专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

71. 发明申请

US20150022990A1 VERTICAL BLINDMATE SCALING OF IDENTICAL SYSTEM BOARDS 有权
标题翻译：标准系统板的垂直分布
公开(公告)号：US20150022990A1
公开(公告)日：2015-01-22
申请号：US13945560
申请日：2013-07-18
申请人： International Business Machines Corporation
发明人： Michael D. French, JR. , Edward J. McNulty , Tony C. Sass , Paul A. Wormsbecher
IPC分类号： H05K1/02
CPC分类号： H05K3/368 , H01R12/7082 , H05K2201/042 , H05K2201/10189 , H05K2201/10325
摘要： Two system boards may be connected by a blind plug connector assembly. The top system board supports a first connector and has a hole adjacent the first connector that secures a guide bracket. The blind plug connector assembly is selectively received in the guide bracket to position a proximal connector on the assembly for connecting to the first connector on the top system board and position a distal connector on the assembly for connecting to a second connector on the lower system board. A flexible wired connection extends within the assembly between the proximal connector and the distal connector, and may form a scalability cable. The interaction between the assembly and the guide bracket provide alignment of the connectors.
摘要翻译：两个系统板可以通过盲插头连接器组件连接。顶部系统板支撑第一连接器，并且在第一连接器附近具有固定导向支架的孔。盲插头连接器组件被选择性地容纳在引导支架中以将近端连接器定位在组件上，用于连接到顶部系统板上的第一连接器，并将远端连接器定位在组件上，用于连接到下部系统板上的第二连接器。柔性有线连接在近端连接器和远端连接器之间的组件内延伸，并且可以形成可伸缩电缆。组件和引导支架之间的相互作用提供了连接器的对准。

72. 发明申请

US20150015529A1 CONNECTION APPARATUS FOR ELECTRICALLY CONDUCTIVE PADS AND TOUCH CONTROL SCREEN 有权
标题翻译：用于电导线和触控屏的连接装置
公开(公告)号：US20150015529A1
公开(公告)日：2015-01-15
申请号：US14058157
申请日：2013-10-18
申请人： Shanghai Tianma Micro-Electronics Co., Ltd.
发明人： Zhongshou Huang , Jialing Li , Jun Ma
IPC分类号： H05K1/14 , G06F3/041 , G06F3/044 , H05K1/11
CPC分类号： H05K1/144 , G02F1/13338 , G02F2201/122 , G02F2202/28 , G02F2203/01 , G06F3/0416 , G06F3/044 , H05K1/111 , H05K3/323 , H05K3/368 , H05K2201/0108 , H05K2201/042 , H05K2201/0969 , H05K2201/10136 , Y02P70/611
摘要： A connection apparatus for electrically conductive pads includes a first substrate and a second substrate arranged in opposition, wherein a plurality of first electrically conductive pads are arranged on the inside of the first substrate, and a plurality of second electrically conductive pads are arranged on the inside of the second substrate. An electrically conductive glue is arranged between the first electrically conductive pads and the second electrically conductive pads, and the first electrically conductive pads each include a first body, the second electrically conductive pads each include a second body, and the first body and/or the second body includes a hollow portion or portions. The electrically conductive pads with a hollow portion(s) allowing light rays to illuminate and solidify the electrically conductive for bonding and interconnecting the upper and lower electrically conductive pads.
摘要翻译：用于导电焊盘的连接装置包括第一基板和相对布置的第二基板，其中多个第一导电焊盘布置在第一基板的内部，并且多个第二导电焊盘布置在内部的第二基板。导电胶被布置在第一导电焊盘和第二导电焊盘之间，并且第一导电焊盘各自包括第一主体，第二导电焊盘各自包括第二主体，并且第一主体和/或第二主体包括中空部分。具有中空部分的导电焊盘允许光线照亮并固化导电以便粘接和互连上部和下部导电焊盘。

73. 发明申请

US20140376196A1 METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST TWO PRINTED CIRCUIT BOARD REGIONS, AND PRINTED CIRCUIT BOARD 有权
标题翻译：生产印刷电路板的方法，包括至少两个印刷电路板区域和印刷电路板
公开(公告)号：US20140376196A1
公开(公告)日：2014-12-25
申请号：US14368623
申请日：2012-12-28
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Volodymyr Karpovych , Johannes Stahr
IPC分类号： H05K3/46 , H05K1/11 , H05K1/18
CPC分类号： H05K3/4611 , H05K1/11 , H05K1/142 , H05K1/18 , H05K3/368 , H05K3/403 , H05K3/4694 , H05K2201/09045 , H05K2201/0919 , H05K2201/09572 , H05K2201/1059 , H05K2201/209 , Y10T29/49126
摘要： The invention relates to a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. According to the invention, at least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface, whereby a simple and reliable lateral electrical coupling between printed circuit board regions to be connected to each other is rendered possible. The invention further relates to such a printed circuit board.
摘要翻译：本发明涉及一种用于制造由至少两个印刷电路板区域组成的印刷电路板的方法，其中印刷电路板区域各自包括至少一个导电层和/或至少一个导电部件，其中印刷电路板区域彼此连接，在每种情况下，至少一个彼此直接相邻的侧表面的区域通过机械联接相互连接。根据本发明，导电层的至少一个子区域或连接端口和/或该部件的导电元件在侧面处彼此导电耦合，从而在印刷之间形成简单且可靠的横向电耦合使彼此连接的电路板区域成为可能。本发明还涉及这种印刷电路板。

74. 发明授权

US08866270B2 Method of manufacturing semiconductor device mounting structure 有权
标题翻译：制造半导体器件安装结构的方法
公开(公告)号：US08866270B2
公开(公告)日：2014-10-21
申请号：US14203912
申请日：2014-03-11
申请人： Fujitsu Limited
发明人： Manabu Watanabe , Masateru Koide , Kenji Fukuzono , Takashi Kanda
IPC分类号： H01L21/00 , H01L21/50
CPC分类号： H01L21/50 , H01L21/82 , H01L29/06 , H01L2924/15311 , H01L2924/19106 , H05K1/141 , H05K3/323 , H05K3/368 , H05K2201/2018
摘要： A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate.
摘要翻译：半导体器件安装结构包括：其中设置有开口的基板; 框架构件，其具有框架体和从框架体突出的突出部分，框体形成并容纳在围绕开口的凹槽中; 无芯基板，设置在所述基板的上方并由所述框架部件的突出部支撑; 以及设置在无芯基板上的半导体元件。

75. 发明申请

US20140268596A1 Flexible Metal Interconnect Structure 有权
标题翻译：柔性金属互连结构
公开(公告)号：US20140268596A1
公开(公告)日：2014-09-18
申请号：US13802701
申请日：2013-03-13
申请人： PALO ALTO RESEARCH CENTER INCORPORATED
发明人： Eugene M. Chow , Dirk DeBruyker
IPC分类号： H05K1/02
CPC分类号： H01L23/5387 , H01L23/49811 , H01L23/5385 , H01L2924/0002 , H05K1/0283 , H05K1/113 , H05K1/189 , H05K3/365 , H05K3/368 , H05K3/4092 , H05K2201/0311 , H05K2201/0397 , H01L2924/00
摘要： A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside (facing) surfaces of the flexible material layers. Compliant micro-contact elements such as micro-springs provide sliding metal pressure contacts that maintain electrical connections between the islands during stretching of the composite sheet. Specifically, at least two micro-contact elements are attached to each metal island in one of the rows, with one element in sliding pressure contact with an associated first metal island in the opposing row and the second element in sliding pressure contact with an associated second metal island. The islands and sliding contacts can be patterned into high density traces that accommodate large strains.
摘要翻译：用于在柔性电子器件中的IC器件之间传输信号的柔性金属互连结构形成在层叠在一起形成多层柔性衬底的两个柔性柔性材料层之间。互连结构由连接到柔性材料层的内侧（面向）表面的两排间隔开的导电焊盘（金属岛）形成。合适的微接触元件例如微弹簧提供滑动金属压力接触件，其在拉伸复合片材期间保持岛之间的电连接。具体地，至少两个微接触元件附接到行中的一个中的每个金属岛，其中一个元件与相对行中的相关联的第一金属岛滑动压力接触，并且第二元件与相关联的第二元件滑动压力接触金属岛。岛和滑动触点可以被图案化成适应大应变的高密度迹线。

76. 发明申请

US20140262451A1 WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：接线基板及其制造方法
公开(公告)号：US20140262451A1
公开(公告)日：2014-09-18
申请号：US14289401
申请日：2014-05-28
申请人： YAZAKI CORPORATION
发明人： Akira HARAO , Mototatsu MATSUNAGA , Yasuhiro SUGIURA , Minoru KUBOTA
IPC分类号： H05K1/02 , H05K3/10 , H05K1/11
CPC分类号： H05K1/0204 , H01L23/49861 , H01L2224/05571 , H01L2224/48091 , H01L2225/1094 , H01R12/728 , H05K1/0203 , H05K1/05 , H05K1/056 , H05K1/11 , H05K1/14 , H05K3/10 , H05K3/202 , H05K3/3447 , H05K3/368 , H05K7/1046 , H05K2201/09009 , H05K2201/09063 , H05K2201/10757 , H05K2201/10787 , H05K2203/025 , Y10T29/49147 , Y10T29/49155
摘要： Disclosed is wiring substrate and method of manufacturing thereof, the wiring substrate including a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a window section formed in the substrate; and a connection terminal extended from an inside surface portion of the window section and bending in a direction perpendicular to a surface of the substrate.
摘要翻译：公开了布线基板及其制造方法，所述布线基板包括具有高导热层的基板，其中所述基板的前表面和后表面中的至少一个是用于各种部件的安装表面; 形成在所述基板中的窗部; 以及从所述窗部的内表面部分延伸并在垂直于所述基板的表面的方向上弯曲的连接端子。

77. 发明授权

US08824164B2 Laminate printed board and manufacturing method thereof 有权
标题翻译：层叠印刷电路板及其制造方法
公开(公告)号：US08824164B2
公开(公告)日：2014-09-02
申请号：US13550883
申请日：2012-07-17
申请人： Tsuyoshi Sakita
发明人： Tsuyoshi Sakita
IPC分类号： H05K1/14 , H05K3/36
CPC分类号： H05K3/368 , H05K1/141 , H05K2201/042 , H05K2201/10303 , Y10T29/49126 , Y10T29/4913 , Y10T29/53174
摘要： The present invention provides a laminate printed board having a novel structure that is able to ensure alignment accuracy of the interboard terminals soldered to one printed board and that is also able to achieve a simplification of the process of soldering the interboard terminals. Through-hole lines in which a plurality of through-holes extend in lines are formed on a first printed board. Additionally, a press-fitting fastener hole is formed within the through-hole lines and a first end of an interboard terminal is press-fitted and fastened to the press-fitting fastener hole. Additionally, first ends of others of the interboard terminals are inserted through and flow soldered to through-holes on the first printed board.
摘要翻译：本发明提供了具有能够确保焊接到一个印刷电路板的板间端子的对准精度的新型结构的层叠印刷电路板，并且也能够实现对板间端子的焊接工序的简化。在第一印刷电路板上形成有多个通孔在其中延伸的通孔线。此外，在通孔线内部形成有压入式紧固件孔，并且将板间端子的第一端压配合并紧固到压配合件孔。此外，其间的板间端子的第一端插入并流动焊接到第一印刷电路板上的通孔。

78. 发明申请

US20140233188A1 MOUNTING STRUCTURE FOR PRINTED CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE USING SUCH STRUCTURE 有权
标题翻译：印刷电路板的安装结构和使用这种结构的半导体器件
公开(公告)号：US20140233188A1
公开(公告)日：2014-08-21
申请号：US14349023
申请日：2012-09-18
申请人： FUJI ELECTRIC CO., LTD.,
发明人： Noriho Terasawa , Yasuyuki Momose
IPC分类号： H01L23/34 , H05K7/02
CPC分类号： H01L23/34 , H01L23/049 , H01L23/36 , H01L23/3735 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/19041 , H01L2924/19042 , H01L2924/19105 , H05K1/0271 , H05K3/368 , H05K7/02 , H05K7/142 , H05K7/1432 , H05K2201/2036 , H05K2201/2045 , H05K2201/2072 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A mounting structure for a printed circuit board, includes a printed circuit board to which a heavy material is fixed; a fixing member fixed to the printed circuit board immediately below the heavy material; and a receiving member fixed to a main body. A bottom portion of the fixing member is disposed in the receiving member, and fixed to the receiving member by a resin adhesive.
摘要翻译：一种用于印刷电路板的安装结构，包括固定有重材料的印刷电路板; 固定件，紧固在重材料正下方的印刷电路板上; 以及固定到主体的接收构件。固定构件的底部设置在接收构件中，并通过树脂粘合剂固定到接收构件。

79. 发明授权

US08774734B1 Module that can be used as a plug-in module and as a solder-down module 失效
标题翻译：可用作插件模块和焊接模块的模块
公开(公告)号：US08774734B1
公开(公告)日：2014-07-08
申请号：US12830174
申请日：2010-07-02
申请人： Mark Rich , Dieter Statezni , Michael Green
发明人： Mark Rich , Dieter Statezni , Michael Green
IPC分类号： H04B1/38 , H04B1/40
CPC分类号： H04B1/40 , H05K1/0243 , H05K1/0268 , H05K1/141 , H05K3/368 , H05K3/403 , H05K2201/10098 , H05K2203/162
摘要： A modular device includes a first printed circuit board and a wireless transceiver (e.g., a radio). Electrical connectors (e.g., pads) are located along multiple edges of the first printed circuit board. The electrical connectors are in locations that correspond to a land pattern on a second printed circuit board. Along one edge of the first printed circuit board, the electrical connectors also correspond to electrical connections in a socket. For certification testing, for example, the device can be plugged into a socket. For installation in a host device, the device can be soldered down to the second printed circuit board.
摘要翻译：模块化装置包括第一印刷电路板和无线收发器（例如，无线电）。电连接器（例如，焊盘）沿着第一印刷电路板的多个边缘定位。电连接器位于对应于第二印刷电路板上的焊盘图案的位置。沿着第一印刷电路板的一个边缘，电连接器也对应于插座中的电连接。对于认证测试，例如，设备可以插入插座。为了安装在主机设备中，可以将设备焊接到第二个印刷电路板。

80. 发明申请

US20140184019A1 CIRCUIT MODULE AND COMPOSITE CIRCUIT MODULE 有权
标题翻译：电路模块和复合电路模块
公开(公告)号：US20140184019A1
公开(公告)日：2014-07-03
申请号：US14176392
申请日：2014-02-10
申请人： Murata Manufacturing Co., Ltd.
发明人： Syuji YAMATO
IPC分类号： H01L41/053
CPC分类号： H01L41/053 , H03H9/0576 , H03H9/725 , H05K1/141 , H05K3/284 , H05K3/3436 , H05K3/368 , H05K2201/10083
摘要： A circuit module and a composite circuit module, which suppress or prevent damage to a connection to or within a device when heat is applied, includes a SAW filter including a piezoelectric substrate. In a package substrate that is a resin substrate, the SAW filter is mounted. A mounting substrate is a multilayer substrate mounted on a mother substrate, and the package substrate is mounted therein.
摘要翻译：在施加热量时抑制或防止对器件的连接的损坏的电路模块和复合电路模块包括具有压电基板的SAW滤波器。在作为树脂基板的封装基板中，安装SAW滤波器。安装基板是安装在母基板上的多层基板，其中安装有封装基板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式