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71. 发明授权

US06574399B2 Ceramic waferboard for integration of optical/optoelectronic/electronic components 有权
标题翻译：用于光学/光电子/电子元件集成的陶瓷片
公开(公告)号：US06574399B2
公开(公告)日：2003-06-03
申请号：US10015914
申请日：2001-11-02
申请人： Robert A. Boudreau , Songsheng Tan
发明人： Robert A. Boudreau , Songsheng Tan
IPC分类号： G02B630
CPC分类号： G02B6/423 , G02B6/3636 , G02B6/3652 , G02B6/3692 , G02B6/3696
摘要： An optoelectronic module includes a ceramic waferboard having a groove configured to passively position an optical fiber. The ceramic waferboard includes an alignment feature configured to passively position an optical component. An optical device is secured to the ceramic waferboard in contact with the alignment feature to thereby position the optical device. An optical fiber is positioned in the groove with an end of the optical fiber positioned adjacent the optical device to thereby optically couple the optical fiber to the optical device. The optoelectronic module also includes an integrated circuit chip secured to the ceramic waferboard, and a conductive material disposed on the ceramic waferboard and electrically coupling the integrated circuit chip to the optical device.
摘要翻译：光电模块包括具有被配置为被动地定位光纤的凹槽的陶瓷晶片板。陶瓷晶片板包括被配置为被动地定位光学部件的对准特征。光学装置固定到与对准特征接触的陶瓷片板上，从而定位光学装置。光纤定位在槽中，其中光纤的端部位于光学器件附近，从而将光纤光耦合到光学器件。光电子模块还包括固定到陶瓷晶片板上的集成电路芯片和设置在陶瓷晶片板上并将集成电路芯片电耦合到光学器件的导电材料。

72. 发明授权

US06516121B2 Configuring optical fibers in a multi-chip module 失效
公开(公告)号：US06516121B2
公开(公告)日：2003-02-04
申请号：US09843136
申请日：2001-04-26
申请人： Herzel Laor
发明人： Herzel Laor
IPC分类号： G02B630
CPC分类号： G02B6/4225 , G02B6/4202 , G02B6/4236 , G02B6/4237 , G02B6/43 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/05599 , H01L2224/45 , H01L2224/4809 , H01L2224/48137 , H01L2224/49175 , H01L2224/78 , H01L2224/78301 , H01L2224/78313 , H01L2224/85 , H01L2224/85399 , H01L2924/00011 , H01L2924/00014 , H01L2924/12042 , H01L2924/12043 , H01L2924/14 , H01L2924/30107 , Y10T29/49155 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2924/01006
摘要： The present invention is directed to a methodology, structure and process (200) for routing connecting, and forming optical fibers between optical ports such as optical transmitters and receivers/detectors to create optical pathways for signal transfer therebetween. More particularly, when connecting timed optoelectronic chips on a Multi Chip Module, an optical fiber is aligned above an optical port (202), the fiber and the port surface are heated (204), (206) and contacted (208) creating an adhesion bond therebetween. The fiber is then routed (210) to another optical port for connection (214). The fiber may then be connected to additional ports (218) or severed (220). Once severed, the optical pathway may be adjusted to synchronize timing between optoelectronic chips. If a chip's timing is advanced or delayed, the connecting optical pathway may be lengthened (224) or shortened (226). Last, the optical fibers are annealed (228) to relieve internal stresses and cure surface defects.

73. 发明授权

US06327408B1 Electrical interconnection of planar lightwave circuits 有权
标题翻译：平面光波电路的电气互连
公开(公告)号：US06327408B1
公开(公告)日：2001-12-04
申请号：US09435105
申请日：1999-11-05
申请人： Dietmar Hiller
发明人： Dietmar Hiller
IPC分类号： G02B630
CPC分类号： G02F1/313 , G02B6/4245 , G02B6/4266 , G02B6/4274 , G02B6/4283 , G02F1/0147 , H01L2224/45144 , H01L2224/48091 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A package for an electrical/optical component includes an optical component and one or more bridges of insulating material mounted in spaced relationship to the optical component. Electrical components are mounted on the bridge on a side opposite the optical component. Electrical connection from the electrical component to conductors on the side of the bridge facing the optical component is made by plated through-hole connections extending through the bridge. Relatively short electrical conductors are employed to interconnect the optical component with conductors formed on the bridge and to connecting pins extending from the package. In another embodiment, one or more bridges are positioned with electrical conductors of a bridge coupled in direct electrical contact with the connector pins using a conductive bonding agent, such as a conductive adhesive material or solder. In a further embodiment, the bridge includes a plurality of electrical contacts on a side facing an optical component within the package. Electrical contacts between the optical component and the contacts on the surface of the bridge facing the optical component and the connector pins are directly made using a conductive bonding agent, such as a conductive adhesive, or solder. Through-hole connections couple the conductors on the first side of the bridge with an electrical component mounted on the second side of the bridge.
摘要翻译：用于电气/光学部件的封装包括光学部件和与光学部件间隔开地安装的一个或多个绝缘材料桥。电气部件安装在与光学部件相对的一侧的桥上。从电气部件到位于面向光学部件的桥侧的导体的电连接通过延伸穿过桥的电镀通孔连接来制造。采用相对短的电导体将光学部件与形成在桥上的导体以及从封装延伸的连接销互连。在另一个实施例中，一个或多个桥被定位成使用导电粘合剂（例如导电粘合剂材料或焊料）与桥接器的电导体与连接器引脚直接电接触。在另一实施例中，桥包括在面向封装内的光学部件的一侧上的多个电触点。光学部件与面向光学部件和连接器引脚的桥接面之间的触点之间的电接触使用诸如导电粘合剂或焊料的导电粘结剂直接制成。通孔连接通过安装在桥的第二侧的电气部件将桥的第一侧上的导体耦合。

74. 发明授权

US06325551B1 Method and apparatus for optically aligning optical fibers with optical devices 失效
标题翻译：光纤与光学器件光学对准的方法和装置
公开(公告)号：US06325551B1
公开(公告)日：2001-12-04
申请号：US09457756
申请日：1999-12-08
申请人： Robert S. Williamson III , Robert Marsland
发明人： Robert S. Williamson III , Robert Marsland
IPC分类号： G02B630
CPC分类号： G02B6/422 , G02B6/4219 , G02B6/4221 , G02B6/4225 , G02B6/4226 , G02B6/4237
摘要： An automatic fiber pigtailing machine (AFPM) is disclosed. The AFPM provides precise coupling between a fiber pigtail and an optoelectronic (OE) device based on the fidelity of signal transfer across a junction between the fiber and OE device. The AFPM uses a positioning system with a high frequency closed loop optical feedback of a modulated signal to/from the device under assembly (DUA). Local/global maximums in the fidelity of the modulated signal are correlated with relative orientations/alignment/positions of the various components of the DUA to determine the preferred orientation/alignment/positions between the various components for the completed assembly. In an embodiment of the invention the fiber optic extends from a first surface of a generally rectangular package and the electrical interface to the OE device is defined on a surface orthogonal to the first surface. This geometry is compatible with usage on PC boards where side mounting reduces the overall form factor for the PC board since the fiber optic is parallel with the plane of the board.
摘要翻译：公开了一种自动纤维尾纤机（AFPM）。基于在光纤和OE设备之间的连接处的信号传输的保真度，AFPM提供光纤尾纤和光电（OE）设备之间的精确耦合。 AFPM使用具有高频闭环光反馈的定位系统，该反馈调制信号来自组装设备（DUA）。调制信号的保真度中的局部/全局最大值与DUA的各个部件的相对取向/对准/位置相关，以确定用于完成组件的各种部件之间的优选取向/对准/位置。在本发明的一个实施例中，光纤从大致矩形的封装的第一表面延伸，并且在与第一表面正交的表面上限定到OE器件的电接口。这种几何体与PC板上的使用兼容，其中侧面安装降低了PC板的整体外形尺寸，因为光纤与板的平面平行。

75. 发明授权

US06249627B1 Arrangement for self-aligning optical fibers to an array of surface emitting lasers 失效
标题翻译：用于自对准光纤到表面发射激光器阵列的布置
公开(公告)号：US06249627B1
公开(公告)日：2001-06-19
申请号：US09394634
申请日：1999-09-13
申请人： Aaron Eugene Bond , Mindaugas Fernand Dautartas , George John Przybylek
发明人： Aaron Eugene Bond , Mindaugas Fernand Dautartas , George John Przybylek
IPC分类号： G02B630
CPC分类号： G02B6/4232 , G02B6/423 , G02B6/4231
摘要： An arrangement for providing attachment and alignment between an array of surface emitting lasers and an array of optical fibers utilizes a first substrate for supporting the laser array and a second substrate for supporting the fibers. The second substrate is formed to including a plurality of apertures that are disposed to self-align with the laser array upon attachment. Alignment fiducials may be formed on both substrates to facilitate the alignment.
摘要翻译：用于在表面发射激光器阵列和光纤阵列之间提供附接和对准的装置利用用于支撑激光器阵列的第一基板和用于支撑光纤的第二基板。第二基底被形成为包括多个孔，所述孔被设置成在附着时与激光阵列自对准。对准基准可以形成在两个基板上以便于对准。

76. 发明授权

US06231771B1 Process for making optical waveguides 失效
标题翻译：制造光波导的工艺
公开(公告)号：US06231771B1
公开(公告)日：2001-05-15
申请号：US09286415
申请日：1999-04-05
申请人： John Paul Drake
发明人： John Paul Drake
IPC分类号： G02B630
CPC分类号： G02B6/131 , G02B6/122 , G02B6/30 , G02B2006/12097 , G02B2006/12176
摘要： A process for treating a waveguide structure which comprises a silicon substrate with an integrally formed rib waveguide is described. The waveguide has an end portion with a facet, the end portion overhanging the silicon substrate and having an oxide layer on its underside protruding from the facet of the waveguide. A nitride layer extends over the upper surface of the waveguide and the facet. The treatment process involves etching the oxide layer from the underside, growing a new oxide layer, etching the nitride layer and then depositing a new nitride layer.
摘要翻译：描述了一种用于处理包括具有整体形成的肋波导的硅衬底的波导结构的方法。波导具有具有小面的端部，该端部突出于硅衬底并且在其下侧上具有从波导的小面突出的氧化物层。氮化物层在波导的上表面和小平面上延伸。处理过程包括从底面蚀刻氧化物层，生长新的氧化物层，蚀刻氮化物层，然后沉积新的氮化物层。

77. 发明授权

US06195485B1 Direct-coupled multimode WDM optical data links with monolithically-integrated multiple-channel VCSEL and photodetector 有权
标题翻译：直接耦合多模WDM光数据链路，采用单片集成多通道VCSEL和光电探测器
公开(公告)号：US06195485B1
公开(公告)日：2001-02-27
申请号：US09425542
申请日：1999-10-22
申请人： Larry A. Coldren , Syn-Yem Hu
发明人： Larry A. Coldren , Syn-Yem Hu
IPC分类号： G02B630
CPC分类号： G02B6/4202 , G02B6/4239 , G02B6/4246 , G02B6/4249 , H01S5/02284 , H01S5/18358 , H01S5/4087 , H01S5/423
摘要： A low cost, high speed WDM optical link which employs a circular array of VCSEL emitters directly coupled to a multi-mode fiber through which multiple simultaneously optical transmissions are sent to an optical detector comprising a circular array of RCPD detectors receiving the multiple simultaneous transmissions. The emitters and detectors within each array are fabricated with a double-absorber design which avoids position sensitivity related to the cavity standing wave and eliminates the need for in-situ cavity-mode adjustment. In addition, a coupled-cavity structure is presented to achieve passbands with flat tops and steep sides to approach the ideal square-shape photoresponse and to ensure proper channel alignment.
摘要翻译：一种低成本，高速WDM光链路，其采用直接耦合到多模光纤的VCSEL发射器的圆形阵列，多模光纤通过多模光纤将多个同时光传输发送到包括接收多个同时传输的RCPD检测器的圆阵列的光检测器。每个阵列中的发射器和检测器都采用双吸收器设计制造，避免了与腔体驻波相关的位置灵敏度，并消除了对原位腔模调整的需要。此外，提供耦合腔结构以实现具有平坦顶部和陡峭侧面的通带以接近理想的正方形光响应并且确保正确的通道对准。

78. 发明授权

US06169833A CMOS-compatible optical bench 有权
标题翻译： CMOS兼容光学台
公开(公告)号：US06169833A
公开(公告)日：2001-01-02
申请号：US09235624
申请日：1999-01-22
申请人： Keith Wayne Goossen , Ashok V. Krishnamoorthy
发明人： Keith Wayne Goossen , Ashok V. Krishnamoorthy
IPC分类号： G02B630
CPC分类号： G02B6/423 , G02B6/4206 , G02B6/4214 , G02B6/4239
摘要： A method of aligning, placing, and attaching an optical fiber directly to an electronic, complementary, metal-oxide-semiconductor (CMOS) chip that uses alignment features defined during the CMOS fabrication. The method involves the steps of: i) defining, during the fabrication of an electronic CMOS device, one or more shallow grooves upon the device substrate; ii) disposing an optical fiber within the defined groove(s); and iii) securing the optical fiber within the groove(s). Advantageously, the method may be practiced using a variety of fabrication techniques and apparatus that are compatible with conventional CMOS devices.
摘要翻译：将光纤直接对准，放置和附着到使用在CMOS制造期间限定的对准特征的电子，互补的金属氧化物半导体（CMOS）芯片的方法。该方法包括以下步骤：i）在制造电子CMOS器件期间限定在器件衬底上的一个或多个浅沟槽; ii）将光纤设置在限定的槽内; 以及iii）将光纤固定在所述凹槽内。有利地，可以使用与常规CMOS器件兼容的各种制造技术和装置来实施该方法。

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