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    • 84. 发明申请
    • INTERPOSER HAVING MOLDED LOW CTE DIELECTRIC
    • 具有成型低CTE电介质的插件
    • US20120267751A1
    • 2012-10-25
    • US13091800
    • 2011-04-21
    • Belgacem HabaIlyas Mohammed
    • Belgacem HabaIlyas Mohammed
    • H01L23/482H01L27/02H01L21/28
    • H01L21/486H01L23/49827H01L23/49861H01L23/49894H01L2224/16225H01L2924/09701H01L2924/15311H05K3/4046H05K2201/0979H05K2201/10378H05K2201/10674
    • A method for making an interconnection component is disclosed, including forming a plurality of metal posts extending away from a reference surface. Each post is formed having a pair of opposed end surface and an edge surface extending therebetween. A dielectric layer is formed contacting the edge surfaces and filling spaces between adjacent ones of the posts. The dielectric layer has first and second opposed surfaces adjacent the first and second end surfaces. The dielectric layer has a coefficient of thermal expansion of less than 8 ppm/° C. The interconnection component is completed such that it has no interconnects between the first and second end surfaces of the posts that extend in a lateral direction. First and second pluralities of wettable contacts are adjacent the first and second opposed surfaces. The wettable contacts are usable to bond the interconnection component to a microelectronic element or a circuit panel.
    • 公开了一种用于制造互连部件的方法,包括形成远离参考表面延伸的多个金属柱。 每个柱形成具有一对相对的端面和在它们之间延伸的边缘表面。 形成接触边缘表面和相邻柱之间的填充空间的电介质层。 电介质层具有邻近第一和第二端面的第一和第二相对表面。 电介质层的热膨胀系数小于8ppm /℃。互连部件完成,使得它们在横向方向上延伸的柱的第一和第二端面之间没有互连。 第一和第二多个可湿接触部分邻近第一和第二相对表面。 可湿接触可用于将互连部件连接到微电子元件或电路板。