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81. 发明申请

US20140010968A1 FLAME SPRAYED BULK SOLIDIFYING AMORPHOUS ALLOY CLADDING LAYER 审中-公开
标题翻译：火焰喷涂块固溶非晶合金层压层
公开(公告)号：US20140010968A1
公开(公告)日：2014-01-09
申请号：US13541693
申请日：2012-07-04
申请人： Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole , Lucy E. Browning
发明人： Christopher D. Prest , Matthew S. Scott , Stephen P. Zadesky , Dermot J. Stratton , Joseph C. Poole , Lucy E. Browning
IPC分类号： C23C4/08 , C23C4/02
CPC分类号： C23C4/02 , C23C4/08
摘要： Disclosed is a method of coating a substrate with a bulk-solidifying amorphous alloy using a thermal spraying technique to provide a coating that is substantially amorphous. Some embodiments include using a substrate having a thickness greater than the critical casting thickness of the bulk-solidifying amorphous alloy, and using a brazing material to assist in adhering the coating to the surface.
摘要翻译：公开了一种使用热喷涂技术用本体固化非晶合金涂覆基材以提供基本无定形的涂层的方法。一些实施方案包括使用厚度大于本体固化非晶合金的临界铸造厚度的基材，并且使用钎焊材料来辅助将涂层粘附到表面。

82. 发明授权

US08568184B2 Display modules 有权
标题翻译：显示模块
公开(公告)号：US08568184B2
公开(公告)日：2013-10-29
申请号：US12608928
申请日：2009-10-29
申请人： Christopher D. Prest , Stephen P. Zadesky , David A. Pakula
发明人： Christopher D. Prest , Stephen P. Zadesky , David A. Pakula
IPC分类号： H01J9/26
CPC分类号： H01L51/5237 , H01L51/5243 , H01L51/5246
摘要： An electronic device may have a display. The display may have active components such as display pixels formed on a display substrate layer. The display substrate layer may be formed from a glass substrate layer. Thin-film transistors and other components for the display pixels may be formed on the glass substrate. An encapsulation glass layer may be bonded to the glass substrate using a ring-shaped bond structure. The ring-shaped bond structure may extend around the periphery of the encapsulation glass layer and the substrate glass layer. The bond structure may be formed from a glass frit, a solid glass ring, integral raised glass portions of the glass layers, meltable metal alloys, or other bond materials. Chemical and physical processing operations may be used to temper the glass layers, to perform annealing operations, to preheat the glass layers, and to promote adhesion.
摘要翻译：电子设备可以具有显示器。显示器可以具有诸如形成在显示基板层上的显示像素的有源部件。显示基板层可以由玻璃基板层形成。可以在玻璃基板上形成用于显示像素的薄膜晶体管和其它部件。可以使用环形粘结结构将包封玻璃层结合到玻璃基板。环形结合结构可以围绕封装玻璃层和基板玻璃层的周边延伸。粘结结构可以由玻璃料，固体玻璃环，玻璃层的一体凸起玻璃部分，可熔融金属合金或其它粘结材料形成。可以使用化学和物理加工操作来回火玻璃层，进行退火操作，以预热玻璃层并促进粘附。

83. 发明授权

US08485245B1 Bulk amorphous alloy sheet forming processes 有权
标题翻译：块状非晶合金薄片成型工艺
公开(公告)号：US08485245B1
公开(公告)日：2013-07-16
申请号：US13473362
申请日：2012-05-16
申请人： Christopher D. Prest , Joseph C. Poole , Joseph Stevick , Theodore Andrew Waniuk , Quoc Tran Pham
发明人： Christopher D. Prest , Joseph C. Poole , Joseph Stevick , Theodore Andrew Waniuk , Quoc Tran Pham
IPC分类号： B22D11/06 , B22D11/01
CPC分类号： B22D11/06 , B22D11/01 , B22D11/0631 , B22D25/06
摘要： Embodiments herein relate to a method for forming a bulk solidifying amorphous alloy sheets have different surface finish including a “fire” polish surface like that of a float glass. In one embodiment, a first molten metal alloy is poured on a second molten metal of higher density in a float chamber to form a sheet of the first molten that floats on the second molten metal and cooled to form a bulk solidifying amorphous alloy sheet. In another embodiment, a molten metal is poured on a conveyor conveying the sheet of the first molten metal on a conveyor and cooled to form a bulk solidifying amorphous alloy sheet. The cooling rate such that a time-temperature profile during the cooling does not traverse through a region bounding a crystalline region of the metal alloy in a time-temperature-transformation (TTT) diagram.
摘要翻译：本文的实施方案涉及用于形成大块固化非晶合金薄片的方法具有不同的表面光洁度，包括像浮法玻璃的“火”抛光表面。在一个实施例中，将第一熔融金属合金浇注在浮法室中的较高密度的第二熔融金属上，以形成浮在第二熔融金属上的第一熔融物片，并冷却以形成大量固化的非晶态合金板。在另一个实施例中，将熔融金属倒在输送机上的第一熔融金属片上的输送机上，并将其冷却以形成大量固化的非晶态合金板。冷却速度使得冷却期间的时间 - 温度分布在时间 - 温度变换（TTT）图中不穿过包围金属合金的结晶区域的区域。

84. 发明申请

US20130083500A1 INTERFEROMETRIC COLOR MARKING 审中-公开
标题翻译：干涉色彩标记
公开(公告)号：US20130083500A1
公开(公告)日：2013-04-04
申请号：US13250660
申请日：2011-09-30
申请人： Christopher D. Prest , Dermot J. Stratton , Joseph C. Poole , Matthew S. Scott , Michael S. Nashner
发明人： Christopher D. Prest , Dermot J. Stratton , Joseph C. Poole , Matthew S. Scott , Michael S. Nashner
IPC分类号： H05K5/00 , B32B3/00 , B29B13/08
CPC分类号： B41M5/262 , Y10T428/24802
摘要： Techniques or processes for providing markings on products are disclosed. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, a housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface so as to be visible from the outside of the housing. The markings are able to be interferometric colors and/or black.
摘要翻译：公开了在产品上提供标记的技术或工艺。在一个实施例中，产品具有外壳，并且标记将设置在外壳上。例如，用于特定产品的壳体可以包括外部壳体表面，并且标记可以设置在外部壳体表面上，以便从壳体的外部可见。标记能够是干涉色和/或黑色。

85. 发明授权

US08333618B2 Audio plug with core structural member 有权
标题翻译：带核心结构件的音频插头
公开(公告)号：US08333618B2
公开(公告)日：2012-12-18
申请号：US13048390
申请日：2011-03-15
申请人： Christopher D. Prest , Matthew Rohrbach
发明人： Christopher D. Prest , Matthew Rohrbach
IPC分类号： H01R24/04
CPC分类号： H01R24/58 , H01R12/59 , H01R13/035 , H01R2107/00
摘要： Plugs with core structural members and methods for manufacturing plugs with core structural members are provided. A plug can include a core structural member that may increase the structural integrity of the plug. The plug can further include contact pads and traces, and each trace can electrically couple with one of the contact pads and extend along a plug axis towards the proximal end (e.g., base section) of the plug. In orientation-specific embodiments, the traces may be disposed on the surface of the plug. However, in other embodiments, the traces may be disposed below but near the surface of the plug. The plug may also include one or more insulating layers to prevent contact pads and traces from shorting.
摘要翻译：提供具有芯结构件的插头和用于制造具有芯结构构件的插头的方法。插头可以包括可以增加插头的结构完整性的芯结构构件。插头还可以包括接触焊盘和迹线，并且每个迹线可以与接触焊盘中的一个电耦合，并且沿着插头轴线朝向插头的近端（例如，基部）延伸。在取向特定实施例中，迹线可以设置在插头的表面上。然而，在其他实施例中，迹线可以设置在插头的表面下方但靠近插头的表面。插头还可以包括一个或多个绝缘层，以防止接触垫和迹线短路。

86. 发明授权

US08159777B2 Portable electronic device with multipurpose hard drive circuit board 有权
标题翻译：便携式电子设备，配有多功能硬盘驱动器电路板
公开(公告)号：US08159777B2
公开(公告)日：2012-04-17
申请号：US12360815
申请日：2009-01-27
申请人： Stephen P. Zadesky , Christopher D. Prest , Stephen Brian Lynch
发明人： Stephen P. Zadesky , Christopher D. Prest , Stephen Brian Lynch
IPC分类号： G11B5/012
CPC分类号： G06F1/1658 , G06F1/1626 , G06F1/187 , H05K1/181 , H05K3/4691
摘要： A hard drive for a portable electronic device is provided that contains a multipurpose circuit board. The multipurpose circuit board may be mounted within a hard drive housing. System components and hard drive controller components may be mounted to the multipurpose circuit board. The multipurpose circuit board may be formed from a rigid flex structure or other structure that is able to accommodate translation of the multipurpose circuit board relative to the remainder of the portable electronic device in the event of an impact event. Components may be mounted to the multipurpose board in accordance with their heights. The portable electronic device may include components such as a battery, display, buttons, and other input-output devices that are connected to the multipurpose circuit board via flex circuit portions of a rigid flex or other electrical paths.
摘要翻译：提供了一种用于便携式电子设备的硬盘驱动器，其包含多用途电路板。多功能电路板可以安装在硬盘驱动器外壳内。系统组件和硬盘驱动器控制器组件可以安装到多用途电路板。多用途电路板可以由刚性柔性结构或其他结构形成，其能够在碰撞事件的情况下容纳多用途电路板相对于便携式电子设备的其余部分的平移。组件可以根据其高度安装到多用途板。便携式电子设备可以包括诸如电池，显示器，按钮和其它输入 - 输出设备的组件，其通过刚性柔性或其他电路径的柔性电路部分连接到多用途电路板。

87. 发明申请

US20110223812A1 AUDIO PLUG WITH CORE STRUCTURAL MEMBER 有权
标题翻译：音频插头与核心结构成员
公开(公告)号：US20110223812A1
公开(公告)日：2011-09-15
申请号：US13048390
申请日：2011-03-15
申请人： Christopher D. Prest , Matthew Rohrbach
发明人： Christopher D. Prest , Matthew Rohrbach
IPC分类号： H01R24/58
CPC分类号： H01R24/58 , H01R12/59 , H01R13/035 , H01R2107/00
摘要： Plugs with core structural members and methods for manufacturing plugs with core structural members are provided. A plug can include a core structural member that may increase the structural integrity of the plug. The plug can further include contact pads and traces, and each trace can electrically couple with one of the contact pads and extend along a plug axis towards the proximal end (e.g., base section) of the plug. In orientation-specific embodiments, the traces may be disposed on the surface of the plug. However, in other embodiments, the traces may be disposed below but near the surface of the plug. The plug may also include one or more insulating layers to prevent contact pads and traces from shorting.
摘要翻译：提供具有芯结构件的插头和用于制造具有芯结构构件的插头的方法。插头可以包括可以增加插头的结构完整性的芯结构构件。插头还可以包括接触焊盘和迹线，并且每个迹线可以与接触焊盘中的一个电耦合，并且沿着插头轴线朝向插头的近端（例如，基部）延伸。在取向特定实施例中，迹线可以设置在插头的表面上。然而，在其他实施例中，迹线可以设置在插头的表面下方但靠近插头的表面。插头还可以包括一个或多个绝缘层，以防止接触垫和迹线短路。

88. 发明申请

US20090316351A1 PORTABLE ELECTRONIC DEVICE WITH MULTIPURPOSE HARD DRIVE CIRCUIT BOARD 有权
标题翻译：具有多用途硬盘驱动电路板的便携式电子设备
公开(公告)号：US20090316351A1
公开(公告)日：2009-12-24
申请号：US12360815
申请日：2009-01-27
申请人： Stephen P. Zadesky , Christopher D. Prest , Stephen Brian Lynch
发明人： Stephen P. Zadesky , Christopher D. Prest , Stephen Brian Lynch
IPC分类号： H05K7/00
CPC分类号： G06F1/1658 , G06F1/1626 , G06F1/187 , H05K1/181 , H05K3/4691
摘要： A hard drive for a portable electronic device is provided that contains a multipurpose circuit board. The multipurpose circuit board may be mounted within a hard drive housing. System components and hard drive controller components may be mounted to the multipurpose circuit board. The multipurpose circuit board may be formed from a rigid flex structure or other structure that is able to accommodate translation of the multipurpose circuit board relative to the remainder of the portable electronic device in the event of an impact event. Components may be mounted to the multipurpose board in accordance with their heights. The portable electronic device may include components such as a battery, display, buttons, and other input-output devices that are connected to the multipurpose circuit board via flex circuit portions of a rigid flex or other electrical paths.
摘要翻译：提供了一种用于便携式电子设备的硬盘驱动器，其包含多用途电路板。多功能电路板可以安装在硬盘驱动器外壳内。系统组件和硬盘驱动器控制器组件可以安装到多用途电路板。多用途电路板可以由刚性柔性结构或其他结构形成，其能够在碰撞事件的情况下容纳多用途电路板相对于便携式电子设备的其余部分的平移。组件可以根据其高度安装到多用途板。便携式电子设备可以包括诸如电池，显示器，按钮和其它输入 - 输出设备的组件，其通过刚性柔性或其他电路径的柔性电路部分连接到多用途电路板。

89. 发明申请

US20080166001A1 Headset with microphone and connector co-location 有权
标题翻译：耳机与麦克风和连接器共同位置
公开(公告)号：US20080166001A1
公开(公告)日：2008-07-10
申请号：US11823922
申请日：2007-06-28
申请人： M. Evans Hankey , Emery Sanford , Christopher D. Prest
发明人： M. Evans Hankey , Emery Sanford , Christopher D. Prest
IPC分类号： H04R1/10
CPC分类号： H04R1/1058 , H04M1/05 , H04R1/083 , H04R1/1016 , H04R1/1041 , H04R1/1066 , H04R1/1075 , H04R31/006 , H04R2201/107 , H04R2420/07 , Y02D70/10
摘要： An electronic device is provided that includes a housing and a connector assembly coupled to the housing. The connector assembly can include a microphone port. The electronic device can further include a microphone mounted within the housing and a channel that fluidically couples the microphone to the microphone port. A joint connector and microphone assembly is also provided. The assembly can include a microphone with a top surface and side surfaces. The top surface of the microphone can include a microphone input. The assembly can include a microphone boot mounted to the microphone such that the boot interfaces with a portion of the top surface and the side surfaces to form a seal around the microphone input. The microphone boot can include a connector sealing portion and an aperture for fluidically coupling the microphone input to a microphone port. The assembly can include a connector plate mounted to the connector sealing portion.
摘要翻译：提供了一种电子设备，其包括壳体和联接到壳体的连接器组件。连接器组件可以包括麦克风端口。电子设备还可以包括安装在壳体内的麦克风和将麦克风流体耦合到麦克风端口的通道。还提供了一个接头连接器和麦克风组件。组件可以包括具有顶表面和侧表面的麦克风。麦克风的顶面可以包括麦克风输入。组件可以包括安装到麦克风的麦克风套筒，使得靴子与顶表面和侧表面的一部分接合以形成麦克风输入周围的密封。麦克风引导件可以包括连接器密封部分和用于将麦克风输入端与麦克风端口流体耦合的孔。组件可以包括安装到连接器密封部分的连接板。

90. 发明申请

US20080165982A1 Headset connector 有权
标题翻译：耳机连接器
公开(公告)号：US20080165982A1
公开(公告)日：2008-07-10
申请号：US11824444
申请日：2007-06-28
申请人： M. Evans Hankey , Emery A. Sanford , Christopher D. Prest , Way Chet Lim
发明人： M. Evans Hankey , Emery A. Sanford , Christopher D. Prest , Way Chet Lim
IPC分类号： H04R1/10
CPC分类号： H04R1/1025 , B21C23/18 , B29C47/0023 , B29C47/0038 , H01R13/6205 , H02J7/0029 , H02J7/0042 , H02J50/10 , H04M1/05 , H04M1/6058 , H04R1/1016 , H04R1/1041 , H04R5/033 , H04R29/008 , H04R2201/107 , H04R2225/33 , H04R2225/51 , H04R2420/09 , Y02D70/10 , Y10T307/414 , Y10T307/826
摘要： Headset assemblies and headset connectors are provided. Headset connectors can include a magnetic mating face and a plurality of electrical contacts disposed within the mating face. Engaging assemblies and engaging connectors are also provided. The engaging connectors can include a housing having a mating side, a magnetic array structure, and a plurality of spring biased contact members. The magnetic array structure can be fixed within the housing and house a plurality of spring biased contact members. The spring biased contact members can include tips that extend out of the mating side. The tips can electrically couple with electrical contacts in a headset connector.
摘要翻译：提供耳机组件和耳机连接器。耳机连接器可以包括磁配合面和布置在配合面内的多个电触头。还提供接合组件和接合连接器。接合连接器可以包括具有配合侧的壳体，磁性阵列结构以及多个弹簧偏置接触构件。磁性阵列结构可以固定在壳体内并容纳多个弹簧偏置的接触构件。弹簧偏置的接触构件可以包括延伸出配合侧的尖端。尖端可以与耳机连接器中的电触点电耦合。

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