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    • 81. 发明授权
    • Die attaching method
    • 贴片方法
    • US07582542B2
    • 2009-09-01
    • US11552416
    • 2006-10-24
    • Dae-Young KimJoung-Min Oh
    • Dae-Young KimJoung-Min Oh
    • H01L21/00
    • H01L21/6836H01L23/544H01L24/83H01L2221/68327H01L2223/54406H01L2223/54466H01L2224/83801H01L2924/14H01L2924/00
    • A die attaching method for attaching semiconductor dies on wafers, each wafer having a first center point and a first radius may include expanding a wafer carrier tape so that the wafer has a second center point and a second radius, measuring the second center point and second radius of the wafer, adding the difference between the first radius and the second radius to a first coordinate value of a first die to calculate a second coordinate value of the first die, and picking up and attaching the semiconductor dies consecutively from the first die. Calculating the second coordinate value of the first die may include compensating the first center point of the wafer based on the second center point of the wafer to calculate the positional coordinate of the semiconductor dies including the first die.
    • 一种用于将半导体管芯附着在晶片上的管芯安装方法,具有第一中心点和第一半径的每个晶片可以包括扩大晶片载带,使得晶片具有第二中心点和第二半径,测量第二中心点和第二半径 将第一半径和第二半径之间的差加至第一模具的第一坐标值,以计算第一模具的第二坐标值,并从第一模具连续拾取并附接半导体模具。 计算第一管芯的第二坐标值可以包括基于晶片的第二中心点补偿晶片的第一中心点,以计算包括第一管芯的半导体管芯的位置坐标。
    • 84. 发明申请
    • METHOD FOR FORMING THE GATE OF A TRANSISTOR
    • 形成晶体管栅极的方法
    • US20080157132A1
    • 2008-07-03
    • US11953571
    • 2007-12-10
    • Dae-Young Kim
    • Dae-Young Kim
    • H01L21/336H01L29/78
    • H01L21/3086H01L21/306H01L29/1037H01L29/4236H01L29/66613
    • A method of forming a gate of a transistor can include forming a nitride film over a semiconductor substrate; forming a photoresist pattern defining a gate channel region of a transistor over the nitride film; forming a nitride pattern by etching the nitride film using the photoresist pattern as a mask; removing the photoresist pattern; forming an oxide film over the semiconductor substrate using a thermal oxidation process; removing the nitride pattern to expose a portion of the surface of the semiconductor substrate corresponding to the removed nitride pattern; and then forming a recessed pattern corresponding to the gate channel region in the exposed semiconductor substrate.
    • 形成晶体管的栅极的方法可以包括在半导体衬底上形成氮化物膜; 形成限定所述氮化物膜上的晶体管的栅极沟道区的光致抗蚀剂图案; 通过使用光致抗蚀剂图案作为掩模蚀刻氮化物膜来形成氮化物图案; 去除光致抗蚀剂图案; 使用热氧化工艺在半导体衬底上形成氧化膜; 去除氮化物图案以暴露对应于去除的氮化物图案的半导体衬底的表面的一部分; 然后在暴露的半导体衬底中形成对应于栅极沟道区的凹陷图案。