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71. 发明授权

US08739403B2 Method of manufacturing a medical lead 有权
标题翻译：医用铅的制造方法
公开(公告)号：US08739403B2
公开(公告)日：2014-06-03
申请号：US12948592
申请日：2010-11-17
申请人： Michael Hegland , Richard T. Stone
发明人： Michael Hegland , Richard T. Stone
IPC分类号： H01R43/00
CPC分类号： A61N1/0551 , A61B5/0422 , A61B2562/125 , B29C45/14639 , B29L2031/753 , Y10T29/49117 , Y10T29/49151 , Y10T29/49169 , Y10T29/49176 , Y10T29/49181 , Y10T29/49204 , Y10T29/4922
摘要： A method of manufacturing a segmented electrode assembly. An electrically conducting tube is coupled to an electrically insulating material. The tube is generally cylindrical and hollow and defines one or more gaps at a first axial position. The tube also includes one or more bridges located at a second axial position. The method includes removing at least a portion of the bridge resulting in a segmented electrode assembly having at least one segment. A number embodiments of making a tube are also provided. In another embodiment a method of manufacturing a medical lead using a segmented electrode assembly is provided.
摘要翻译：一种制造分段电极组件的方法。导电管耦合到电绝缘材料。管通常为圆柱形且中空并且在第一轴向位置限定一个或多个间隙。管还包括位于第二轴向位置的一个或多个桥。该方法包括去除桥的至少一部分，产生具有至少一个段的分段电极组件。还提供了制造管的多个实施例。在另一个实施例中，提供了使用分段电极组件制造医疗引线的方法。

72. 发明授权

US08739394B2 System for stringing a first elongate element into a second elongate element 有权
标题翻译：用于将第一细长元件拉入第二细长元件的系统
公开(公告)号：US08739394B2
公开(公告)日：2014-06-03
申请号：US12986867
申请日：2011-01-07
申请人： Edgardo Ortiz Negron , Victor Torres Serrano
发明人： Edgardo Ortiz Negron , Victor Torres Serrano
IPC分类号： B23P19/00
CPC分类号： H01B13/0003 , H01B7/048 , H01B13/062 , Y10T29/49117 , Y10T29/49123 , Y10T29/49169 , Y10T29/49194 , Y10T29/5187 , Y10T29/532 , Y10T29/53213 , Y10T29/53261
摘要： A method for stringing a first elongate element through a second elongate element is provided by placing the first elongate element in a channel and injecting compressed gas into the channel to propel the first elongate element therethrough. The channel has a first open end, and the second elongate element is sealed around the first open end. Compressed gas is injected into the channel towards the second elongate element, propelling the first elongate element through the second elongate element. Also disclosed is a system for performing such a method, including a source of compressed gas and a housing having a channel with a first end and a second open end. The first end is in fluid communication with the source of compressed gas. The channel has a tapered portion adjacent the open end of the channel, and the channel defines a straight longitudinal axis between the first end and the second open end.
摘要翻译：通过将第一细长元件放置在通道中并将压缩气体注入通道以推动第一细长元件通过其中而提供通过第二细长元件将第一细长元件串合的方法。通道具有第一开口端，并且第二细长元件围绕第一开口端密封。压缩气体朝向第二细长元件注入通道，推动第一细长元件通过第二细长元件。还公开了一种用于执行这种方法的系统，其包括压缩气体源和具有带有第一端和第二开口端的通道的壳体。第一端与压缩气体源流体连通。通道具有邻近通道的开口端的锥形部分，并且通道在第一端和第二开口端之间限定直的纵向轴线。

73. 发明申请

US20140144971A1 In System Reflow of Low Temperature Eutectic Bond Balls 审中-公开
标题翻译：低温共晶焊球的系统回流
公开(公告)号：US20140144971A1
公开(公告)日：2014-05-29
申请号：US14167188
申请日：2014-01-29
申请人： Research Triangle Institute
发明人： Robert O. Conn , Daniel S. Stevenson
IPC分类号： H01L23/00
CPC分类号： H01L24/81 , H01L23/147 , H01L23/49816 , H01L23/49827 , H01L23/50 , H01L23/5384 , H01L24/13 , H01L24/16 , H01L24/97 , H01L25/0655 , H01L2224/05147 , H01L2224/10135 , H01L2224/10165 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13562 , H01L2224/13655 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/8114 , H01L2224/81141 , H01L2224/81191 , H01L2224/81234 , H01L2224/81815 , H01L2224/97 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H05K3/3436 , H05K3/3494 , H05K2203/047 , H05K2203/163 , Y02P70/613 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49169 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： Low temperature bond balls connect two structures having disparate coefficients of linear thermal expansion. An integrated circuit is made to heat the device such that the low temperature bond balls melt. After melting, the bond balls solidify, and the device is operated with the bond balls solidified. In one example, one of the two structures is a semiconductor substrate, and the other structure is a printed circuit board. The integrated circuit is a die mounted to the semiconductor substrate. The bond balls include at least five percent indium, and the integrated circuit is an FPGA loaded with a bit stream. The bit stream configures the FPGA such that the FPGA has increased power dissipation, which melts the balls. After the melting, a second bit stream is loaded into the FPGA and the FPGA is operated in a normal user-mode using the second bit stream.
摘要翻译：低温焊球连接两个具有不同的线性热膨胀系数的结构。制造集成电路以加热该器件，使得低温接合球熔化。熔化后，粘结球固化，并且使粘合球固化的装置进行操作。在一个示例中，两个结构之一是半导体衬底，而另一个结构是印刷电路板。集成电路是安装到半导体衬底的裸片。结合球包括至少5％的铟，并且集成电路是装载有位流的FPGA。位流配置FPGA，使得FPGA具有增加的功率耗散，其熔化了球。熔化后，将第二位流装载到FPGA中，并使用第二位流以正常用户模式操作FPGA。

74. 发明授权

US08731862B2 Lightweight audio system for automotive applications and method 有权
标题翻译：汽车应用轻便音响系统及方法
公开(公告)号：US08731862B2
公开(公告)日：2014-05-20
申请号：US13208714
申请日：2011-08-12
申请人： Vineet Gupta , Joseph K. Huntzinger , Michael G. Coady , Dan D. Carman , William R. Reed
发明人： Vineet Gupta , Joseph K. Huntzinger , Michael G. Coady , Dan D. Carman , William R. Reed
IPC分类号： G06F17/00 , G06F11/00
CPC分类号： H05K9/0007 , B29C59/16 , B60R11/02 , G06F11/00 , H04B1/082 , H04R1/02 , H05K1/0215 , H05K1/141 , H05K5/0217 , H05K5/0221 , H05K5/0226 , H05K7/20409 , H05K7/20418 , H05K7/20436 , H05K9/0047 , H05K9/0079 , H05K9/0081 , H05K13/00 , H05K2201/09081 , H05K2201/10386 , H05K2201/10446 , Y10T16/547 , Y10T16/5476 , Y10T29/49002 , Y10T29/49124 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49169 , Y10T29/49172 , Y10T29/4957 , Y10T29/49826 , Y10T29/49861 , Y10T29/5313 , Y10T74/20396 , Y10T403/70 , Y10T403/77 , Y10T428/24289
摘要： A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.
摘要翻译：用于车辆应用的轻量级无线电/ CD播放器实际上是“无紧固件”，并且包括由聚合物基材料形成的壳体和正面接口，其被模制以提供细节以接收音频设备，如回放机构（如果需要）和无线电接收器，以及作为电气控制和显示所需的电路板。外壳和正面接口为复合结构，包括已经通过模制操作预先形成轮廓的镶嵌模制导电丝网。金属丝网通过暴露的金属丝网垫和相邻的接地夹提供EMC，RFI，BCI和ESD屏蔽和电路板的接地。 PCB结构分为第一板，其承载具有适合于大批量生产的表面安装配置中的公共电路部件，以及第二板，其以波焊焊棒安装配置的方式承载特定于应用的电路部件。主要组件和组件在最终组装过程中是自固定的，无需专用工具，夹具和组装设备。主要部件和组件通过整体引导和连接功能自我互连，实现“滑动锁定”和“卡锁”自动互连。无线电架构包括改进的按钮，采用4杆活动铰链和前装饰装饰钮扣。

75. 发明授权

US08680960B2 Multi-layer-multi-turn structure for high efficiency inductors 有权
标题翻译：用于高效率电感器的多层多匝结构
公开(公告)号：US08680960B2
公开(公告)日：2014-03-25
申请号：US13797387
申请日：2013-03-12
申请人： NuCurrent, Inc.
发明人： Vinit Singh , Jacob Babcock , Christine A. Frysz
IPC分类号： H01F5/00
CPC分类号： H01Q1/38 , A61N1/0553 , A61N1/3605 , A61N1/37229 , A61N1/3756 , A61N1/3787 , B33Y80/00 , H01F5/00 , H01F5/003 , H01F7/06 , H01F17/00 , H01F17/0006 , H01F17/0013 , H01F17/02 , H01F21/005 , H01F27/28 , H01F27/2804 , H01F27/30 , H01F27/42 , H01F29/02 , H01F38/14 , H01F41/00 , H01F41/04 , H01F41/041 , H01F41/32 , H01F2027/2809 , H01Q7/00 , H01R43/00 , H01R43/20 , H02J7/025 , H02J17/00 , H02J50/12 , H02P13/00 , H03H7/01 , H04B5/0031 , H04B5/0037 , H04B5/0062 , H04B5/0068 , H04B5/0075 , H05B6/06 , H05B6/1245 , H05B6/36 , H05B6/362 , H05K1/165 , H05K2201/0352 , Y02B40/126 , Y10T29/49005 , Y10T29/4902 , Y10T29/4908 , Y10T29/49117 , Y10T29/49155 , Y10T29/49169 , Y10T29/49195
摘要： A multi-layer, multi-turn structure for an inductor having a plurality of conductor layers separated by layers of insulator is described. The inductor further comprises a connector electrically connected between the conductor layers. The structure of the inductor may comprise a cavity therewithin. The structure of the inductor constructed such that electrical resistance is reduced therewithin, thus increasing the efficiency of the inductor. The inductor is particularly useful at operating within the radio frequency range and greater.
摘要翻译：描述了具有由绝缘体层隔开的多个导体层的电感器的多层多匝结构。该电感器还包括电连接在导体层之间的连接器。电感器的结构可以包括其中的空腔。电感器的结构使得电阻在其中减小，从而提高电感器的效率。电感器在无线电频率范围内工作时特别有用。

76. 发明授权

US08677611B2 Methods of making calibration-adjusted sensors 有权
标题翻译：校准校准传感器的制作方法
公开(公告)号：US08677611B2
公开(公告)日：2014-03-25
申请号：US13349286
申请日：2012-01-12
申请人： Yi Wang , Benjamin J. Feldman
发明人： Yi Wang , Benjamin J. Feldman
IPC分类号： H01R43/00
CPC分类号： G01N27/3271 , G01N27/3272 , G01N27/3274 , Y10T29/49002 , Y10T29/49004 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49135 , Y10T29/49155 , Y10T29/49156 , Y10T29/49169 , Y10T29/49204
摘要： A sensor, and methods of making, for determining the concentration of an analyte, such as glucose, in a biological fluid such as blood or serum, using techniques such as coulometry, amperometry, and potentiometry. The sensor includes a working electrode and a counter electrode, and may include an insertion monitoring trace to determine correct positioning of the sensor in a connector. The sensor is calibration-adjusted, eliminating the need for a user to enter a calibration code or for the meter to read a calibration code.
摘要翻译：使用诸如电量表，电流分析法和电位法的技术，在生物流体例如血液或血清中测定分析物（例如葡萄糖）的浓度的传感器和制造方法。传感器包括工作电极和对电极，并且可以包括插入监视轨迹，以确定传感器在连接器中的正确定位。传感器经过校准调整，无需用户输入校准代码或仪表读取校准代码。

77. 发明申请

US20140073088A1 ELECTRONIC COMPONENT MOUNTING LINE AND ELECTRONIC COMPONENT MOUNTING METHOD 有权
标题翻译：电子元件安装线和电子元件安装方法
公开(公告)号：US20140073088A1
公开(公告)日：2014-03-13
申请号：US13981871
申请日：2012-10-19
申请人： PANASONIC CORPORATION
发明人： Tadashi Maeda , Hiroki Maruo , Tsubasa Saeki
IPC分类号： H01L23/00
CPC分类号： H01L24/81 , B23K1/0008 , B23K1/008 , B23K1/203 , B23K3/0669 , B23K2101/42 , H01L2924/351 , H05K3/305 , H05K3/3436 , H05K3/3442 , H05K13/0465 , H05K13/0469 , H05K2203/0126 , Y02P70/613 , Y10T29/49169 , H01L2924/00
摘要： Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine; a printing machine for applying solder paste to a first placement area of the substrate; a first electronic component placement machine for placing a first electronic component on the first placement area; a second electronic component placement machine for dispensing a thermosetting resin onto a reinforcement position on a peripheral edge portion of a second placement area of the substrate, and for placing on the area the second electronic component having solder bumps; and a reflow machine for bonding the electronic components to the substrate, by heating and cooling the resultant. The second electronic component is placed after the resin is dispensed, such that a peripheral edge portion thereof comes in contact with the resin.
摘要翻译：公开了一种电子部件安装线，其中衬底经过焊膏打印，电子部件放置，然后从上游向下游移动，然后回流。该线包括：基材喂料机; 用于将焊膏施加到基板的第一放置区域的印刷机; 第一电子元件贴装机，用于将第一电子元件放置在所述第一放置区域上; 第二电子元件贴装机，用于将热固性树脂分配到所述基板的第二放置区域的周边边缘部分上的加强位置上，并且用于在所述区域上放置所述第二电子部件具有焊料凸块; 以及用于将电子部件接合到基板的回流机，通过加热和冷却所得物。第二电子部件放置在分配树脂之后，使得其周边部分与树脂接触。

78. 发明申请

US20140071081A1 SYSTEMS AND METHODS FOR ROUTING CABLES IN AN ELECTRONIC DEVICE 有权
标题翻译：用于在电子设备中路由电缆的系统和方法
公开(公告)号：US20140071081A1
公开(公告)日：2014-03-13
申请号：US13610734
申请日：2012-09-11
申请人： Anna-Katrina Shedletsky , Christopher M. Werner , Colin M. Ely , Fletcher R. Rothkopf , Ming Leong , Phillip Michael Hobson
发明人： Anna-Katrina Shedletsky , Christopher M. Werner , Colin M. Ely , Fletcher R. Rothkopf , Ming Leong , Phillip Michael Hobson
IPC分类号： H05K7/06 , H01R43/00 , G06F3/047
CPC分类号： H05K7/06 , G06F1/1643 , G06F1/1658 , G06F1/18 , G06F3/047 , H01R43/00 , H04M1/0266 , H04M1/0274 , H04M2250/22 , Y10T29/49169
摘要： Systems and methods for routing cables in an electronic device are provided. In some embodiments, the electronic device may include a touch sensor having a number of traces, a display component, and a mechanical button, each of which may be coupled to a circuit board via a single flexible circuit cable. This may save valuable space within the electronic device.
摘要翻译：提供了用于在电子设备中布线电缆的系统和方法。在一些实施例中，电子设备可以包括具有多个迹线的触摸传感器，显示部件和机械按钮，每个触摸传感器可以经由单个柔性电路电缆耦合到电路板。这可以节省电子设备中的宝贵空间。

79. 发明申请

US20140062233A1 STARTER MOTOR FOR A VEHICLE 有权
标题翻译：起重机电动汽车
公开(公告)号：US20140062233A1
公开(公告)日：2014-03-06
申请号：US13598377
申请日：2012-08-29
申请人： Travis Reid ATKINSON , Brian Ray BAXTER
发明人： Travis Reid ATKINSON , Brian Ray BAXTER
IPC分类号： H02K11/00 , H02K15/00
CPC分类号： H02K5/148 , H02K11/02 , H02K11/40 , Y10T29/49169
摘要： A dual earth starter motor for a vehicle. The starter motor includes a housing, an armature within the housing, a brush plate within the housing arranged to deliver electric current, by means of conductive brushes, to the armature, and two separate earth terminals electrically connected to the brush plate with each terminal extending through a wall of the housing. In a preferred form, the two earth terminals are electrically isolated from the housing, and at least one of the terminals is mechanically and electrically coupled to the brush plate my means of an interference fit between a portion of the terminal and a hole formed in the brush plate. A method of retrofitting a second earth terminal to an existing starter motor is also disclosed.
摘要翻译：用于车辆的双接地启动电动机。起动电动机包括壳体，壳体内的电枢，壳体内的刷板，布置成通过导电刷将电流传递到电枢，以及电连接到电刷板的两个单独的接地端子，每个端子延伸通过房屋的墙壁。在优选的形式中，两个接地端子与壳体电隔离，并且至少一个端子机械地和电气地耦合到电刷板，我的装置在端子的一部分和形成在端子刷板。还公开了将第二接地端子改装到现有起动电动机的方法。

80. 发明申请

US20140029252A1 LAMP, LAMP UNIT, AND LUMINAIRE 审中-公开
标题翻译：灯，灯单元和灯
公开(公告)号：US20140029252A1
公开(公告)日：2014-01-30
申请号：US13664075
申请日：2012-10-30
申请人： TOSHIBA LIGHTING & TECHNOLOGY CORPORATION
发明人： Go KATO , Masahiko Kamata , Junichi Kimiya , Kenji Nezu , Yoshiyuki Tamaki , Hiroto Nakamura , Makoto Otsuka , Yoshiyuki Tomizawa
IPC分类号： F21V21/00 , H01R43/26 , F21V5/04
CPC分类号： F21V23/002 , F21K9/20 , F21V19/0055 , F21V23/006 , F21V29/507 , F21V29/83 , F21V29/87 , F21Y2103/33 , F21Y2115/10 , Y10T29/49117 , Y10T29/49169
摘要： According to one embodiment, an LED lamp includes a lighting circuit, a storage, a thermal radiating body, an LED substrate, and a cover. The storage includes a pair of electrode pins electrically connected to the lighting circuit, and stores the lighting circuit in the interior thereof. The thermal radiating body integrally includes a lid portion configured to cover the storage and an arrangement portion located in a periphery of the lid portion. The LED substrate includes an LED configured to emit light upon receipt of power feed from the lighting circuit, and is arranged so as to be thermally connected to the arrangement portion of the thermal radiating body. The cover has translucency and covers the LED substrate.
摘要翻译：根据一个实施例，LED灯包括照明电路，存储器，热辐射体，LED基板和盖。存储器包括电连接到照明电路的一对电极引脚，并将照明电路存储在其内部。热辐射体一体地包括构造成覆盖存储器的盖部分和位于盖部分的周边中的布置部分。 LED基板包括被配置为在从照明电路接收电力馈送时发光的LED，并且被布置成与热辐射体的配置部分热连接。盖子具有半透明性并覆盖了LED基板。

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