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    • 83. 发明申请
    • MEMORY DEVICES AND PROGRAMMING MEMORY ARRAYS THEREOF
    • 存储器件和编程存储器阵列
    • US20140029345A1
    • 2014-01-30
    • US13561637
    • 2012-07-30
    • Akira GodaHaitao LiuKrishna Parat
    • Akira GodaHaitao LiuKrishna Parat
    • G11C16/10
    • G11C16/10G11C16/0483H01L27/11556H01L27/11582
    • An embodiment of a method includes decreasing a difference of a voltage applied to a first select gate minus a voltage applied to a source while the first select gate is off, decreasing a difference of a voltage applied to a second select gate minus a voltage applied to a data line while the second select gate is off, and increasing a voltage of a signal applied to a selected access line that is coupled to an untargeted memory cell in a string of memory cells coupled to the first and second select gates to a program voltage after or substantially concurrently with decreasing the difference of the voltage applied to the first select gate minus the voltage applied to the source and with decreasing the difference of the voltage applied to the second select gate minus the voltage applied to the data line.
    • 一种方法的实施例包括在第一选择栅极截止时减小施加到第一选择栅极的电压减去施加到源极的电压的差异,减小施加到第二选择栅极的电压的差减去施加到 数据线,而第二选择栅极关闭,以及增加施加到所选择的存取线的信号的电压,该选择的存取线耦合到耦合到第一和第二选择栅极的一串存储单元中的非目标存储器单元到编程电压 之后或基本同时地减小施加到第一选择栅极的电压的差减去施加到源极的电压,并且减小施加到第二选择栅极的电压的差减去施加到数据线的电压。
    • 84. 发明授权
    • Methods of operating a memory device having a buried boosting plate
    • 操作具有埋地升压板的存储器件的方法
    • US08634252B2
    • 2014-01-21
    • US13351148
    • 2012-01-16
    • Akira Goda
    • Akira Goda
    • G11C11/34
    • G11C16/10H01L21/84H01L27/11526H01L27/11529H01L27/1203
    • Memory devices are disclosed, such as those that include a semiconductor-on-insulator (SOI) NAND memory array having a boosting plate. The boosting plate may be disposed in an insulator layer of the SOI substrate such that the boosting plate exerts a capacitive coupling effect on a p-well of the memory array. Such a boosting plate may be used to boost the p-well during program and erase operations of the memory array. During a read operation, the boosting plate may be grounded to minimize interaction with p-well. Systems including the memory array and methods of operating the memory array are also disclosed.
    • 公开了存储器件,例如包括具有升压板的绝缘体上半导体(SOI)NAND存储器阵列的存储器件。 升压板可以设置在SOI衬底的绝缘体层中,使得升压板对存储器阵列的p阱施加电容耦合效应。 这种升压板可用于在存储器阵列的编程和擦除操作期间升压p阱。 在读取操作期间,升压板可以接地以最小化与p阱的相互作用。 还公开了包括存储器阵列的系统和操作存储器阵列的方法。