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81. 发明授权

US08493738B2 Cooled electronic system with thermal spreaders coupling electronics cards to cold rails 失效
标题翻译：冷却电子系统，散热器将电子卡耦合到冷轨
公开(公告)号：US08493738B2
公开(公告)日：2013-07-23
申请号：US13102211
申请日：2011-05-06
申请人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
发明人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781 , H05K7/2079
摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
摘要翻译：提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。闩锁有助于将卡固定在插座内或从插座中取出卡。液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。

82. 发明授权

US08322029B2 Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof 失效
标题翻译：导热复合材料界面，使用其的冷却电子组件及其制造方法
公开(公告)号：US08322029B2
公开(公告)日：2012-12-04
申请号：US13087678
申请日：2011-04-15
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Keith F. Fogel , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Keith F. Fogel , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K3/20 , F28F7/00
CPC分类号： H01L23/3677 , H01L2224/78301 , Y10T29/49128 , Y10T29/4935 , H01L2924/00014
摘要： A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to he cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.
摘要翻译：提供了复合界面和制造方法，用于将冷却组件连接到电子设备。界面包括由具有第一导热性的第一材料形成的多个导热丝，以及至少部分地围绕线的热界面材料。将冷却组件与待冷却的电子设备的表面热接合的界面材料是具有第二导热性的第二材料，其中第一热导率大于第二导热系数。至少一些线部分地位于较高热通量的第一区域上，并且部分地延伸在较低热通量的第二区域上，其中第一和第二区域是要冷却的表面的不同区域。这些电线作为热扩散器起促进从待冷却表面到冷却组件的热传递。

83. 发明申请

US20120254400A1 SYSTEM TO IMPROVE OPERATION OF A DATA CENTER WITH HETEROGENEOUS COMPUTING CLOUDS 有权
标题翻译：改进具有异质计算云的数据中心的操作的系统
公开(公告)号：US20120254400A1
公开(公告)日：2012-10-04
申请号：US13077578
申请日：2011-03-31
申请人： Madhusudan K. Iyengar , Vinod Kamath , Eren Kursun , Roger R. Schmidt
发明人： Madhusudan K. Iyengar , Vinod Kamath , Eren Kursun , Roger R. Schmidt
IPC分类号： G06F15/173
CPC分类号： G06F9/5094 , Y02D10/22
摘要： A system to improve operation of a data center with heterogeneous computing clouds may include monitoring components to track data center climate controls and individual heterogeneous computing clouds' operating parameters within the data center. The system may also include a controller that regulates the individual heterogeneous computing clouds and data center climate controls based upon data generated by the monitoring components to improve the operating performance of the individual heterogeneous computing clouds as well as the operating performance of the data center. The system may further include spilling computing clouds to receive excess workload of an individual heterogeneous computing cloud without violating individual heterogeneous computing clouds contracts.
摘要翻译：改进具有异构计算云的数据中心运行的系统可能包括监视组件以跟踪数据中心气候控制和数据中心内的个别异构计算云运行参数。该系统还可以包括控制器，其基于由监视组件生成的数据来调节各个异构计算云和数据中心气候控制，以改善各个异构计算云的操作性能以及数据中心的操作性能。该系统可以进一步包括溢出计算云以接收单个异构计算云的额外的工作量，而不违反个别的异构计算云合同。

84. 发明授权

US08230906B2 Dual-chamber fluid pump for a multi-fluid electronics cooling system and method 有权
标题翻译：双腔流体泵用于多流体电子冷却系统和方法
公开(公告)号：US08230906B2
公开(公告)日：2012-07-31
申请号：US12850104
申请日：2010-08-04
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F28D15/00 , H05K7/20
CPC分类号： H05K7/20218
摘要： A dual-chamber fluid pump is provided for a multi-fluid electronics cooling system and method. The pump has a first fluid path for pumping a first fluid coolant and a second fluid path for pumping a second fluid coolant, with the first fluid path including a first pumping chamber and the second fluid path including a second pumping chamber. The first and second pumping chambers are separated by at least one diaphragm, and an actuator is coupled to the diaphragm for transitioning the diaphragm between a first position and a second position. Transitioning of the diaphragm to the first position pumps first fluid coolant from the first pumping chamber while concurrently drawing second fluid coolant into the second pumping chamber, and transitioning of the diaphragm to the second position pumps second fluid coolant from the second pumping chamber while concurrently drawing first fluid coolant into the first pumping chamber.
摘要翻译：为多流体电子冷却系统和方法提供双室流体泵。泵具有用于泵送第一流体冷却剂的第一流体路径和用于泵送第二流体冷却剂的第二流体路径，其中第一流体路径包括第一泵送室，第二流体路径包括第二泵送室。第一和第二泵送室由至少一个隔膜隔开，并且致动器联接到隔膜，用于在第一位置和第二位置之间转换隔膜。将隔膜转换到第一位置将第一流体冷却剂从第一泵送室抽出，同时将第二流体冷却剂拉入第二泵送室，并且将膜片转移到第二位置，从第二泵送室泵送第二流体冷却剂，同时拉伸第一流体冷却剂进入第一泵送室。

85. 发明申请

US20110279967A1 Techniques for Data Center Cooling 失效
标题翻译：数据中心冷却技术
公开(公告)号：US20110279967A1
公开(公告)日：2011-11-17
申请号：US13189515
申请日：2011-07-24
申请人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
发明人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
IPC分类号： H05K7/20
CPC分类号： H05K7/20754 , H05K7/20736 , H05K7/20745
摘要： Techniques for cooling in a data center are provided. In one aspect, a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets; and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
摘要翻译：提供了数据中心冷却技术。在一个方面，提供了包括一个或多个空气入口的计算机设备机架; 一个或多个排气口; 以及一个或多个：安装到围绕至少一部分空气入口的计算机设备机架的进气管道，空气入口管道具有近似于计算机设备机架的横向尺寸的横向尺寸和较小的长度比计算机设备机架的长度以及安装到围绕至少一部分排气出口的计算机设备机架的排气管道，排气管道具有接近计算机设备机架的横向尺寸的横向尺寸和长度小于计算机设备机架的长度。

86. 发明授权

US08051897B2 Redundant assembly for a liquid and air cooled module 有权
标题翻译：液体和空气冷却模块的冗余组件
公开(公告)号：US08051897B2
公开(公告)日：2011-11-08
申请号：US11290899
申请日：2005-11-30
申请人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F28F7/00 , H05K7/20 , H05K5/00
CPC分类号： H05K7/20772
摘要： A redundant assembly for an air and liquid cooled module is provided. The redundant cooling assembly comprises an air and liquid cooled module having a cold plate in thermal communication with a side attached auxiliary drawer. The auxiliary drawer houses a heat exchanger, a liquid pump with piping such that the heat exchanger, the liquid pump with piping and the cold plate form a closed liquid cooling loop. The auxillary drawer also housing an air moving device such that air can readily pass through the air moving device and the heat exchanger in order to provide air cooling. In one embodiment of the invention, fins are disposed on the cold plate to provide cooling in case the pump or the air moving device or both encounter a failure. In alternate embodiments, multiple pumps and/or multiple air moving devices can be used with or without the cold plate fins to provide redundancies.
摘要翻译：提供了一种用于空气和液体冷却模块的冗余组件。冗余冷却组件包括空气和液体冷却模块，其具有与附接辅助抽屉热连通的冷板。辅助抽屉装有一个热交换器，一个带有管道的液体泵，使得热交换器，带管道的液体泵和冷板形成一个封闭的液体冷却回路。辅助抽屉还容纳空气移动装置，使得空气可以容易地通过空气移动装置和热交换器以提供空气冷却。在本发明的一个实施例中，在泵或空气移动装置或两者都遇到故障的情况下，翅片设置在冷板上以提供冷却。在替代实施例中，多个泵和/或多个空气移动装置可以使用或不使用冷板翅片来提供冗余。

87. 发明授权

US08038343B2 Apparatus for thermal characterization under non-uniform heat load 有权
标题翻译：非均匀热负荷下热表征的装置
公开(公告)号：US08038343B2
公开(公告)日：2011-10-18
申请号：US12048635
申请日：2008-03-14
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
IPC分类号： G01K3/00
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A novel computer program product and method for thermally characterizing a device used for cooling an electronic device is disclosed. A cooling device, being operated, is thermally coupled to a heat pipe having a surface to receive a test chip. A heater is patterned on a circuitry side of the test chip. The heater is separate from operational circuitry of the test chip. A localized heat source is applied to at least one region on a test chip thermally coupled to the heat pipe to locally heat more than one region on a second surface of the test chip to test more than one hot spot. The second surface is the circuitry side of the test chip. The heater provides a bias heat to the test chip, independent of operating the test chip, while the localized heat source is selectively applied directly to the test chip. A temperature detector is used to measure a temperature distribution on the second surface of the test chip. The temperature distribution is used to thermally characterize said cooling device during operation.
摘要翻译：公开了一种用于热表征用于冷却电子设备的设备的新颖的计算机程序产品和方法。被操作的冷却装置热耦合到具有接收测试芯片的表面的热管。加热器在测试芯片的电路侧进行图案化。加热器与测试芯片的操作电路分开。将局部热源施加到热耦合到热管的测试芯片上的至少一个区域，以局部加热测试芯片的第二表面上的多于一个区域，以测试多于一个热点。第二个表面是测试芯片的电路侧。加热器对测试芯片提供偏置热量，与操作测试芯片无关，同时局部热源被选择性地直接应用于测试芯片。温度检测器用于测量测试芯片第二表面上的温度分布。温度分布用于在操作期间热定形所述冷却装置。

88. 发明授权

US08009430B2 Techniques for data center cooling 有权
标题翻译：数据中心冷却技术
公开(公告)号：US08009430B2
公开(公告)日：2011-08-30
申请号：US11750322
申请日：2007-05-17
申请人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
发明人： Alan Claassen , Hendrik F. Hamann , Madhusudan K. Iyengar , James Andrew Lacey , Yves C. Martin , Roger R. Schmidt , Theodore Gerard van Kessel
IPC分类号： H05K7/20 , H05K5/00 , A47B81/00
CPC分类号： H05K7/20754 , H05K7/20736 , H05K7/20745
摘要： Techniques for cooling in a data center are provided. In one aspect a computer equipment rack is provided comprising one or more air inlets; one or more exhaust outlets, and one or more of: an air inlet duct mounted to the computer equipment rack surrounding at least a portion of the air inlets, the air inlet duct having a lateral dimension that approximates a lateral dimension of the computer equipment rack and a length that is less than a length of the computer equipment rack, and an air exhaust duct mounted to the computer equipment rack surrounding at least a portion of the exhaust outlets, the air exhaust duct having a lateral dimension that approximates the lateral dimension of the computer equipment rack and a length that is less than the length of the computer equipment rack.
摘要翻译：提供了数据中心冷却技术。在一个方面，提供了包括一个或多个空气入口的计算机设备机架; 一个或多个排气口，以及一个或多个：安装到计算机设备机架上的空气入口管道，其围绕空气入口的至少一部分，空气入口管道具有近似于计算机设备机架的横向尺寸的横向尺寸并且长度小于计算机设备机架的长度，以及安装在围绕至少一部分排气出口的计算机设备机架上的排气管，排气管具有接近侧向尺寸的横向尺寸计算机设备机架的长度小于计算机设备机架的长度。

89. 发明申请

US20110056675A1 APPARATUS AND METHOD FOR ADJUSTING COOLANT FLOW RESISTANCE THROUGH LIQUID-COOLED ELECTRONICS RACK(S) 审中-公开
标题翻译：通过液体冷却电子架（S）调节冷却剂流动阻力的装置和方法
公开(公告)号：US20110056675A1
公开(公告)日：2011-03-10
申请号：US12556040
申请日：2009-09-09
申请人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, JR.
发明人： Wayne A. Barringer , David P. Graybill , Madhusudan K. Iyengar , Roger R. Schmidt , James J. Steffes , Gerard V. Weber, JR.
IPC分类号： G05D23/00 , F28F13/00
CPC分类号： H05K7/20709 , H05K7/20272 , H05K7/20281 , H05K7/20736 , H05K7/20763 , H05K7/2079
摘要： Apparatuses and methods are presented for adjusting coolant flow resistance through one or more liquid-cooled electronics racks. Flow restrictors are employed in association with multiple heat exchange tube sections of a heat exchange assembly, or in association with a plurality of coolant supply lines or coolant return lines feeding multiple heat exchange assemblies. Flow restrictors associated with respective heat exchange tube sections (or respective heat exchange assemblies) are disposed at the coolant channel inlet or coolant channel outlet of the tube sections (or of the heat exchange assemblies). These flow restrictors tailor coolant flow resistance through the heat exchange tube sections or through the heat exchange assemblies to enhance overall heat transfer within the tube sections or across heat exchange assemblies by tailoring coolant flow. In one embodiment, the flow restrictors tailor a coolant flow distribution differential across multiple heat exchange tube sections or across multiple heat exchange assemblies.
摘要翻译：提出了通过一个或多个液冷电子机架来调节冷却剂流动阻力的装置和方法。流量限制器与热交换组件的多个热交换管部分相关联地使用，或者与供给多个热交换组件的多个冷却剂供应管线或冷却剂返回管路相关联地使用。与相应的热交换管部分（或相应的热交换组件）相关联的流量限制器设置在管部分（或热交换组件）的冷却剂通道入口或冷却剂通道出口处。这些流量限制器通过热交换管部分或通过热交换组件来调节冷却剂流动阻力，以通过调整冷却剂流量来增强管部分内部或通过热交换组件的整体热传递。在一个实施例中，流量限制器定制跨越多个热交换管部分或跨多个热交换组件的冷却剂流量分配差。

90. 发明授权

US07739073B2 Method and apparatus for three-dimensional measurements of physical characteristics within a data center 有权
标题翻译：数据中心内物理特性三维测量的方法和装置
公开(公告)号：US07739073B2
公开(公告)日：2010-06-15
申请号：US12110732
申请日：2008-04-28
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Martin P. O'Boyle , Roger R. Schmidt
IPC分类号： G01K1/06 , G06F17/40
CPC分类号： G01K1/026 , G01K2213/00
摘要： An apparatus and method for measuring the physical quantities of a data center during operation and method for servicing large-scale computing systems is disclosed. The apparatus includes a cart that supports a plurality of sensors. The cart is moveable within the data center. The sensors capture temperature or other physical parameters within the room. The sensor readings, along with position and orientation information pertaining to the cart are transmitted to a computer system where the data is analyzed to select the optimum temperature or other system environmental parameters for the data center.
摘要翻译：公开了一种用于在操作期间测量数据中心的物理量的装置和方法以及用于维护大规模计算系统的方法。该装置包括支撑多个传感器的推车。购物车可在数据中心内移动。传感器捕获房间内的温度或其他物理参数。传感器读数以及与推车相关的位置和方向信息被传送到计算机系统，在该系统中分析数据以选择数据中心的最佳温度或其他系统环境参数。

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