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81. 发明授权

US08677023B2 High availability and I/O aggregation for server environments 有权
标题翻译：服务器环境的高可用性和I / O聚合
公开(公告)号：US08677023B2
公开(公告)日：2014-03-18
申请号：US11145698
申请日：2005-06-03
申请人： Vikram Venkataraghavan , Ming Wong , Vipul Jain , Cheng Tang , Shreyas Shah , Jonathan Davar , Mike Dvorkin
发明人： Vikram Venkataraghavan , Ming Wong , Vipul Jain , Cheng Tang , Shreyas Shah , Jonathan Davar , Mike Dvorkin
IPC分类号： G06F15/16
CPC分类号： H04L49/70 , G06F3/0601 , G06F3/0635 , G06F3/0662 , G06F3/0664 , G06F3/067 , G06F11/2005 , G06F13/12 , G06F13/128 , G06F13/4022 , G06F13/42 , G06F13/4221 , G06F2003/0697 , H04L12/4641 , H04L41/04 , H04L49/00 , H04L49/357 , H04L67/1097
摘要： Methods and apparatus are provided for virtualizing port adapter resources such as network interface cards (NICs) used to connect servers to packet based networks. Resources are offloaded from individual servers onto a resource virtualization switch. Servers connected to the resource virtualization switch using an I/O bus connection share access to NICs. Redundancy can be provided using multipathing mechanisms implemented at individual servers or high availability mechanisms implemented at the resource virtualization switch. Switchover can occur between ports on the same port adapter, between ports on separate adapters, or between ports on separate resource virtualization switches.
摘要翻译：提供了用于虚拟化端口适配器资源的方法和装置，例如用于将服务器连接到基于分组的网络的网络接口卡（NIC）。资源从单个服务器卸载到资源虚拟化交换机上。使用I / O总线连接到资源虚拟化交换机的服务器共享对NIC的访问。可以使用在单个服务器上实现的多路径机制或在资源虚拟化交换机上实现的高可用性机制来提供冗余。可以在同一端口适配器上的端口，单独适配器上的端口之间或单独的资源虚拟化交换机上的端口之间进行切换。

82. 发明申请

US20130138836A1 Remote Shared Server Peripherals Over an Ethernet Network For Resource Virtualization 有权
标题翻译：用于资源虚拟化的以太网上的远程共享服务器外围设备
公开(公告)号：US20130138836A1
公开(公告)日：2013-05-30
申请号：US12544744
申请日：2009-08-20
申请人： Ariel Cohen , Ashok Krishnamurthi , Viswanath Krishnamurthy , Frank Salzmann , David S. Allison , Cheng Tang
发明人： Ariel Cohen , Ashok Krishnamurthi , Viswanath Krishnamurthy , Frank Salzmann , David S. Allison , Cheng Tang
IPC分类号： G06F15/16
CPC分类号： H04L49/351
摘要： Provided is a novel approach for connecting servers to peripherals, such as NICs, HBAs, and SAS/SATA controllers. Also provided are methods of arranging peripherals within one or more I/O directors, which are connected to the servers over an Ethernet network. Such arrangement allows sharing the same resource among multiple servers.
摘要翻译：提供了一种将服务器连接到外围设备（如NIC，HBA和SAS / SATA控制器）的新颖方法。还提供了在一个或多个I / O控制器中布置外围设备的方法，其通过以太网网络连接到服务器。这种安排允许在多个服务器之间共享相同的资源。

83. 发明申请

US20120309186A1 CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME 审中-公开
标题翻译：半导体集成电路的导电结构及其形成方法
公开(公告)号：US20120309186A1
公开(公告)日：2012-12-06
申请号：US13568465
申请日：2012-08-07
申请人： J. B. CHYI , Cheng Tang HUANG
发明人： J. B. CHYI , Cheng Tang HUANG
IPC分类号： H01L21/768
CPC分类号： H01L24/11 , H01L24/12 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05572 , H01L2224/05666 , H01L2224/05684 , H01L2224/114 , H01L2224/1147 , H01L2224/1148 , H01L2224/116 , H01L2224/13007 , H01L2224/13144 , H01L2224/1357 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/14 , H01L2924/00014 , H01L2224/13099 , H01L2924/013
摘要： A conductive structure for a semiconductor integrated circuit and method for forming the conductive structure are provided. The semiconductor integrated circuit has a pad and a passivation layer partially covering the pad to define a first opening portion having a first lateral size. The conductive structure electrically connects to the pad via the first opening portion. The conductive structure comprises a support layer defining a second opening portion. A conductor is formed in the second opening portion to serve as a bump having a planar top surface.
摘要翻译：提供了一种用于半导体集成电路的导电结构和用于形成导电结构的方法。半导体集成电路具有焊盘和钝化层，其部分地覆盖焊盘以限定具有第一横向尺寸的第一开口部分。导电结构经由第一开口部分电连接到焊盘。导电结构包括限定第二开口部分的支撑层。导体形成在第二开口部分中以用作具有平坦顶表面的凸块。

84. 发明授权

US08319337B2 Conductive structure for a semiconductor integrated circuit and method for forming the same 有权
标题翻译：半导体集成电路的导电结构及其形成方法
公开(公告)号：US08319337B2
公开(公告)日：2012-11-27
申请号：US11898612
申请日：2007-09-13
申请人： Chung-Pang Chi , Cheng Tang Huang
发明人： Chung-Pang Chi , Cheng Tang Huang
IPC分类号： H01L23/48
CPC分类号： H01L24/11 , H01L24/12 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05572 , H01L2224/05666 , H01L2224/05684 , H01L2224/114 , H01L2224/1147 , H01L2224/1148 , H01L2224/116 , H01L2224/13007 , H01L2224/13144 , H01L2224/1357 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/14 , H01L2924/00014 , H01L2224/13099 , H01L2924/013
摘要： A conductive structure for a semiconductor integrated circuit and method for forming the conductive structure are provided. The semiconductor integrated circuit has a pad and a passivation layer partially covering the pad to define a first opening portion having a first lateral size. The conductive structure electrically connects to the pad via the first opening portion. The conductive structure comprises a support layer defining a second opening portion. A conductor is formed in the second opening portion to serve as a bump having a planar top surface.
摘要翻译：提供了一种用于半导体集成电路的导电结构和用于形成导电结构的方法。半导体集成电路具有焊盘和钝化层，其部分地覆盖焊盘以限定具有第一横向尺寸的第一开口部分。导电结构经由第一开口部分电连接到焊盘。导电结构包括限定第二开口部分的支撑层。导体形成在第二开口部分中以用作具有平坦顶表面的凸块。

85. 发明申请

US20120226482A1 NUMERICAL SIMUALTION OF STRUCTURAL BEHAVIORS USING A MESHFREE-ENRICHED FINITE ELEMENT METHOD 有权
标题翻译：使用MESHFREE增强的有限元素方法的结构行为的数值模拟
公开(公告)号：US20120226482A1
公开(公告)日：2012-09-06
申请号：US13038330
申请日：2011-03-01
申请人： Cheng-Tang Wu , Wei Hu
发明人： Cheng-Tang Wu , Wei Hu
IPC分类号： G06F17/10
CPC分类号： G06F17/5018
摘要： System, method and software product for numerically simulating structural behaviors of an engineering product in compressible and near-incomprssible region is disclosed. Meshfree enriched finite element method (ME-FEM) is used for such numerical simulation. ME-FEM requires an engineering product be represented by a FEM model comprising a plurality of finite elements. Finite elements used in the ME-FEM are generally low-order finite elements. Each of the finite elements in the FEM model is enriched by at least one meshfree enriched (ME) node located within the element's domain. Each ME node has additional degrees-of-freedom for the element it belongs independent from those of the corner nodes. A displacement based first-order convex meshfree approximation is applied to the ME node. The convex meshfree approximation has Knonecker-delta property at the element's boundary. The gradient matrix of ME-FEM element satisfies integration constraint. ME-FEM interpolation is an element-wise meshfree interpolation that is discrete divergence-free at the incompressible limit.
摘要翻译：公开了一种用于数值模拟工程产品在可压缩和近不可逆区域中的结构行为的系统，方法和软件产品。无网格富集有限元法（ME-FEM）用于这种数值模拟。 ME-FEM要求工程产品由包括多个有限元素的FEM模型表示。 ME-FEM中使用的有限元素通常是低阶有限元。 FEM模型中的每个有限元素都由位于元素域内的至少一个无网格富集（ME）节点来丰富。每个ME节点对于其所属的元件具有额外的自由度，独立于角点节点。基于位移的一阶凸无网格近似被应用于ME节点。凸无网格近似在元素边界处具有Knonecker-delta属性。 ME-FEM元素的梯度矩阵满足积分约束。 ME-FEM插值是在不可压缩极限处为离散无差异的元素无网格内插。

86. 发明授权

US08211789B2 Manufacturing method of a bump structure having a reinforcement member 有权
标题翻译：具有加强构件的凸块结构的制造方法
公开(公告)号：US08211789B2
公开(公告)日：2012-07-03
申请号：US13104980
申请日：2011-05-11
申请人： Cheng-Tang Huang
发明人： Cheng-Tang Huang
IPC分类号： H01L21/44
CPC分类号： H01L24/11 , H01L2224/02166 , H01L2224/0401 , H01L2224/05124 , H01L2224/05147 , H01L2224/05572 , H01L2224/10126 , H01L2224/114 , H01L2224/1147 , H01L2224/116 , H01L2224/1191 , H01L2224/13007 , H01L2224/13012 , H01L2224/13013 , H01L2224/13021 , H01L2224/13099 , H01L2224/13144 , H01L2924/0002 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/00014 , H01L2224/05552
摘要： A manufacturing method of a bump structure having a reinforcement member is disclosed. First, a substrate including pads and a passivation layer is provided. The passivation layer has first openings, and each first opening exposes a portion of the corresponding pad respectively. Next, an under ball metal (UBM) material layer is formed on the substrate to cover the passivation layer and the pads exposed by the passivation layer. Bumps are formed on the UBM material layer and the lower surface of each bump is smaller than that of the opening. Each reinforcement member formed on the UBM material layer around each bump contacts with each bump, and the material of the reinforcement member is a polymer. The UBM material layer is patterned to form UBM layers and the lower surface of each UBM layer is larger than that of each corresponding opening. Hence, the bump has a planar upper surface.
摘要翻译：公开了一种具有加强件的凸块结构的制造方法。首先，提供包括焊盘和钝化层的衬底。钝化层具有第一开口，并且每个第一开口分别暴露相应衬垫的一部分。接下来，在衬底上形成底部球金属（UBM）材料层以覆盖钝化层和由钝化层暴露的焊盘。在UBM材料层上形成凸起，并且每个凸起的下表面小于开口的下表面。形成在每个凸块周围的UBM材料层上的每个加强构件与每个凸块接触，并且加强构件的材料是聚合物。将UBM材料层图案化以形成UBM层，并且每个UBM层的下表面大于每个相应开口的下表面。因此，凸块具有平坦的上表面。

87. 发明申请

US20120042457A1 DYE COMPOUND AND PHOTOELECTRIC COMPONENT USING THE SAME 失效
标题翻译：使用它的DYE化合物和光电组分
公开(公告)号：US20120042457A1
公开(公告)日：2012-02-23
申请号：US13287321
申请日：2011-11-02
申请人： Ming-Si WU , Wei-Cheng TANG
发明人： Ming-Si WU , Wei-Cheng TANG
IPC分类号： C09B57/00 , C07C255/41 , C07D333/24
CPC分类号： C07C255/42 , C07C2603/18 , C07D333/06 , C09B57/008 , H01G9/2031 , H01G9/2059 , H01L51/006 , H01L51/0068 , Y02E10/542 , Y02E10/549
摘要： The present invention relates to a dye compound represented by the following formula (I), or a salt thereof: wherein R1, R2, R3, R4, D1, D2, B, and n are defined the same as the specification, and also relates to a photoelectric component using the same. The dye compound of the present invention is suitable for Dye-Sensitized Solar Cell (DSSC). Hence, the photoelectric characteristics of the DSSC can be improved by using the dye compound of the present invention.
摘要翻译：本发明涉及由下式（I）表示的染料化合物或其盐：其中R1，R2，R3，R4，D1，D2，B和n定义与说明书相同，并且还涉及涉及使用其的光电部件。本发明的染料化合物适用于染料敏化太阳能电池（DSSC）。因此，通过使用本发明的染料化合物可以提高DSSC的光电特性。

88. 发明申请

US20120029388A1 FORCE BEARING MONITOR APPARATUS FOR SPORTS SHOES 审中-公开
标题翻译：用于运动鞋的强制轴承监视器装置
公开(公告)号：US20120029388A1
公开(公告)日：2012-02-02
申请号：US12846192
申请日：2010-07-29
申请人： Cheng-Tang CHIANG
发明人： Cheng-Tang CHIANG
IPC分类号： A61B5/103
CPC分类号： A43B5/06 , A43B3/0005 , A61B5/1036
摘要： A force bearing monitor apparatus for sports shoes includes a first accelerometer module located at a rear end of a sole of a shoe and a second accelerometer module located at a front end of the sole to measure alterations of a first acceleration and a second acceleration borne by the shoe when a user is stridden and stepped during running. Through generation sequence of the alterations of the first and second accelerations, an exercise mode is determined. And through processing of a first signal processing unit and an interrelation processing unit, a first reacting force and a second reacting force are derived, and the ratio of the first and second reacting forces is obtained to serve as a control factor to adjust softness and hardness of the sole. According to the exercise mode, the softness and hardness of the sole can be made in response to the ground.
摘要翻译：用于运动鞋的力轴承监测装置包括位于鞋底的后端的第一加速度计模块和位于鞋底前端的第二加速度计模块，以测量第一加速度和第二加速度的变化，所述第一加速度和第二加速度由当用户在运行过程中被踩踏时，鞋子就是鞋。通过第一和第二加速度的改变的生成顺序，确定锻炼模式。并且通过处理第一信号处理单元和相关处理单元，得到第一反作用力和第二反作用力，并且获得第一和第二反作用力的比例作为调节柔软度和硬度的控制因素的唯一。根据运动模式，鞋底的柔软度和硬度可以根据地面进行。

89. 发明授权

US08032095B1 Method and apparatus for detecting carrier leakage in a wireless or similar system 有权
标题翻译：用于检测无线或类似系统中的载波泄漏的方法和装置
公开(公告)号：US08032095B1
公开(公告)日：2011-10-04
申请号：US11213907
申请日：2005-08-30
申请人： Kevin Hsiao-Cheng Tang , Atul Salhotra
发明人： Kevin Hsiao-Cheng Tang , Atul Salhotra
IPC分类号： H04B1/04
CPC分类号： H04B1/0466
摘要： A method and circuit for indicating signal faults in wireless transmissions, particularly, a carrier leak, includes an input to receive a wireless signal, a bias detector that detects a bias in a portion of the signal and outputs a bias value indicative of the bias, an evaluator configured to compare the bias value to at least one allowable transmission signal value, and output a signal when the bias value is outside the allowable transmission signal value, and an output, responsive to the evaluator, to indicate a carrier leakage in the wireless signal. A buffer may be provided between the input and the evaluator. The sensitivity of the circuit may be adjusted and a protocol determination may be made.
摘要翻译：用于指示无线传输中的信号故障，特别是载波泄漏的方法和电路包括接收无线信号的输入端，偏置检测器，其检测信号的一部分中的偏置并输出指示偏置的偏置值，评估器，被配置为将所述偏置值与至少一个可允许的传输信号值进行比较，并且当所述偏置值在所述允许的传输信号值之外时输出信号;以及响应于所述评估器的输出，以指示所述无线电中的载波泄漏信号。可以在输入和评估器之间提供缓冲器。可以调整电路的灵敏度，并且可以进行协议确定。

90. 发明授权

US08002448B2 Table lamp 失效
标题翻译：台灯
公开(公告)号：US08002448B2
公开(公告)日：2011-08-23
申请号：US12389383
申请日：2009-02-20
申请人： Cheng-Tang Chen
发明人： Cheng-Tang Chen
IPC分类号： F21S8/08
CPC分类号： F21S6/003 , F21Y2115/10 , G02B6/001
摘要： The table lamp contains a lamp base and an extension tube plugged vertically into the lamp base. A curved transparent light tube is attached along its entire length to a parallel and also curved back cover. The combination is joined to a top end of the extension tube. Two light generation assemblies are provided at the two ends of the light tube, respectively, each sequentially composed of a lens, a lens ring, a light emitting diode, a power circuit, a heat dissipation plate, and a heat dissipation element. The light from the light emitting diodes is projected into the light tube and, with a reflection layer along the inner wall of the light tube, the light is uniformly reflected towards the area beneath the table lamp.
摘要翻译：台灯包含一个灯座和一个垂直插入灯座的延长管。弯曲的透明光管沿其整个长度附接到平行且也是弯曲的后盖。该组合件连接到延伸管的顶端。分别在光管的两端分别设置两个发光组件，每个发光组件依次由透镜，透镜环，发光二极管，电源电路，散热板和散热元件组成。来自发光二极管的光被投射到光管中，并且沿着光管的内壁的反射层将光均匀地反射到台灯下方的区域。

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