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    • 88. 发明授权
    • Deposition apparatus and method for depositing film
    • 沉积膜及其沉积方法
    • US08679253B2
    • 2014-03-25
    • US11704295
    • 2007-02-09
    • Akira Furuya
    • Akira Furuya
    • C23C16/00C23C16/455C23C16/52
    • C23C16/452C23C16/45525C23C16/45542C23C16/45561C23C16/515
    • An enhanced utilization efficiency of gases can be presented and an improved deposition characteristics are presented, when a film is deposited with a plurality of gases. A deposition apparatus 100 includes: a reaction chamber 102 for depositing a film; a first gas supply line 112 and a second gas supply line 152 for supplying a first source material A and a gas B to a reaction chamber 102, respectively; and an exciting unit 106 that is capable of exciting a gas supplied in the reaction chamber 102 to form a plasma. In the deposition apparatus 100 having such configuration, a deposition operation is performed by: a first operation for supplying a gas derived from a first source material A and a gas B in the reaction chamber 102 to cause the gas derived from a first source material A adsorbed on the substrate, thereby forming a deposition layer; and a second operation for supplying a second gas in reaction chamber 102, and treating the deposition layer with the gas in a condition of being plasma-excited.
    • 当使用多种气体沉积膜时,可以提供气体的提高的利用效率并提出改进的沉积特性。 沉积设备100包括:用于沉积膜的反应室102; 分别将第一源材料A和气体B分别供应到反应室102中的第一气体供应管线112和第二气体供应管线152; 以及激励单元106,其能够激励在反应室102中供应的气体以形成等离子体。 在具有这种结构的沉积设备100中,通过以下步骤进行沉积操作:第一操作,用于将来自第一源材料A和气体B的气体供应到反应室102中,以产生源自第一源材料A的气体 吸附在基板上,从而形成沉积层; 以及用于在反应室102中供应第二气体并在等离子体激发的条件下用气体处理沉积层的第二操作。
    • 90. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US07755191B2
    • 2010-07-13
    • US11723498
    • 2007-03-20
    • Akira Furuya
    • Akira Furuya
    • H01L23/48H01L23/52
    • H01L23/522H01L21/76829H01L21/76831H01L21/76843H01L21/76859H01L21/76873H01L23/53238H01L23/53295H01L2924/0002H01L2924/3011H01L2924/00
    • A semiconductor device includes a first copper-containing conductive film formed on a substrate, insulating films formed on the first copper-containing conductive film with a concave portion reaching the first copper-containing conductive film, a second barrier insulating film formed to cover the side wall of the concave portion of these insulating films, a second adhesive alloy film made of copper and a dissimilar element other than copper, and coming in contact with the first copper-containing conductive film at the bottom surface of the concave portion and in contact with the second barrier insulating film at the side wall of the concave portion to cover the inside wall of the concave portion, and a second copper-containing conductive film containing copper as a main component, and formed on the second adhesive alloy film in contact with the second adhesive alloy film to fill the concave portion.
    • 半导体器件包括:形成在基板上的第一含铜导电膜,形成在第一含铜导电膜上的绝缘膜,具有到达第一含铜导电膜的凹部;第二阻挡绝缘膜,形成为覆盖侧 这些绝缘膜的凹部的壁,由铜构成的第二粘合剂合金膜和铜以外的异种元素,并且与凹部的底面的第一含铜导电膜接触并与 在凹部的侧壁上的第二阻挡绝缘膜覆盖凹部的内壁,以及含有铜作为主要成分的第二含铜导电膜,并形成在与第二粘合合金膜接触的第二粘合合金膜上 第二粘合剂合金膜填充凹部。