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81. 发明申请

US20130126891A1 MICRO LIGHT EMITTING DIODE 有权
标题翻译：微光发光二极管
公开(公告)号：US20130126891A1
公开(公告)日：2013-05-23
申请号：US13372222
申请日：2012-02-13
申请人： Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
发明人： Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
IPC分类号： H01L33/32 , H01L33/08
CPC分类号： H01L33/06 , F21V7/00 , H01L25/0753 , H01L27/15 , H01L29/0684 , H01L33/0079 , H01L33/04 , H01L33/20 , H01L33/28 , H01L33/30 , H01L2224/95
摘要： A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
摘要翻译：描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。保形介质阻挡层可以跨越微型p-n二极管的侧壁。微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。

82. 发明授权

US08415771B1 Micro device transfer head with silicon electrode 有权
标题翻译：带硅电极的微器件转印头
公开(公告)号：US08415771B1
公开(公告)日：2013-04-09
申请号：US13481592
申请日：2012-05-25
申请人： Dariusz Golda , Andreas Bibl
发明人： Dariusz Golda , Andreas Bibl
IPC分类号： H01L29/66 , H01L21/683
CPC分类号： B81C99/0025 , B81C2201/0194 , H01L21/67144 , H01L24/75 , H01L2224/7598
摘要： A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.
摘要翻译：描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。在一个实施例中，微器件传送头阵列包括基底衬底和基底衬底上的图案化硅层。图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。每个硅电极包括突出在硅互连上方的台面结构。介电层覆盖每个台面结构的顶面。

83. 发明授权

US08377319B2 Print head nozzle formation 有权
标题翻译：打印头喷嘴形成
公开(公告)号：US08377319B2
公开(公告)日：2013-02-19
申请号：US12027597
申请日：2008-02-07
申请人： Zhenfang Chen , Andreas Bibl , Paul A. Hoisington
发明人： Zhenfang Chen , Andreas Bibl , Paul A. Hoisington
IPC分类号： G01D15/00
CPC分类号： B41J2/1623 , B41J2/162 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1645
摘要： Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.
摘要翻译：提供了用于在微机电装置中形成喷嘴的技术。在将层粘合到装置的另一部分之前，喷嘴形成在一层中。在接合之前在层中形成喷嘴可以形成具有期望深度和期望几何形状的喷嘴。为喷嘴选择特定的几何形状可以降低油墨流动的阻力，并且提高喷嘴在整个微机电装置上的均匀性。

84. 发明授权

US08349116B1 Micro device transfer head heater assembly and method of transferring a micro device 有权
标题翻译：微型设备传送头加热器组件和传送微型设备的方法
公开(公告)号：US08349116B1
公开(公告)日：2013-01-08
申请号：US13372422
申请日：2012-02-13
申请人： Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
发明人： Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
IPC分类号： B29C65/02 , B29C65/48 , B32B37/04 , B32B39/00 , B32B43/00
CPC分类号： H01L29/167 , B32B38/18 , H01L21/67144 , H01L24/75 , H01L24/83 , H01L24/95 , H01L24/97 , H01L25/0753 , H01L33/62 , H01L2224/75725 , H01L2224/7598 , H01L2224/83005 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2933/0066 , Y10T156/1153 , Y10T156/17 , Y10T156/1705 , Y10T156/1707 , Y10T156/1744 , Y10T156/1749 , Y10T156/1776 , Y10T156/1911 , H01L2224/83 , H01L2924/00
摘要： A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
摘要翻译：公开了一种传送微型装置和微型装置阵列的方法。承载连接到接合层的微型器件的载体衬底被加热到低于接合层的液相线温度的温度，并且转移头被加热到高于接合层的液相线温度的温度。当微型装置与转印头接触时，来自转印头的热量转移到粘结层中以至少部分地熔化粘结层。施加到转印头的电压产生从载体衬底拾取微器件的夹持力。

85. 发明授权

US08333860B1 Method of transferring a micro device 有权
标题翻译：转移微型装置的方法
公开(公告)号：US08333860B1
公开(公告)日：2012-12-18
申请号：US13372310
申请日：2012-02-13
申请人： Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
发明人： Andreas Bibl , John A. Higginson , Hung-Fai Stephen Law , Hsin-Hua Hu
IPC分类号： B29C65/02 , B29C65/48 , B32B37/04 , B32B39/00 , B32B43/00
CPC分类号： H01L24/83 , B32B37/025 , B32B37/06 , B32B2457/20 , H01L21/67144 , H01L21/6833 , H01L24/75 , H01L24/95 , H01L24/97 , H01L2224/75725 , H01L2224/7598 , H01L2224/83005 , H01L2224/97 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/1421 , H01L2924/1431 , H01L2924/1434 , H01L2924/1461 , H01L2924/15153 , Y10T156/1153 , Y10T156/1707 , Y10T156/1744 , Y10T156/1749 , Y10T156/1776 , H01L2224/83 , H01L2924/00
摘要： A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.
摘要翻译：公开了一种微器件转印头和头阵列。在一个实施例中，微器件转移头包括基底，具有侧壁的台面结构，形成在台面结构上的电极以及覆盖电极的电介质层。可以将电压施加到微器件转移头和头阵列以从载体衬底拾取微器件并将微器件释放到接收衬底上。

86. 发明授权

US08297742B2 Bonded circuits and seals in a printing device 有权
标题翻译：印刷装置中的接合电路和密封
公开(公告)号：US08297742B2
公开(公告)日：2012-10-30
申请号：US12728020
申请日：2010-03-19
申请人： Kevin Von Essen , John A. Higginson , Andreas Bibl
发明人： Kevin Von Essen , John A. Higginson , Andreas Bibl
IPC分类号： B41J2/045
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1632 , B41J2/1642 , B41J2/1643 , B41J2/1646 , B41J2002/14362 , B41J2202/03 , Y10T29/49401
摘要： A fluid ejection device includes a circuit layer having a fluid outlet on a lower surface, a chamber substrate having a fluid inlet on an upper surface, an electrical contact electrically connecting the chamber substrate to the lower surface of the circuit layer, and a seal forming a fluid connection between the fluid outlet of the circuit layer and the fluid inlet of the chamber substrate. The seal and the electrical contact are a eutectic material. The seal and the electrical contact may be the same material.
摘要翻译：流体喷射装置包括在下表面上具有流体出口的电路层，具有在上表面上的流体入口的腔室基底，将腔室基底电连接到电路层的下表面的电接触，以及密封形成电路层的流体出口和腔室衬底的流体入口之间的流体连接。密封和电接触是共晶材料。密封和电接触可以是相同的材料。

87. 发明授权

US08191979B2 Depositing drops on a substrate carried by a stage 有权
标题翻译：将液滴沉积在载物台上
公开(公告)号：US08191979B2
公开(公告)日：2012-06-05
申请号：US12416756
申请日：2009-04-01
申请人： Nobuo Matsumoto , Andreas Bibl , Martin Schoeppler , Deane A. Gardner , John C. Batterton
发明人： Nobuo Matsumoto , Andreas Bibl , Martin Schoeppler , Deane A. Gardner , John C. Batterton
IPC分类号： B41J29/38 , B41J2/01
CPC分类号： B41J3/28 , B41J11/06 , B41J13/103
摘要： A device for depositing drops includes a head configured to eject drops on a region of a substrate; a stage configured to hold the substrate while the head ejects drops on the region of the substrate; a first transporting device configured to transport the substrate in a transporting direction onto the stage; and a second transporting device configured to transport the substrate in the transporting direction off the stage. The stage and at least one of the first transporting device or the second transporting device are movable together in the transporting direction.
摘要翻译：用于沉积液滴的装置包括头部，头部构造成在基底的区域上喷射液滴; 一个构造成在头部喷射在衬底的区域上时保持衬底的阶段; 第一输送装置，其构造成将所述基板沿输送方向输送到所述载物台上; 以及第二输送装置，其构造成将所述基板沿所述输送方向输送出所述载物台。第一输送装置或第二输送装置中的载物台和至少一个可沿输送方向一起移动。

88. 发明授权

US08162466B2 Printhead having impedance features 有权
标题翻译：具有阻抗特性的打印头
公开(公告)号：US08162466B2
公开(公告)日：2012-04-24
申请号：US12486693
申请日：2009-06-17
申请人： Andreas Bibl , John A. Higginson , Paul A. Hoisington , Deane A. Gardner , Robert A. Hasenbein , Melvin L. Biggs , Edward R. Moynihan
发明人： Andreas Bibl , John A. Higginson , Paul A. Hoisington , Deane A. Gardner , Robert A. Hasenbein , Melvin L. Biggs , Edward R. Moynihan
IPC分类号： B41J2/17 , B41J2/05 , B41J2/175
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1635 , B41J2/1637 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14306 , B41J2002/14403 , B41J2002/14419 , B41J2202/20
摘要： Ink jet printheads and printhead components having a body that include a flow path, a piezoelectric actuator having a piezoelectric layer fixed to the body and an impedance feature in the flow path are described. The impedance feature includes a plurality of posts arranged in a first row, at least one post in the first row of posts having a downstream surface that is concave.
摘要翻译：描述了具有包括流路的主体的喷墨打印头和打印头部件，具有固定到主体的压电层的压电致动器和流动路径中的阻抗特征。阻抗特征包括布置在第一排中的多个柱，第一排柱中的至少一个柱具有凹入的下游表面。

89. 发明授权

US08157352B2 Fluid ejecting with centrally formed inlets and outlets 有权
标题翻译：流体喷射与集中形成的入口和出口
公开(公告)号：US08157352B2
公开(公告)日：2012-04-17
申请号：US12393985
申请日：2009-02-26
申请人： Kevin Von Essen , Andreas Bibl
发明人： Kevin Von Essen , Andreas Bibl
IPC分类号： B41J2/155
CPC分类号： B41J2/155 , B41J2/1433 , B41J2002/14475 , B41J2202/12
摘要： An apparatus for ejecting droplets of a fluid includes a substrate, a first plurality of nozzles formed in a first region of a nozzle face of the substrate, and a second plurality of nozzles formed in a second region of the nozzle face. The second region is separated from the first region. An inlet and an outlet are both formed in an upper face of the substrate opposite a third region of the nozzle face, the third region being located between the first region and the second region, and a plurality of fluid paths formed in the substrate and fluidically connecting the first plurality of nozzles and the second plurality of nozzles with the inlet and outlet.
摘要翻译：用于喷射流体液滴的装置包括基板，形成在基板的喷嘴面的第一区域中的第一多个喷嘴和形成在喷嘴面的第二区域中的第二多个喷嘴。第二区域与第一区域分离。入口和出口都形成在与喷嘴面的第三区域相对的基板的上表面中，第三区域位于第一区域和第二区域之间，并且形成在基板中并且流体地形成的多个流体路径用入口和出口连接第一组多个喷嘴和第二组喷嘴。

90. 发明申请

US20110128335A1 CIRCULATING FLUID FOR FLUID DROPLET EJECTING 有权
标题翻译：流体流出液循环流体
公开(公告)号：US20110128335A1
公开(公告)日：2011-06-02
申请号：US12992587
申请日：2009-04-30
申请人： Kevin von Essen , Paul A. Hoisington , Andreas Bibl
发明人： Kevin von Essen , Paul A. Hoisington , Andreas Bibl
IPC分类号： B41J2/18
CPC分类号： B41J2/18 , B41J2/14 , B41J2/175 , B41J2202/12
摘要： A fluid droplet ejection apparatus includes a printhead having a fluid supply and a fluid return. A substrate is attached to the printhead, and the substrate includes a fluid inlet and a fluid outlet on a surface of the substrate proximate to the fluid supply and fluid return. Nozzles are in fluid communication with the fluid inlet. The fluid inlet of the substrate is in fluid communication with the fluid supply, and the fluid outlet is in fluid communication with the fluid return. A first circulation path through the substrate is between the fluid inlet and the fluid outlet. The fluid supply is in fluid communication with the fluid return through a second circulation path that is through the printhead and not through the substrate.
摘要翻译：液滴喷射装置包括具有流体供应和流体返回的打印头。衬底附接到打印头，并且衬底包括流体入口和在衬底表面上靠近流体供应和流体返回的流体出口。喷嘴与流体入口流体连通。衬底的流体入口与流体源流体连通，并且流体出口与流体返回流体连通。通过衬底的第一循环路径位于流体入口和流体出口之间。流体供应通过穿过打印头而不通过基底的第二循环路径与流体返回流体连通。

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