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81. 发明授权

US08476663B2 Semiconductor light emitting component and method for manufacturing the same 有权
标题翻译：半导体发光元件及其制造方法
公开(公告)号：US08476663B2
公开(公告)日：2013-07-02
申请号：US13102350
申请日：2011-05-06
申请人： Ray-Hua Horng , Yi-An Lu
发明人： Ray-Hua Horng , Yi-An Lu
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L27/153 , H01L33/0079 , H01L33/20 , H01L33/22 , H01L33/38 , H01L33/405 , H01L33/46
摘要： A method for manufacturing a semiconductor light emitting component is disclosed in the present invention. First, a substrate is provided and an epitaxial structure is formed thereon, wherein a first surface of the epitaxial structure contacts the substrate. The epitaxial structure includes a first type doped layer, a light emitting portion and a second type doped layer. A first electrode is then formed on a second surface of the first type doped layer. Subsequently, a functional structure is formed on the first electrode using an in-situ method. Afterwards, the substrate is removed to expose the epitaxial structure. Finally, an etching step is performed to etch the exposed epitaxial structure, so as to expose at least a portion of the first electrode.
摘要翻译：在本发明中公开了半导体发光元件的制造方法。首先，提供衬底并且在其上形成外延结构，其中外延结构的第一表面接触衬底。外延结构包括第一类型掺杂层，发光部分和第二类型掺杂层。然后在第一类型掺杂层的第二表面上形成第一电极。随后，使用原位法在第一电极上形成功能结构。之后，去除衬底以露出外延结构。最后，执行蚀刻步骤以蚀刻暴露的外延结构，以暴露第一电极的至少一部分。

82. 发明申请

US20120193652A1 LED ARRAY FORMED BY INTERCONNECTED AND SURROUNDED LED CHIPS 审中-公开
标题翻译： LED阵列由互连和周边LED灯形成
公开(公告)号：US20120193652A1
公开(公告)日：2012-08-02
申请号：US13287542
申请日：2011-11-02
申请人： Ray-Hua Horng , Yi-An Lu , Heng Liu
发明人： Ray-Hua Horng , Yi-An Lu , Heng Liu
IPC分类号： H01L33/08
CPC分类号： H01L25/0753 , H01L24/24 , H01L33/54 , H01L33/62 , H01L33/641 , H01L2224/24137 , H01L2224/73267 , H01L2924/12041 , H01L2924/15788 , H01L2933/0066 , H01L2924/00
摘要： A light emitting diode array includes a first light emitting diode having a first electrode and a second light emitting diode having a second electrode. The first and second light emitting diodes are separated. A first polymer layer is positioned between the light emitting diodes. An interconnect located at least partially on the first polymer layer connects the first electrode to the second electrode. A permanent substrate is coupled to the light emitting diodes. The permanent substrate is coupled to the side of the light emitting diodes with the interconnect. A second polymer layer at least partially encapsulates the side of the light emitting diodes opposite the permanent substrate (the side opposite the interconnect).
摘要翻译：发光二极管阵列包括具有第一电极的第一发光二极管和具有第二电极的第二发光二极管。第一和第二发光二极管被分离。第一聚合物层位于发光二极管之间。至少部分地位于第一聚合物层上的互连将第一电极连接到第二电极。永久基板耦合到发光二极管。永久性基板通过互连件耦合到发光二极管的侧面。第二聚合物层至少部分地封装与永久基板相对的发光二极管的侧面（与互连件相对的一侧）。

83. 发明授权

US08193546B2 Light-emitting-diode array with polymer between light emitting devices 有权
标题翻译：具有聚合物的发光二极管阵列在发光器件之间
公开(公告)号：US08193546B2
公开(公告)日：2012-06-05
申请号：US12948504
申请日：2010-11-17
申请人： Ray-Hua Horng , Yi-An Lu , Heng Liu
发明人： Ray-Hua Horng , Yi-An Lu , Heng Liu
IPC分类号： H01L21/00 , H01L21/44 , H01L29/207 , H01L29/06 , H01L23/48
CPC分类号： H01L25/0753 , H01L24/24 , H01L24/82 , H01L27/156 , H01L33/50 , H01L33/56 , H01L33/62 , H01L2924/01012 , H01L2924/01029 , H01L2924/12041 , H01L2924/00
摘要： A light-emitting-diode (LED) array includes a first LED device having a first electrode and a second LED device having a second electrode. The first and the second LED device are formed on a common substrate and are separated by a gap. At least one polymer material substantially fills the gap. An interconnect, formed on top of the at least one polymer material, electrically connects the first electrode and the second electrode.
摘要翻译：发光二极管（LED）阵列包括具有第一电极的第一LED器件和具有第二电极的第二LED器件。第一和第二LED器件形成在公共衬底上并被间隙隔开。至少一种聚合物材料基本上填充该间隙。在所述至少一种聚合物材料的顶部上形成的互连电连接所述第一电极和所述第二电极。

84. 发明授权

US08178886B2 Multi-layered LED epitaxial structure with light emitting unit 有权
标题翻译：具有发光单元的多层LED外延结构
公开(公告)号：US08178886B2
公开(公告)日：2012-05-15
申请号：US12980964
申请日：2010-12-29
申请人： Ray-Hua Horng
发明人： Ray-Hua Horng
IPC分类号： H01L33/60
CPC分类号： H01L27/153 , H01L33/0079 , H01L33/22 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
摘要： A method for manufacturing a semiconductor light emitting device includes: (a) providing a temporary substrate; (b) forming a multi-layered LED epitaxial structure, having at least one light emitting unit, on the temporary substrate, wherein a first surface of the light emitting unit contacts the temporary substrate, and the light emitting unit includes a n-type layer, an active region, and a p-type layer; (c) forming a n-electrode on the n-type layer; (d) forming a p-electrode on the p-type layer; (e) bonding a permanent substrate on the light emitting unit, the n-electrode and the p-electrode; (f) removing the temporary substrate to expose the first surface of the light emitting unit; and (g) removing a portion of the light emitting unit from the first surface, to expose at least one of the n-electrode and the p-electrode.
摘要翻译：一种制造半导体发光器件的方法包括：（a）提供临时衬底; （b）在所述临时衬底上形成具有至少一个发光单元的多层LED外延结构，其中所述发光单元的第一表面接触所述临时衬底，并且所述发光单元包括n型层，有源区和p型层; （c）在n型层上形成n电极; （d）在p型层上形成p电极; （e）在发光单元，n电极和p电极上键合永久性基板; （f）去除所述临时衬底以露出所述发光单元的所述第一表面; 以及（g）从所述第一表面去除所述发光单元的一部分，以暴露所述n电极和所述p电极中的至少一个。

85. 发明申请

US20120001202A1 Semiconductor Light Emitting Device and Method for Manufacturing the Same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20120001202A1
公开(公告)日：2012-01-05
申请号：US12980964
申请日：2010-12-29
申请人： Ray-Hua Horng
发明人： Ray-Hua Horng
IPC分类号： H01L33/60
CPC分类号： H01L27/153 , H01L33/0079 , H01L33/22 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0066 , H01L2924/00
摘要： A method for manufacturing a semiconductor light emitting device includes: (a) providing a temporary substrate; (b) forming a multi-layered LED epitaxial structure, having at least one light emitting unit, on the temporary substrate, wherein a first surface of the light emitting unit contacts the temporary substrate, and the light emitting unit includes a n-type layer, an active region, and a p-type layer; (c) forming a n-electrode on the n-type layer; (d) forming a p-electrode on the p-type layer; (e) bonding a permanent substrate on the light emitting unit, the n-electrode and the p-electrode; (f) removing the temporary substrate to expose the first surface of the light emitting unit; and (g) removing a portion of the light emitting unit from the first surface, to expose at least one of the n-electrode and the p-electrode.
摘要翻译：一种制造半导体发光器件的方法包括：（a）提供临时衬底; （b）在所述临时衬底上形成具有至少一个发光单元的多层LED外延结构，其中所述发光单元的第一表面接触所述临时衬底，并且所述发光单元包括n型层，有源区和p型层; （c）在n型层上形成n电极; （d）在p型层上形成p电极; （e）在发光单元，n电极和p电极上键合永久性基板; （f）去除所述临时衬底以露出所述发光单元的所述第一表面; 以及（g）从所述第一表面去除所述发光单元的一部分，以暴露所述n电极和所述p电极中的至少一个。

86. 发明授权

US08031889B2 Acoustoeletric transformation chip for ribbon microphone 有权
标题翻译：带式麦克风的声波转换芯片
公开(公告)号：US08031889B2
公开(公告)日：2011-10-04
申请号：US12383596
申请日：2009-03-24
申请人： Ray-Hua Horng , Chao-Chih Chang , Ming-Li Ke , Guan-Wei Chen , Yao-Cheng Tsai
发明人： Ray-Hua Horng , Chao-Chih Chang , Ming-Li Ke , Guan-Wei Chen , Yao-Cheng Tsai
IPC分类号： H04R25/00
CPC分类号： H04R9/048 , H04R3/00
摘要： An acoustoelectric transformation chip for a ribbon microphone includes a diaphragm that has a vibrating region and two fixing regions disposed on two opposite sides of the vibrating region, and a voice coil film formed on the diaphragm. The voice coil film includes two rectangular voice coils, each of which has a plurality of first and second connection segments parallel to a direction of a magnetic field. A plurality of first and second transverse segments are perpendicular to the first and second connection segments and are connected between the first and second connection segments. The second transverse segments of each voice coil are disposed on one of the fixing regions. The first transverse segments of the two voice coils are disposed in the vibrating region.
摘要翻译：用于带状麦克风的声电转换芯片包括具有振动区域和设置在振动区域的两个相对侧上的两个固定区域的隔膜和形成在隔膜上的音圈膜。音圈膜包括两个矩形音圈，每个音圈具有平行于磁场方向的多个第一和第二连接段。多个第一和第二横向段垂直于第一和第二连接段并连接在第一和第二连接段之间。每个音圈的第二横向片段设置在一个固定区域上。两个音圈的第一横向片段设置在振动区域中。

87. 发明申请

US20110092005A1 LIGHT-EMITTING-DIODE ARRAY AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：发光二极管阵列及其制造方法
公开(公告)号：US20110092005A1
公开(公告)日：2011-04-21
申请号：US12975068
申请日：2010-12-21
申请人： Ray-Hua Horng , Yi-An Lu , Heng Liu
发明人： Ray-Hua Horng , Yi-An Lu , Heng Liu
IPC分类号： H01L33/00
CPC分类号： H01L27/156 , H01L2224/16225 , H01L2224/16227 , H01L2224/24137 , H01L2224/73267 , H01L2224/82 , H01L2224/92244 , H01L2933/0066
摘要： A method for forming a light-emitting-diode (LED) array is disclosed which comprises forming a LED structure on a substrate, dividing the LED structure into at least a first and a second LED device with a gap, depositing at least one polymer material over the LED structure substantially filling the gap, removing portions of the at least one polymer material to expose a first electrode of the first LED device and a second electrode of the second LED device, and forming an interconnect on top of the at least one polymer material electrically connecting the first and second electrode.
摘要翻译：公开了一种用于形成发光二极管（LED）阵列的方法，其包括在衬底上形成LED结构，将LED结构分成具有间隙的至少第一和第二LED器件，沉积至少一种聚合物材料在所述LED结构上基本上填充所述间隙，去除所述至少一种聚合物材料的部分以暴露所述第一LED器件的第一电极和所述第二LED器件的第二电极，以及在所述至少一种聚合物的顶部上形成互连电连接第一和第二电极的材料。

88. 发明授权

US07343661B2 Method for making condenser microphones 有权
标题翻译：制作电容麦克风的方法
公开(公告)号：US07343661B2
公开(公告)日：2008-03-18
申请号：US11409615
申请日：2006-04-24
申请人： Ray-Hua Horng , Zong-Ying Lin , Jean-Yih Tsai , Chao-Chih Chang
发明人： Ray-Hua Horng , Zong-Ying Lin , Jean-Yih Tsai , Chao-Chih Chang
IPC分类号： H04R31/00
CPC分类号： H04R19/005 , H04R19/04 , H04R31/003 , Y10T29/42 , Y10T29/435 , Y10T29/49005 , Y10T29/49007 , Y10T29/4908
摘要： A method for making condenser microphones includes: forming a fixed electrode layer structure of a plurality of fixed electrode units; forming a sacrificial layer of a plurality of sacrificial units on one side of the fixed electrode layer structure; forming a diaphragm layer structure of a plurality of diaphragm units on the sacrificial layer; forming a patterned mask layer on an opposite side of the fixed electrode layer structure opposite to the sacrificial layer; forming a plurality of etching channels, each of which extends through the patterned mask layer and the fixed electrode layer structure; removing a portion of the sacrificial layer of each of the sacrificial units so as to form a spacer between a respective one of the fixed electrode units and a respective one of the diaphragm units; and removing the patterned mask layer.
摘要翻译：一种制造电容式麦克风的方法包括：形成多个固定电极单元的固定电极层结构; 在所述固定电极层结构的一侧上形成多个牺牲单元的牺牲层; 在牺牲层上形成多个膜片单元的隔膜层结构; 在与牺牲层相对的固定电极层结构的相对侧上形成图案化掩模层; 形成多个蚀刻通道，每个蚀刻通道延伸通过图案化掩模层和固定电极层结构; 去除每个牺牲单元的牺牲层的一部分，以便在固定电极单元中的相应一个和相应的一个隔膜单元之间形成间隔物; 并去除图案化掩模层。

89. 发明申请

US20060216845A1 White light emitting device and method of making same 有权
标题翻译：白光发射装置及其制造方法
公开(公告)号：US20060216845A1
公开(公告)日：2006-09-28
申请号：US11398262
申请日：2006-04-04
申请人： Tung-Hsing Wu , Ray-Hua Horng , Meng-Chai Wu
发明人： Tung-Hsing Wu , Ray-Hua Horng , Meng-Chai Wu
IPC分类号： H01L21/00
CPC分类号： H01L25/0753 , H01L33/08 , H01L33/508 , H01L2224/48091 , H01L2224/48137 , H01L2224/48471 , H01L2224/49107 , H01L2924/00014 , H01L2224/4554
摘要： A white-light emitting device comprising a first PRS-LED and a second PRS-LED. The first PRS-LED has a primary light source to emit blue light and a secondary light source to emit red light responsive to the blue light; and the second PRS-LED has a primary light source to emit green light and a secondary light source for emitting red light responsive to the green light. Each of the primary light sources is made from an InGaN layer disposed between a p-type GaN layer and an n-type GaN layer. The secondary light sources are made from AlGaInP. The primary light source and the secondary light source can be disposed on opposite sides of a sapphire substrate. Alternatively, the second light source is disposed on the n-type GaN layer of the primary light source. The second light sources may comprise micro-rods of AlGaInP of same or different compositions.
摘要翻译：一种白光发射装置，包括第一PRS-LED和第二PRS-LED。第一PRS-LED具有发射蓝光的初级光源和响应蓝色光发出红光的次级光源; 并且第二PRS-LED具有发射绿光的初级光源和响应于绿色光发射红光的次级光源。每个初级光源由设置在p型GaN层和n型GaN层之间的InGaN层制成。二次光源由AlGaInP制成。主光源和次光源可以设置在蓝宝石衬底的相对侧上。或者，第二光源设置在初级光源的n型GaN层上。第二光源可以包括相同或不同组成的AlGaInP微棒。

90. 发明申请

US20060160257A1 White-light emitting devices and methods for manufacturing the same 有权
标题翻译：白光发射装置及其制造方法
公开(公告)号：US20060160257A1
公开(公告)日：2006-07-20
申请号：US11302641
申请日：2005-12-14
申请人： Tung-Hsing Wu , Ray-Hua Horng , Meng-Chai Wu
发明人： Tung-Hsing Wu , Ray-Hua Horng , Meng-Chai Wu
IPC分类号： H01L21/00
CPC分类号： H01L25/0753 , H01L33/08 , H01L33/508 , H01L2224/48091 , H01L2224/48137 , H01L2224/48471 , H01L2224/49107 , H01L2924/00014 , H01L2224/4554
摘要： White-light emitting devices and methods for manufacturing the same. The white-light emitting device emits white light comprising a first color component with first wavelength, a second color component with a second wavelength, and a third color component with a third wavelength. The first wavelength is shorter than the second wavelength. The second wavelength is shorter than the third wavelength. The white-light emitting device comprises a baseboard. A first light emitting device emitting the first color component and a second light emitting device emitting a second color component are disposed on the baseboard. A transparent passivation layer with a substantially planar surface is formed on the baseboard. A second light emitting device is disposed on the transparent passivation layer. The second light emitting device emits the third color component which is responsive to the first and the second color components.
摘要翻译：白光发射装置及其制造方法。白光发射装置发射包括具有第一波长的第一颜色分量，具有第二波长的第二颜色分量和具有第三波长的第三颜色分量的白光。第一波长比第二波长短。第二波长比第三波长短。白光发射装置包括基板。发射第一颜色分量的第一发光器件和发射第二颜色分量的第二发光器件设置在基板上。在基板上形成具有大致平坦表面的透明钝化层。第二发光器件设置在透明钝化层上。第二发光器件发射响应于第一和第二颜色分量的第三颜色分量。

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