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81. 发明授权

US08624342B2 Rear-face illuminated solid state image sensors 有权
标题翻译：背面照明固态图像传感器
公开(公告)号：US08624342B2
公开(公告)日：2014-01-07
申请号：US12940326
申请日：2010-11-05
申请人： Giles Humpston , Moshe Kriman
发明人： Giles Humpston , Moshe Kriman
IPC分类号： H01L31/02
CPC分类号： H01L27/14636 , H01L21/76898 , H01L27/14618 , H01L27/14632 , H01L27/14638 , H01L27/1464 , H01L27/14687 , H01L27/14806 , H01L2224/13024
摘要： A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.
摘要翻译：微电子单元包括具有附接有包装层的前表面和远离前表面的后表面的半导体元件。元件包括光检测器，其包括布置成邻近前表面设置的阵列的多个光检测器元件，并布置成通过后表面接收光。半导体元件还包括在连接到光检测器的前表面处的导电接触。导电接触包括薄区域和比薄区域更厚的较厚区域。导电互连件穿过包装层延伸到导电接触件的薄区域，并且导电互连件的一部分在微电子单元的表面处露出。

82. 发明申请

US20130314587A1 Multi-State Electrostatic Actuator and Digital Camera Therewith 审中-公开
标题翻译：多状态静电执行器和数码相机
公开(公告)号：US20130314587A1
公开(公告)日：2013-11-28
申请号：US13984275
申请日：2012-02-06
申请人： Moshe Kriman , Ephraim Goldenberg , Uri Kinrot , Gal Shabtay , Jamil Nasser , Dalit Bahar , Giles Humpston
发明人： Moshe Kriman , Ephraim Goldenberg , Uri Kinrot , Gal Shabtay , Jamil Nasser , Dalit Bahar , Giles Humpston
IPC分类号： H02N1/00 , H04N5/232
CPC分类号： H02N1/006 , H04N5/232
摘要： An actuator that operates by electrostatic attraction and repulsion and can have fixed and moving electrodes is disclosed for one or more embodiments. The fixed and moving electrodes can be inclined relative to each other at an acute angle. The actuator can be radially symmetric and mirrored about the moving electrode. The moving electrode can have a central aperture over which is placed an optical element such as a lens. The optical element can be part of an optical train that permits the focus of an electronic camera to be modified by changing the displacement of the lens along the optical axis of the camera.
摘要翻译：对于一个或多个实施例公开了一种通过静电吸引和排斥操作并且可以具有固定和移动的电极的致动器。固定和移动的电极可以相对于彼此以锐角倾斜。致动器可以围绕移动电极径向对称和镜像。移动电极可以具有中心孔，在其上放置诸如透镜的光学元件。光学元件可以是允许通过改变透镜沿着照相机的光轴的位移来修改电子照相机的焦点的光学系列的一部分。

83. 发明申请

US20130270419A1 Compact Camera Module 有权
标题翻译：小型相机模块
公开(公告)号：US20130270419A1
公开(公告)日：2013-10-17
申请号：US13445857
申请日：2012-04-12
申请人： Harpuneet Singh , Giles Humpston , Ellis Chau , Eddie Azuma , Peter Pietrangelo , Ocie Ward
发明人： Harpuneet Singh , Giles Humpston , Ellis Chau , Eddie Azuma , Peter Pietrangelo , Ocie Ward
IPC分类号： H01L27/146 , H01L31/18
CPC分类号： H01L31/02327 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L2924/0002 , H04N5/2257 , H01L2924/00
摘要： A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.
摘要翻译：通过在保护性覆盖晶片上形成复制的透镜形状并且沉积材料以形成分别设置在其中的复制透镜形状的多个空腔而形成微型相机模块部件。载体晶片在被切割之前被耦合到保护盖晶片。中间晶片连接到保护盖晶片，并移除载体晶片。将图像传感器晶片连接到保护盖晶片，并移除中间晶片。

84. 发明申请

US20130056241A1 EMITTER WIRE WITH LAYERED CROSS-SECTION 审中-公开
标题翻译：发射线与分层交叉部分
公开(公告)号：US20130056241A1
公开(公告)日：2013-03-07
申请号：US13302811
申请日：2011-11-22
申请人： Guilian Gao , Nels Jewell-Larsen , Giles Humpston
发明人： Guilian Gao , Nels Jewell-Larsen , Giles Humpston
IPC分类号： H01B5/00 , F28F13/00 , F04B19/00 , B05D5/12
CPC分类号： B03C3/60 , B03C3/41 , B03C2201/04 , B03C2201/14
摘要： By selecting different materials for each layer, a multi-layered electrode structure can be made with superior performance characteristics. For example, a multilayered electrode can include a high tensile strength tungsten core, a conductive intermediate palladium, palladium-nickel, or other platinum group metal layer for generating a corona discharge, and a hardened layer comprising rhodium or other platinum group metal or alloy of the same to resist frictional abrasion during removal of silica dendrites that accumulate on the electrode surface during operation.
摘要翻译：通过为每层选择不同的材料，可以制造具有优异性能特性的多层电极结构。例如，多层电极可以包括用于产生电晕放电的高拉伸强度钨芯，导电中间体钯，钯 - 镍或其它铂族金属层，以及包含铑或其它铂族金属或其它铂族金属的合金的硬化层同样能够抵抗在操作期间积聚在电极表面上的二氧化硅枝晶的去除期间的摩擦磨损。

85. 发明申请

US20120199857A1 Wafer-Scale Emitter Package Including Thermal Vias 审中-公开
标题翻译：包括散热片的晶圆发射器封装
公开(公告)号：US20120199857A1
公开(公告)日：2012-08-09
申请号：US13500889
申请日：2010-10-07
申请人： Giles Humpston , Moshe Kriman , Marc Himel
发明人： Giles Humpston , Moshe Kriman , Marc Himel
IPC分类号： H01L27/15 , H01L33/64
CPC分类号： H01L33/642 , H01L33/486 , H01L2924/0002 , H01L2924/00
摘要： Improved packages for light emitters may be fabricated at the wafer level. The package can be a single device or an array of die. The package includes a thermal via that extends through the thickness of the package substrate. The thermal via may be made of a material possessing a high thermal conductivity. The thermal via may be wider at the package exterior than at the interior to provide heat spreading between the device and its heat sink. The taper angle of the thermal via may be around 45 degrees to match the natural spread of heat in a solid. The thermal via may extend above the package interior, so its height is sufficient to position an emitter placed thereon at one foci of a parabola, where the vertex of the parabola is at the surface of the package substrate from which the thermal via extends.
摘要翻译：可以在晶片级制造用于发光体的改进的封装。该封装可以是单个器件或一个管芯阵列。该封装包括延伸穿过封装衬底的厚度的热通孔。热通孔可以由具有高导热性的材料制成。热通孔在封装外部比在内部可以更宽，以在器件和其散热器之间提供散热。热通孔的锥角可以是大约45度，以匹配固体中的热量的自然扩散。热通孔可以在封装内部延伸，因此其高度足以将放置在其上的发射器放置在抛物线的一个焦点处，其中抛物线的顶点位于热通孔延伸的封装衬底的表面处。

86. 发明申请

US20110273600A1 Optical Imaging Apparatus And Methods Of Making The Same 审中-公开
标题翻译：光学成像设备及其制作方法
公开(公告)号：US20110273600A1
公开(公告)日：2011-11-10
申请号：US13145830
申请日：2010-02-03
申请人： Moshe Kriman , William Hudson Welch , Giles Humpston , Osher Avsian , Felix Hazanovich , Ekaterina Axelrod
发明人： Moshe Kriman , William Hudson Welch , Giles Humpston , Osher Avsian , Felix Hazanovich , Ekaterina Axelrod
IPC分类号： H04N5/335 , H01L31/18
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14683 , H01L2224/05001 , H01L2224/05009 , H01L2224/051 , H01L2224/0557 , H01L2224/056 , H01L2224/13 , H01L2224/13025 , H04N5/2254 , H04N5/2257 , H01L2924/00014
摘要： The present invention provides optical imaging apparatus comprising solid state sensing elements and optical components operable to be manufactured and assembled at the wafer level.
摘要翻译：本发明提供了包括固态感测元件和可操作以在晶片级制造和组装的光学部件的光学成像设备。

87. 发明授权

US07936062B2 Wafer level chip packaging 有权
标题翻译：晶圆级芯片封装
公开(公告)号：US07936062B2
公开(公告)日：2011-05-03
申请号：US11655777
申请日：2007-01-19
申请人： Giles Humpston , Michael J. Nystrom , Vage Oganesian , Yulia Aksenton , Osher Avsian , Robert Burtzlaff , Avi Dayan , Andrey Grinman , Felix Hazanovich , Ilya Hecht , Charles Rosenstein , David Ovrutsky , Mitchell Hayes Reifel
发明人： Giles Humpston , Michael J. Nystrom , Vage Oganesian , Yulia Aksenton , Osher Avsian , Robert Burtzlaff , Avi Dayan , Andrey Grinman , Felix Hazanovich , Ilya Hecht , Charles Rosenstein , David Ovrutsky , Mitchell Hayes Reifel
IPC分类号： H01L23/12
CPC分类号： B81C1/00269 , B81C2203/0118 , H01L21/50 , H01L23/10 , H01L24/48 , H01L24/73 , H01L27/14618 , H01L27/14687 , H01L31/0203 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73265 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/16235 , H01L2924/181 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Packaged microelectronic elements are provided. In an exemplary embodiment, a microelectronic element having a front face and a plurality of peripheral edges bounding the front face has a device region at the front face and a contact region with a plurality of exposed contacts adjacent to at least one of the peripheral edges. The packaged element may include a plurality of support walls overlying the front face of the microelectronic element such that a lid can be mounted to the support walls above the microelectronic element. For example, the lid may have an inner surface confronting the front face. In a particular embodiment, some of the contacts can be exposed beyond edges of the lid.
摘要翻译：提供封装的微电子元件。在一个示例性实施例中，具有前表面和限定前表面的多个周边边缘的微电子元件在前表面具有一个器件区域，以及一个接触区域与多个暴露的接触件相邻，至少一个周边边缘。封装元件可以包括覆盖微电子元件的前表面的多个支撑壁，使得盖可以安装到微电子元件上方的支撑壁上。例如，盖可以具有面向正面的内表面。在一个具体实施例中，一些触点可以暴露在盖的边缘之外。

88. 发明申请

US20100242269A1 COMPACT LENS TURRET ASSEMBLY 审中-公开
标题翻译：紧凑型镜头组合
公开(公告)号：US20100242269A1
公开(公告)日：2010-09-30
申请号：US12813009
申请日：2010-06-10
申请人： Giles Humpston , Kenneth Allen Honer , David B. Tuckerman
发明人： Giles Humpston , Kenneth Allen Honer , David B. Tuckerman
IPC分类号： B08B7/00 , H05K13/00
CPC分类号： H01L27/14618 , G02B7/02 , H01L27/14625 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2924/0002 , H04N5/2253 , H04N5/2254 , H04N5/2257 , Y10T29/49117 , H01L2924/00
摘要： An electronic camera module incorporates a sensor unit (20) having a semiconductor chip (22) such as a CCD imager and a cover (34) overlying the front surface of the chip. An optical unit (50) includes one or more optical elements such as lenses (58). The optical unit has engagement features (64) which abut alignment features on the sensor unit as, for example, portions (44) of the cover outer surface (38), so as to maintain a precise relationship between the optical unit and sensor unit.
摘要翻译：电子照相机模块包括具有诸如CCD成像器的半导体芯片（22）的传感器单元（20）和覆盖在芯片的前表面上的盖（34）。光学单元（50）包括一个或多个光学元件，例如透镜（58）。光学单元具有接合特征（64），其接合传感器单元上的对准特征，例如覆盖外表面（38）的部分（44），以保持光学单元和传感器单元之间的精确关系。

89. 发明授权

US07768574B2 Compact lens turret assembly 有权
标题翻译：紧凑型镜头转塔组件
公开(公告)号：US07768574B2
公开(公告)日：2010-08-03
申请号：US11121434
申请日：2005-05-04
申请人： Giles Humpston
发明人： Giles Humpston
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , G02B7/02 , H01L27/14618 , H01L27/14625 , H01L31/0203 , H01L31/02325 , H01L2924/0002 , H04N5/2253 , H01L2924/00
摘要： An electronic camera module incorporates a sensor unit (20) having a semiconductor chip (22) such as a CCD imager and a cover (34) overlying the front surface of the chip. An optical unit (50) includes one or more optical elements such as lenses (58). The optical unit has engagement features (64) which abut alignment features on the sensor unit as, for example, portions (44) of the cover outer surface (38), so as to maintain a precise relationship between the optical unit and sensor unit.
摘要翻译：电子照相机模块包括具有诸如CCD成像器的半导体芯片（22）的传感器单元（20）和覆盖在芯片的前表面上的盖（34）。光学单元（50）包括一个或多个光学元件，例如透镜（58）。光学单元具有接合特征（64），其接合传感器单元上的对准特征，例如覆盖外表面（38）的部分（44），以保持光学单元和传感器单元之间的精确关系。

90. 发明授权

US07449779B2 Wire bonded wafer level cavity package 有权
标题翻译：接线晶圆级腔体封装
公开(公告)号：US07449779B2
公开(公告)日：2008-11-11
申请号：US11322617
申请日：2005-12-30
申请人： Kenneth Allen Honer , Giles Humpston , David B. Tuckerman , Michael J. Nystrom
发明人： Kenneth Allen Honer , Giles Humpston , David B. Tuckerman , Michael J. Nystrom
IPC分类号： H01L23/48
CPC分类号： B81B7/0006 , B81C1/00269 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01L2224/8592 , H01L2924/01013 , H01L2924/01029 , H01L2924/01079 , H01L2924/10253 , H01L2924/1461 , H01L2924/00014 , H01L2924/00
摘要： A microelectronic device includes a chip having a front surface and a rear surface, the front surface having an active region and a plurality of contacts exposed at the front surface outside of the active region. The device further includes a lid overlying the front surface. The lid has edges bounding the lid, at least one of the edges including one or more outer portions and one or more recesses extending laterally inwardly from the outer portions, with the contacts being aligned with the recesses and exposed through them.
摘要翻译：微电子器件包括具有前表面和后表面的芯片，前表面具有有源区域和暴露在有源区域外部的前表面处的多个触点。该装置还包括盖在前表面上的盖。盖具有边缘边缘，边缘中的至少一个包括一个或多个外部部分和一个或多个从外部部分横向向内延伸的凹部，触头与凹部对准并暴露在其中。

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