and output terminal of the GSM communication signal of the diplexer and is arranged to switch transmission and reception of the GSM communication signal, and a multipoint GaAsIC switch that is connected to the GSM/DCS/PCS/WCDMA communication signals of the diplexer and is arranged to switch transmission and reception of these signals. The high frequency module switches the four types of communication signals by changing the patterns of controls signals VcG, VC1, and Vc2 that are applied to the diode switch circuit and the GaAsIC switch.
    • 以相对较小的尺寸和低成本提供用于例如通过单个天线发送和接收例如GSM / DCS / PCS / WCDMA系统的通信信号的高频模块。 高频模块包括:双工器,被配置为将来自天线的通信信号分离成较低频带的GSM通信信号和较高频带的POS / DOS / WODMA通信信号;二极管开关电路,连接到输入和输出端子 双工器的GSM通信信号,并且被设置为切换GSM通信信号的发送和接收,以及连接到双工器的GSM / DCS / PCS / WCDMA通信信号的多点GaAsIC开关,并且被布置成切换传输和 接收这些信号。 高频模块通过改变施加到二极管开关电路和GaAsIC开关的控制信号VcG,VC1和Vc2的模式来切换四种类型的通信信号。
    • 84. 发明申请
    • SEMICONDUCTOR DEVICE
    • 半导体器件
    • US20090257212A1
    • 2009-10-15
    • US12376541
    • 2007-07-25
    • Fumitomo TakanoShinya WatanabeTsukasa AibaJoji NakashimaHiroshi Otsuka
    • Fumitomo TakanoShinya WatanabeTsukasa AibaJoji NakashimaHiroshi Otsuka
    • H05K1/14
    • H01L25/071H01L25/18H01L2224/48091H01L2224/48247H01L2224/49113H01L2924/1305H01L2924/13055H01L2924/13091H01L2924/30107H01L2924/3011H01L2924/00014H01L2924/00
    • A semiconductor device includes first and second assembled bodies (12A, 12B). The first assembled body is provided with a first semiconductor chip, a high voltage bus bar (21) connected to one surface of the first semiconductor chip, a first metal wiring board (24-1) connected to the other surface of the first semiconductor chip with a bonding wire, and a third metal wiring board (24-3) connected to the first metal wiring board. The second assembled body is provided with a second semiconductor chip, a low voltage bus bar (23) connected to one surface of the second semiconductor chip with a bonding wire, a second metal wiring board (24-2) connected to the other surface of the second semiconductor chip, and a fourth metal wiring board (24-4) connected by being returned from an end portion of the second metal wiring board and arranged in parallel to the second metal wiring board. The first assembled body and the second assembled body are arranged in a stacked structure wherein the assembled bodies are being separated. Inductance of a main circuit is reduced by the semiconductor module structure.
    • 半导体器件包括第一和第二组装体(12A,12B)。 第一组装体设置有第一半导体芯片,连接到第一半导体芯片的一个表面的高压母线(21),连接到第一半导体芯片的另一个表面的第一金属布线板(24-1) 和与第一金属布线板连接的第三金属布线板(24-3)。 第二组装体设置有第二半导体芯片,利用接合线连接到第二半导体芯片的一个表面的低压母线(23),连接到第二半导体芯片的另一个表面的第二金属布线板(24-2) 第二半导体芯片和第四金属布线板(24-4),通过从第二金属布线板的端部返回并与第二金属布线板平行地布置。 第一组装体和第二组装体被布置成堆叠结构,其中组装体被分离。 通过半导体模块结构减小主电路的电感。
    • 86. 发明申请
    • HIGH FREQUENCY MODULE
    • 高频模块
    • US20090075604A1
    • 2009-03-19
    • US10595782
    • 2004-10-21
    • Koji FurutaniShinya Watanabe
    • Koji FurutaniShinya Watanabe
    • H04B1/44
    • H04B1/0057H04B1/005H04B1/406H04B1/48
    • A high frequency module for transmitting and receiving, for example, communication signals of GSM/DCS/PCS/WCDMA systems through a single antenna, is provided at a relatively small size and low cost. The high frequency module includes a diplexer arranged to separate communication signals from the antenna into GSM communication signals in lower frequency bands and PCS/DCS/WCDMA communication signals in higher frequency bands, a diode switch circuit that is connected to a input and output terminal of the GSM communication signal of the diplexer and is arranged to switch transmission and reception of the GSM communication signal, and a multipoint GaAsIC switch that is connected to the GSM/DCS/PCS/WCDMA communication signals of the diplexer and is arranged to switch transmission and reception of these signals. The high frequency module switches the four types of communication signals by changing the patterns of controls signals VcG, VC1, and Vc2 that are applied to the diode switch circuit and the GaAsIC switch.
    • 以相对较小的尺寸和低成本提供用于例如通过单个天线发送和接收例如GSM / DCS / PCS / WCDMA系统的通信信号的高频模块。 高频模块包括一个双工器,它被设置成将来自天线的通信信号分离成较低频带的GSM通信信号和较高频段的PCS / DCS / WCDMA通信信号,二极管开关电路连接到输入和输出端 双工器的GSM通信信号,并且被设置为切换GSM通信信号的发送和接收,以及连接到双工器的GSM / DCS / PCS / WCDMA通信信号的多点GaAsIC开关,并且被布置成切换传输和 接收这些信号。 高频模块通过改变施加到二极管开关电路和GaAsIC开关的控制信号VcG,VC1和Vc2的模式来切换四种类型的通信信号。
    • 87. 发明授权
    • Retarder, liquid crystal display element, and liquid crystal projector
    • 减速器,液晶显示元件和液晶投影机
    • US07477348B2
    • 2009-01-13
    • US11563412
    • 2006-11-27
    • Shinya Watanabe
    • Shinya Watanabe
    • G02F1/1335
    • G02F1/13363G02B5/045G02B5/3083G02F1/1337G02F2413/02G02F2413/07G02F2413/09G02F2413/10H04N9/3167
    • A retarder includes a transparent support substrate, a prism layer including a plurality of microprisms arranged on one of main surfaces of the transparent support substrate, where each of the microprisms has a sloped prism face formed at the same slope angle with respect to the one main surface in the same direction, an optical anisotropic medium layer disposed on the sloped prism face so that an optic axis of the optical anisotropic medium layer is directed in one of a direction of the maximum sloped prism face of the microprisms and a direction perpendicular to the direction of the maximum sloped prism face, and a planarizing layer disposed on the transparent support substrate so as to embed the optical anisotropic medium layer therein. The planarizing layer is formed from a material having an index of refraction that is substantially the same as that of the microprisms.
    • 延迟器包括透明支撑基板,棱镜层,其包括布置在透明支撑基板的一个主表面上的多个微棱镜,其中每个微棱镜具有相对于一个主棱镜以相同倾斜角度形成的倾斜棱镜面 表面在相同方向上,设置在倾斜棱镜面上的光学各向异性介质层,使得光学各向异性介质层的光轴指向微棱镜的最大倾斜棱镜面的方向和垂直于 最大倾斜棱镜面的方向,以及设置在透明支撑基板上以将光学各向异性介质层嵌入其中的平坦化层。 平坦化层由具有与微棱镜基本相同的折射率的材料形成。