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81. 发明授权

US08426934B2 Micro-electro-mechanical system device and method for making same 有权
公开(公告)号：US08426934B2
公开(公告)日：2013-04-23
申请号：US13178121
申请日：2011-07-07
申请人： Sheng Ta Lee , Chuan Wei Wang
发明人： Sheng Ta Lee , Chuan Wei Wang
IPC分类号： H01L29/84
CPC分类号： B81C1/00182 , B81B2201/0257
摘要： According to the present invention, a micro-electro-mechanical system (MEMS) device comprises: a thin film structure including at least a metal layer and a protection layer deposited in any order; and a protrusion connected under the thin film structure. A preferred thin film structure includes at least a lower protection layer, a metal layer and an upper protection layer. The MEMS device for example is a capacitive MEMS acoustical sensor.

82. 发明授权

US08424383B2 Mass for use in a micro-electro-mechanical-system sensor and 3-dimensional micro-electro-mechanical-system sensor using same 有权
标题翻译：用于微机电系统传感器的质量和使用它的三维微机电系统传感器
公开(公告)号：US08424383B2
公开(公告)日：2013-04-23
申请号：US12652108
申请日：2010-01-05
申请人： Chuan-Wei Wang , Sheng-Ta Lee
发明人： Chuan-Wei Wang , Sheng-Ta Lee
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P15/18 , G01P2015/082
摘要： A 3-dimensional MEMS sensor, comprising: a first axis fixed electrode; a second axis fixed electrode; a third axis fixed electrode; a movable electrode frame including a first axis movable electrode, a second axis movable electrode, a third axis movable electrode, and a connection part connecting the movable electrodes, wherein the first axis movable electrode and the first axis fixed electrode form a first capacitor along the first axis, the second axis movable electrode and the second axis fixed electrode form a second capacitor along the second axis, and the third axis movable electrode and the third axis fixed electrode form a third capacitor along the third axis, the connection part including a center mass, wherein the center mass is at least connected with one of the first, second and third axis movable electrodes, and has an outer periphery and a first interconnecting segment connecting at least two adjacent sides of the outer periphery; at least one spring connecting with the movable electrode frame; and at least one anchor connecting with the spring, wherein the first, second and third axes are not parallel to one another such that they define a 3-dimensional coordinate system.
摘要翻译： 3维MEMS传感器，包括：第一轴固定电极; 第二轴固定电极; 第三轴固定电极; 可动电极框架，包括第一轴可动电极，第二轴可动电极，第三轴可动电极和连接可动电极的连接部，其中，所述第一轴可动电极和所述第一轴固定电极沿着所述可动电极形成第一电容器第一轴，第二轴可动电极和第二轴固定电极沿着第二轴形成第二电容器，第三轴可动电极和第三轴固定电极沿着第三轴形成第三电容器，连接部分包括中心其中所述中心质量体至少与所述第一，第二和第三轴可动电极中的一个连接，并且具有外周和连接所述外周的至少两个相邻侧的第一互连段; 与可动电极框架连接的至少一个弹簧; 以及与弹簧连接的至少一个锚固件，其中所述第一，第二和第三轴线彼此不平行，使得它们限定三维坐标系。

83. 发明授权

US08371168B2 In-plane sensor and method for making same 有权
公开(公告)号：US08371168B2
公开(公告)日：2013-02-12
申请号：US13150497
申请日：2011-06-01
申请人： Chuan Wei Wang , Sheng Ta Lee
发明人： Chuan Wei Wang , Sheng Ta Lee
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , B81B2201/0235 , B81C1/00182 , G01P15/0802 , G01P2015/0814
摘要： According to the present invention, an in-plane sensor comprises: a fixed structure including a fixed finger and a fixed column connected to each other, the fixed finger having a supported end supported by the fixed column and a suspended end which is unsupported; and a movable structure including at least one mass body and an extending finger connected to each other; wherein the supported end of the fixed finger is closer to the mass body than the suspended end is.

84. 发明授权

US08178935B2 MEMS chip and package method thereof 有权
标题翻译： MEMS芯片及其封装方法
公开(公告)号：US08178935B2
公开(公告)日：2012-05-15
申请号：US13151361
申请日：2011-06-02
申请人： Chuan-Wei Wang
发明人： Chuan-Wei Wang
IPC分类号： H01L29/84 , H01L23/06
CPC分类号： B81C1/00333 , B81C2203/0714
摘要： The present invention proposes a MEMS chip and a package method thereof. The package method comprises: making a capping wafer by: providing a first substrate and forming an etch stop layer on the first substrate; making a device wafer by: providing a second substrate and forming a MEMS device and a material layer surrounding the MEMS device on the second substrate; bonding the capping wafer and the device wafer; after bonding, etching the first substrate to form at least one via; etching the etch stop layer through the via; etch the material layer; and forming a sealing layer on the first substrate.
摘要翻译：本发明提出一种MEMS芯片及其封装方法。封装方法包括：通过以下步骤制造封盖晶片：提供第一衬底并在第一衬底上形成蚀刻停止层; 通过以下方式制造器件晶片：提供第二衬底并在第二衬底上形成MEMS器件和围绕MEMS器件的材料层; 接合封盖晶片和器件晶片; 在接合之后，蚀刻第一基板以形成至少一个通孔; 通过所述通孔蚀刻所述蚀刻停止层; 蚀刻材料层; 以及在所述第一基板上形成密封层。

85. 发明申请

US20120068940A1 ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备
公开(公告)号：US20120068940A1
公开(公告)日：2012-03-22
申请号：US12885690
申请日：2010-09-20
申请人： Chuan Wei Wang , Cheng Nan Tsai , Chun Yi Lu , Horng Goung Lai , Chih Hung Lu
发明人： Chuan Wei Wang , Cheng Nan Tsai , Chun Yi Lu , Horng Goung Lai , Chih Hung Lu
IPC分类号： G06F3/041
CPC分类号： G06F1/1616 , G06F1/1643 , G06F1/1677 , G06F1/3203 , G06F1/3262
摘要： An electronic device includes a housing, an optical touch module, and a detecting unit. The housing includes a first body and a second body, and an angle is formed between the first body and the second body. The optical touch module executes a positioning function by sensing signals. The detecting unit is configured to the optical touch module, and is used for detecting the angle. When the angle is smaller than a predetermined angle, the detecting unit instructs the optical touch module to pause executing the positioning function, so as to avoid false position determinations by the optical touch module.
摘要翻译：电子设备包括壳体，光学触摸模块和检测单元。壳体包括第一主体和第二主体，并且在第一主体和第二主体之间形成角度。光学触摸模块通过感测信号来执行定位功能。检测单元被配置为光学触摸模块，并用于检测角度。当角度小于预定角度时，检测单元指示光学触摸模块暂停执行定位功能，以避免光学触摸模块的错误位置确定。

86. 发明授权

US08071413B2 Micro-electro-mechanical system (MEMS) sensor and method for making same 有权
标题翻译：微机电系统（MEMS）传感器及其制造方法
公开(公告)号：US08071413B2
公开(公告)日：2011-12-06
申请号：US13080012
申请日：2011-04-05
申请人： Chuan Wei Wang
发明人： Chuan Wei Wang
IPC分类号： H01L21/00
CPC分类号： B81C1/00246 , B81B2201/0235 , B81B2201/0257 , B81C2203/0714
摘要： The present invention discloses an MEMS sensor and a method for making the MEMS sensor. The MEMS sensor according to the present invention includes: a substrate including an opening; a suspended structure located above the opening; and an upper structure, a portion of which is at least partially separated from a portion of the suspended structure; wherein the suspended structure and the upper structure are separated from each other by a step including metal etch.
摘要翻译：本发明公开了一种用于制造MEMS传感器的MEMS传感器和方法。根据本发明的MEMS传感器包括：包括开口的基板; 位于开口上方的悬挂结构; 以及上部结构，其一部分至少部分地与所述悬挂结构的一部分分离; 其中所述悬挂结构和所述上部结构通过包括金属蚀刻的步骤彼此分离。

87. 发明申请

US20110260268A1 Micro-Electro-Mechanical System Device and Method for Making Same 有权
标题翻译：微机电系统装置及其制作方法
公开(公告)号：US20110260268A1
公开(公告)日：2011-10-27
申请号：US13178121
申请日：2011-07-07
申请人： Sheng Ta Lee , Chuan Wei Wang
发明人： Sheng Ta Lee , Chuan Wei Wang
IPC分类号： H01L29/84
CPC分类号： B81C1/00182 , B81B2201/0257
摘要： According to the present invention, a micro-electro-mechanical system (MEMS) device comprises: a thin film structure including at least a metal layer and a protection layer deposited in any order; and a protrusion connected under the thin film structure. A preferred thin film structure includes at least a lower protection layer, a metal layer and an upper protection layer. The MEMS device for example is a capacitive MEMS acoustical sensor.
摘要翻译：根据本发明，微电子机械系统（MEMS）装置包括：薄膜结构，至少包括金属层和以任何顺序沉积的保护层; 以及连接在薄膜结构下方的突起。优选的薄膜结构至少包括下保护层，金属层和上保护层。例如，MEMS器件是电容式MEMS声学传感器。

88. 发明申请

US20110236805A1 MEMS lithography mask with improved tungsten deposition topography and method for the same 有权
标题翻译：具有改进的钨沉积形貌的MEMS光刻掩模及其方法
公开(公告)号：US20110236805A1
公开(公告)日：2011-09-29
申请号：US12802209
申请日：2010-06-02
申请人： Hsin-Hui Hsu , Chuan-Wei Wang , Sheng-Ta Lee , Chih-Hung Lu
发明人： Hsin-Hui Hsu , Chuan-Wei Wang , Sheng-Ta Lee , Chih-Hung Lu
IPC分类号： G03F1/00 , G03F7/20
CPC分类号： G03F1/36 , B81B2207/07 , B81C1/00404 , G02B26/0833
摘要： The present invention discloses a MEMS lithography mask with improved tungsten deposition topography and a method for making the same. The MEMS lithography mask includes: a pattern including at least two sections forming a conjunction with each other, each of the at least two sections having a width not less than a minimum width, the conjunction having a center and a plurality of corners, wherein at least one of the corners is inwardly recessed to reduce a width of the conjunction, the sections being for defining trenches on a substrate to be filled with tungsten as apart of a MEMS device, whereby the lowest height of the tungsten surface is not lower than 80% of the trench height.
摘要翻译：本发明公开了一种具有改善的钨沉积形貌的MEMS光刻掩模及其制造方法。 MEMS光刻掩模包括：包括形成彼此连接的至少两个部分的图案，所述至少两个部分中的每一个具有不小于最小宽度的宽度，所述连接具有中心和多个拐角，其中在至少一个拐角向内凹进以减小连接的宽度，这些部分用于限定衬底上的沟槽，以将钨填充为MEMS器件的分开，由此钨表面的最低高度不低于80 沟槽高度的百分比。

89. 发明申请

US20110108934A1 MICRO-ELECTRO-MECHANICAL-SYSTEM DEVICE WITH PARTICLES BLOCKING FUNCTION AND METHOD FOR MAKING SAME 失效
标题翻译：具有颗粒阻塞功能的微电子机械系统装置及其制造方法
公开(公告)号：US20110108934A1
公开(公告)日：2011-05-12
申请号：US13009270
申请日：2011-01-19
申请人： Chuan Wei Wang , Sheng Ta Lee
发明人： Chuan Wei Wang , Sheng Ta Lee
IPC分类号： H01L29/84 , H01L21/302
CPC分类号： B81B7/0077
摘要： The present invention discloses a MEMS device with particles blocking function, and a method for making the MEMS device. The MEMS device comprises: a substrate on which is formed a MEMS device region; and a particles blocking layer deposited on the substrate.
摘要翻译：本发明公开了一种具有粒子阻挡功能的MEMS器件及其制造方法。 MEMS器件包括：衬底，其上形成有MEMS器件区域; 和沉积在基底上的颗粒阻挡层。

90. 发明申请

US20110024852A1 MEMS DEVICE AND MEMS SPRING ELEMENT 有权
标题翻译： MEMS器件和MEMS弹簧元件
公开(公告)号：US20110024852A1
公开(公告)日：2011-02-03
申请号：US12756305
申请日：2010-04-08
申请人： Chuan-Wei WANG , Sheng-Ta Lee , Hsin-Hui Hsu
发明人： Chuan-Wei WANG , Sheng-Ta Lee , Hsin-Hui Hsu
IPC分类号： H01L29/84
CPC分类号： B81B3/0072 , B81B2201/025 , B81B2203/0118
摘要： A micro electromechanical system (MEMS) spring element is disposed on a substrate, and includes a fixing portion and a moveable portion. The fixing portion is fixed on the substrate, and includes an insulating layer, a plurality of metal-fixing layers and a plurality of supporting-fixing layers. The insulating layer is disposed on the substrate. The metal-fixing layers are disposed above the insulating layer. The supporting-fixing layers are connected between the metal-fixing layers. The moveable portion has a first end and a second end. The first end is connected with the fixing portion, and the second end is suspended above the substrate. The moveable portion includes a plurality of metal layers and at least a supporting layer. The supporting layer is connected between the adjacent metal layers, and a hollow region is formed between the supporting layer and the adjacent metal layers. The deformation of the MEMS spring element generated because of the different thermal expansion may be avoided and the working performance of the MEMS spring element can be improved.
摘要翻译：微机电系统（MEMS）弹簧元件设置在基板上，并且包括固定部分和可移动部分。固定部固定在基板上，具有绝缘层，多个金属固定层和多个支撑固定层。绝缘层设置在基板上。金属固定层设置在绝缘层的上方。支撑固定层连接在金属固定层之间。可移动部分具有第一端和第二端。第一端与固定部分连接，第二端悬挂在基板上。可移动部分包括多个金属层和至少一个支撑层。支撑层连接在相邻的金属层之间，并且在支撑层和相邻金属层之间形成中空区域。可以避免由于不同的热膨胀而产生的MEMS弹簧元件的变形，并且可以提高MEMS弹簧元件的工作性能。

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