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    • 84. 发明申请
    • Via hole machining for microwave monolithic integrated circuits
    • 微波单片集成电路的通孔加工
    • US20070026676A1
    • 2007-02-01
    • US11194419
    • 2005-08-01
    • Ming LiXinbing LiuHiroyuki SakaiMasaaki NishijimaDaisuke Ueda
    • Ming LiXinbing LiuHiroyuki SakaiMasaaki NishijimaDaisuke Ueda
    • H01L21/302
    • B23K26/0624B23K26/40B23K2103/50
    • A method for forming a via in a sapphire substrate with a laser machining system that includes an ultrafast pulsed laser source. The sapphire substrate is provided. Pulses of laser light are substantially focused to a beam spot on the first surface of the sapphire substrate such that each focused pulse of laser light ablates a volume of the sapphire substrate having a depth less than the substrate thickness. The beam spot of the focused laser light pulses is scanned over a via portion of the first surface of the sapphire substrate. The sapphire substrate is moved in a direction substantially normal to the first surface to control the volume of the sapphire substrate ablated by each pulse of laser light to be substantially constant. The pulsing and scanning steps are repeated until the via is formed extending from the first surface to the second surface of the sapphire substrate.
    • 一种在具有包括超快脉冲激光源的激光加工系统的蓝宝石衬底中形成通孔的方法。 提供蓝宝石衬底。 激光的脉冲基本上聚焦到蓝宝石衬底的第一表面上的束斑上,使得每个聚焦的激光脉冲消除了具有小于衬底厚度的深度的蓝宝石衬底的体积。 聚焦激光脉冲的束斑在蓝宝石衬底的第一表面的通孔部分上扫描。 蓝宝石衬底沿着基本上垂直于第一表面的方向移动,以控制由每个激光脉冲消融的蓝宝石衬底的体积基本恒定。 重复脉冲和扫描步骤,直到形成从蓝宝石衬底的第一表面延伸到第二表面的通孔。
    • 86. 发明申请
    • Laser device and laser module
    • 激光设备和激光模块
    • US20060203860A1
    • 2006-09-14
    • US11352948
    • 2006-02-13
    • Kenichi InoueKazuhiko YamanakaKazutoshi OnozawaDaisuke Ueda
    • Kenichi InoueKazuhiko YamanakaKazutoshi OnozawaDaisuke Ueda
    • H01S3/10
    • H01S5/02292H01S5/005H01S5/0071H01S5/02248H01S5/4012H01S5/4087
    • A laser module includes a substrate 1, a first laser element 2 placed on the substrate 1, a second laser element 3 placed with an output surface opposed to the first laser element 2 on the substrate 1, and a mirror 7 placed between the first laser element 2 and the second laser element 3. The mirror 7 has a reflective surface capable of reflecting output light from the first laser element 2 or the second laser element 3 in a predetermined direction, and is placed so as to move or rotate between a first position capable of reflecting the output light from the first laser element 2 and a second position capable of reflecting the output light from the second laser element 3. Thus, a laser module can be provided in which high precision, low cost, and miniaturization can be realized.
    • 激光模块包括基板1,放置在基板1上的第一激光元件2,在基板1上设置有与第一激光元件2相对的输出面的第二激光元件3,以及配置在第一激光器 元件2和第二激光元件3。 反射镜7具有反射表面,该反射表面能够沿预定方向反射来自第一激光元件2或第二激光元件3的输出光,并且能够在能够反射来自第一激光元件2或第二激光元件3的输出光的第一位置之间移动或旋转 第一激光元件2和能够反射来自第二激光元件3的输出光的第二位置。 因此,可以提供可以实现高精度,低成本和小型化的激光模块。