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    • 81. 发明申请
    • Viscoelasticity measuring device
    • 粘弹性测量装置
    • US20020178795A1
    • 2002-12-05
    • US10055893
    • 2002-01-28
    • TOSHIBA CERAMICS CO., LTD.
    • Hiromichi IsogaiKatsuyoshi KojimaTakayuki Masunaga
    • G01N011/10
    • G01N3/56G01N2203/0071G01N2203/0085G01N2203/0094
    • The invention provides a viscoelasticity measuring device which is capable of imparting a desired displacement profile to a sample under conditions close to that of actual use. The viscoelasticity measuring device is composed of a presser to impart displacements to a sample; a rod to convey said displacements to said presser; a control jig kept in contact with an upper end portion of said rod and adapted to move to impart a desired displacement to said rod; a load cell which detects a load exerted to the sample to detect a stress generated in the sample; and a displacement sensor to detect the displacement in said sample; said displacements imparted of the sample being defined in accordance with a configuration and a moving speed of said control jig.
    • 本发明提供了一种粘弹性测量装置,该装置能够在接近于实际使用的条件下将样品赋予期望的位移曲线。 粘弹性测量装置由将压力赋予样品的压头构成; 用于将所述位移传送到所述压脚的杆; 控制夹具与所述杆的上端部分保持接触并且适于移动以赋予所述杆所需的位移; 负载传感器,其检测施加到样品的负载以检测在样品中产生的应力; 以及位移传感器,用于检测所述样品中的位移; 所述根据所述控制夹具的构造和移动速度限定样品的位移。
    • 87. 发明授权
    • Treatment apparatus for high-precision analysis of impurities in silicic
material
    • 用于高精度分析硅材料杂质的处理装置
    • US5849597A
    • 1998-12-15
    • US769128
    • 1996-12-18
    • Fumio TokuokaKazuhiko Shimanuki
    • Fumio TokuokaKazuhiko Shimanuki
    • G01N1/32G01N33/20G01N1/00G01N33/00B01D00/00
    • G01N33/20G01N1/32Y10S436/807Y10T436/25125
    • A treatment apparatus for analyzing the impurities in silicic material with high precision, includes a container having an inner space in which at least one analysis sample container and a sample decomposing solution are accommodated. The container is divided into a lid body and a lower body, each of the lid body and the lower body being opened at the division surface side thereof to form an open end and being closed at the surface side opposite to the division surface side to form a close end thereof. The inner peripheral surface of the open end of the lower body is formed in a stepwise shape so that the analysis sample container is disposed to be spaced from the surface of the decomposing solution which is stocked in the lower body, and the inner peripheral surfaces of the lid body and the lower body are smoothly continuously threadily engaged with each other through abutment faces thereof to keep the container in an appropriate hermetic level. Through the analysis process using the apparatus, the impurities contained in silicic materials used for semiconductor industries in which integration techniques are remarkably developed can be quantitatively analyzed in the order of ppt to obtain silicic products having high reliability.
    • 一种高精度地分析硅质材料中的杂质的处理装置,包括具有至少一个分析用样品容器和样品分解溶液的内部空间的容器。 容器分为盖体和下体,盖体和下体各自在分割面侧开口,形成开口端,与分割面侧相反的表面侧封闭,形成 其结束。 下体的开口端的内周面形成为阶梯状,使得分析用样品容器配置成与储存在下体中的分解溶液的表面间隔开,并且内周面 盖体和下体通过其邻接面平滑地连续地彼此接合,以将容器保持在适当的气密度。 通过使用该装置的分析处理,可以以ppt的顺序对用于半导体工业中用于集成技术显着开发的硅材料中所含的杂质进行定量分析,以获得具有高可靠性的硅产品。
    • 88. 发明授权
    • Method for measuring a substitutional carbon concentration
    • 替代碳浓度测定方法
    • US5808745A
    • 1998-09-15
    • US851612
    • 1997-05-06
    • Hiroshi ShiraiMikio WatanabeShinichiro Takasu
    • Hiroshi ShiraiMikio WatanabeShinichiro Takasu
    • C30B13/00G01N21/59G01J40/00G01N21/00
    • C30B29/06C30B13/00G01N21/59
    • A silicon wafer measuring method includes: (a) a first step of measuring a light transmission characteristic (I.sub.OBS) of the pulled silicon wafer by utilizing parallel polarized light incident at the Brewster angle into the pulled silicon wafer, (b) a second step of measuring a light transmission characteristic (I.sub.O) of a floating zone silicon wafer functioning as a reference silicon wafer by utilizing parallel polarized light incident at the Brewster angle into the floating zone silicon wafer, and (c) a third step of calculating a substitutional carbon concentration �C.sub.SC ! on the basis of the light transmission characteristic (I.sub.OBS) of the pulled silicon wafer measured during the first step and the light transmission characteristic (I.sub.O) of the floating zone silicon wafer measured during the second step, (d) a fourth step of comparing the substitutional carbon concentration �C.sub.SC ! of the pulled silicon wafer measured during the third step with a reference value, and (e) a fifth step of removing a pulled silicon wafer if its substitutional carbon concentration �C.sub.SC ! outside of a range of values about the reference value so as to be defective in view of the results compared during the fourth step.
    • 一种硅晶片测量方法包括:(a)第一步骤,通过利用以布鲁斯特角入射的平行偏振光将拉硅晶片的透光特性(IOBS)测量到拉硅晶片中,(b)第二步骤 通过将以布鲁斯特角入射的平行偏振光利用于浮动区硅晶片,测量用作参考硅晶片的浮动区硅晶片的透光特性(IO),以及(c)计算替代碳浓度的第三步骤 [CSC],基于在第一步骤期间测量的拉动硅晶片的透光特性(IOBS)和在第二步骤期间测量的浮动区硅晶片的透光特性(IO),(d)第四步骤 将在第三步骤中测量的拉硅硅片的替代碳浓度[CSC]与参考值进行比较,和(e)第五步骤 如果其替代碳浓度[CSC]超出参考值的值范围之外,则考虑到在第四步骤期间比较的结果而导致有缺陷的拉动硅晶片。