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71. 发明授权

US07422440B2 Method and apparatus for determining a position of a location dependent device 有权
标题翻译：用于确定位置相关设备的位置的方法和装置
公开(公告)号：US07422440B2
公开(公告)日：2008-09-09
申请号：US10679180
申请日：2003-10-03
申请人： William L. Black , Steven J. Marian
发明人： William L. Black , Steven J. Marian
IPC分类号： H01R12/00
CPC分类号： H05K1/0268 , H04L12/403 , H04L2012/40273 , H05K1/189 , H05K2201/1009 , H05K2203/168 , H05K2203/304
摘要： The present invention provides an interconnect for a location dependent device. The interconnect includes at least one bus adapted to provide at least one bus signal to the location dependent device and a plurality of electrical contacts external to the location dependent device and capable of providing a signal indicative of a physical location of the location dependent device when the location dependent device is installed.
摘要翻译：本发明提供了一种用于位置相关设备的互连。互连包括至少一个总线，其适于向位置相关设备提供至少一个总线信号，以及在位置相关设备外部提供多个电触点，并能够提供指示位置相关设备的物理位置的信号安装位置相关设备

72. 发明申请

US20080197504A1 SINGLE-SIDED, FLAT, NO LEAD, INTEGRATED CIRCUIT PACKAGE 有权
标题翻译：单面，平面，无引线，集成电路封装
公开(公告)号：US20080197504A1
公开(公告)日：2008-08-21
申请号：US11697260
申请日：2007-04-05
申请人： Jeff Alan Gordon , Steven Hass , Hal Kurkowski , Scott Jones
发明人： Jeff Alan Gordon , Steven Hass , Hal Kurkowski , Scott Jones
IPC分类号： H01L23/50 , H01L21/00
CPC分类号： H01L24/46 , H01L23/32 , H01L24/48 , H01L24/85 , H01L2224/48091 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H05K3/325 , H05K2201/10636 , H05K2203/168 , Y02P70/611 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An integrated circuit package comprising an enclosure including a dielectric housing, a first electrical contact, and a second electrical contact. The dielectric housing, the first electrical contact, and the second electrical contact are configured to form a contact side of the enclosure. In addition, the first and second electrical contacts are sized to be substantially alignment insensitive for electro-mechanical connection to corresponding contacts of an end-use equipment. The enclosure encapsulates an integrated circuit die which is electrically coupled to the first and second electrical contacts. The alignment insensitive first and second electrical contacts may be electro-mechanically connected to corresponding contacts of an end-use equipment (e.g., a printer). Further, the integrated circuit package may be hosted by a peripheral device (e.g., a printer cartridge).
摘要翻译：一种集成电路封装，包括包括绝缘壳体，第一电触头和第二电触头的外壳。绝缘壳体，第一电触点和第二电触头被配置成形成外壳的接触侧。此外，第一和第二电触头的尺寸被设计成基本对准不对终端用途设备的相应触点进行机电连接的对准。封装封装集成电路管芯，该集成电路管芯电耦合到第一和第二电触点。对准不敏感的第一和第二电触点可以电机械连接到最终用途设备（例如打印机）的相应触点。此外，集成电路封装可以由外围设备（例如，打印机墨盒）托管。

73. 发明申请

US20080153352A1 Electrical Connector 有权
标题翻译：电气连接器
公开(公告)号：US20080153352A1
公开(公告)日：2008-06-26
申请号：US12041185
申请日：2008-03-03
申请人： Dan Harkabi , Gidon Elazar , Nehemiah Weingarten
发明人： Dan Harkabi , Gidon Elazar , Nehemiah Weingarten
IPC分类号： H01R13/648
CPC分类号： H01R27/00 , H01R12/721 , H01R13/6315 , H01R24/62 , H01R2107/00 , H05K1/117 , H05K2201/09145 , H05K2203/1572 , H05K2203/168
摘要： An electrical connector, for example a connector that will operate with the Universal Serial Bus, is disclosed. In some embodiments, the connector includes none, one, or several tongue board, tongue tip, electrical contact, housing shell, insulating strip on the inner lining of housing shell, protective edge. A connector integral to a printed circuit board is also disclosed. Other embodiments are disclosed.
摘要翻译：公开了一种电连接器，例如将使用通用串行总线进行操作的连接器。在一些实施例中，连接器包括没有，一个或多个舌板，舌尖，电接触，壳体壳，壳体壳体内衬上的绝缘条，保护边缘。还公开了与印刷电路板集成的连接器。公开了其他实施例。

74. 发明授权

US07357646B1 Removable electronic assembly that requires validation 失效
标题翻译：需要验证的可移动电子组件
公开(公告)号：US07357646B1
公开(公告)日：2008-04-15
申请号：US11130626
申请日：2005-05-16
申请人： Kong-Chen Chen
发明人： Kong-Chen Chen
IPC分类号： H01R12/00 , H05K1/00
CPC分类号： H05K1/141 , H05K2201/049 , H05K2201/10303 , H05K2201/10325 , H05K2203/168
摘要： A dual-in-line adaptor for mounting an electronic assembly that requires validation includes a pair of substantially parallel pin strips mounted to a first side of a dual-in-line adaptor circuit board and a first land pattern on at least one of the first side and a second side of the dual-in-line adaptor circuit board. The second side opposing the first side and the first land pattern corresponding to a second land pattern on the electronic assembly that requires validation. A method for testing an electronic assembly that requires validation using a dual-in-line adaptor is also described.
摘要翻译：用于安装需要验证的电子组件的双列直插式适配器包括一对安装在双列直插式适配器电路板的第一侧上的基本上平行的引脚条，并且在第一侧和第二侧的双列直插适配器电路板。与电子组件上需要验证的第一面相对的第二面和对应于电子组件上的第二焊盘图案的第一焊盘图案。还描述了使用双列直插适配器来测试需要验证的电子组件的方法。

75. 发明申请

US20070267964A1 A Light Unit with Staggered Electrodes 有权
标题翻译：具有交错电极的灯单元
公开(公告)号：US20070267964A1
公开(公告)日：2007-11-22
申请号：US11459377
申请日：2006-07-24
申请人： Jiahn-Chang WU
发明人： Jiahn-Chang WU
IPC分类号： H01J1/62 , H01J63/04
CPC分类号： H01L33/62 , H01L2224/48091 , H01L2224/48247 , H05K3/308 , H05K2201/09309 , H05K2201/10106 , H05K2201/10651 , H05K2203/168 , H01L2924/00014
摘要： A staggered light unit has a top-bottom electrode lead. The light unit is insertable into a substrate having a metal/insulation/metal sandwich structure.
摘要翻译：交错的光单元具有顶部 - 底部电极引线。光单元可插入具有金属/绝缘/金属夹层结构的基板中。

76. 发明授权

US07289332B2 Mirror image electrical packages and system for using same 有权
标题翻译：镜像电气封装和使用相同的系统
公开(公告)号：US07289332B2
公开(公告)日：2007-10-30
申请号：US10869533
申请日：2004-06-16
申请人： Charles Clark
发明人： Charles Clark
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H01L23/50 , H01L2924/0002 , H01L2924/3011 , H05K1/181 , H05K2201/10522 , H05K2201/10545 , H05K2201/10689 , H05K2203/161 , H05K2203/168 , Y02P70/611 , H01L2924/00
摘要： A mirror image package is disclosed along with several embodiments for using such package in connection with a normal package. Embodiments include side-by-side and top-over-bottom mounting arrangements. Embodiments also include color or graphic coding so that normal and mirror image chips may be easily distinguished.
摘要翻译：公开了一种镜像封装以及与正常封装结合使用这种封装件的若干实施例。实施例包括并排和顶部 - 底部安装布置。实施例还包括彩色或图形编码，使得可以容易地区分普通和镜像芯片。

77. 发明授权

US07164195B2 Semiconductor device and semiconductor device manufacturing method 失效
标题翻译：半导体器件和半导体器件制造方法
公开(公告)号：US07164195B2
公开(公告)日：2007-01-16
申请号：US10929373
申请日：2004-08-31
申请人： Yuuki Furuya , Akihisa Iguchi , Kentarou Arai
发明人： Yuuki Furuya , Akihisa Iguchi , Kentarou Arai
IPC分类号： H01L23/48
CPC分类号： H01L24/10 , H01L21/6835 , H01L21/6836 , H01L23/3114 , H01L23/544 , H01L24/13 , H01L24/27 , H01L2221/68322 , H01L2221/68327 , H01L2223/54406 , H01L2223/5442 , H01L2223/54426 , H01L2223/54473 , H01L2223/5448 , H01L2224/0401 , H01L2224/0603 , H01L2224/13 , H01L2224/13022 , H01L2224/13099 , H01L2224/1403 , H01L2224/16 , H01L2224/274 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/014 , H01L2924/12042 , H05K1/0266 , H05K3/303 , H05K3/3436 , H05K2201/09381 , H05K2201/094 , H05K2203/168 , Y02P70/613 , H01L2924/00
摘要： In a semiconductor device including a semiconductor wafer having a first main surface where a circuit element is formed, electrode pads are formed at an upper portion of the first main surface of the semiconductor wafer electrically connected with the circuit element. Index marks are formed on a second main surface of the semiconductor wafer that is opposite the first main surface. The index marks consist of line segments and indicate a direction along which the semiconductor device is to be mounted.
摘要翻译：在包括具有形成有电路元件的第一主表面的半导体晶片的半导体器件中，电极焊盘形成在与电路元件电连接的半导体晶片的第一主表面的上部。指示标记形成在与第一主表面相对的半导体晶片的第二主表面上。索引标记由线段组成，并表示半导体器件要安装的方向。

78. 发明授权

US07134918B2 Electrical connector assembly 失效
标题翻译：电连接器总成
公开(公告)号：US07134918B2
公开(公告)日：2006-11-14
申请号：US11148531
申请日：2005-06-08
申请人： Ning Wang , Zhi-giang Chen
发明人： Ning Wang , Zhi-giang Chen
IPC分类号： H01R13/64
CPC分类号： H05K1/182 , H01R12/722 , H01R13/64 , H05K2201/10189 , H05K2201/10446 , H05K2201/10568 , H05K2203/167 , H05K2203/168
摘要： An electrical connector assembly comprises a first connector (1) and a second connector (1′) having a same configuration with a housing (30, 30′) and a mounting face (34, 34′) adapted for mounting onto a printed circuit board PCB (100) except for a distinguishable portion (353, 353′) provided on the housing (30, 30′) adjacent to the mounting face (34, 34′) thereof. The first connector (1) is not able to be regarded as the second connector (1′) to be mounted onto the PCB (100) due to the different distinguishable portions (353, 353′) of the first and second connectors (1,1′).
摘要翻译：电连接器组件包括具有与壳体（30,30'）相同构造的第一连接器（1）和第二连接器（1'）和适于安装到印刷电路板上的安装面（34,34'） PCB（100）除了设置在与其安装面（34,34'）相邻的壳体（30,30'）上的可区分部分（353,335'）之外。由于第一连接器（1）和第二连接器（1）的不同的可区分部分（353,353'）不能将第一连接器（1）视为要安装到PCB（100）上的第二连接器（1' 1'）。

79. 发明申请

US20060158824A1 Composite electronic component 审中-公开
标题翻译：复合电子元件
公开(公告)号：US20060158824A1
公开(公告)日：2006-07-20
申请号：US10548651
申请日：2004-03-03
申请人： Keiji Kawajiri , Tomohisa Okimoto , Eiji Koga
发明人： Keiji Kawajiri , Tomohisa Okimoto , Eiji Koga
IPC分类号： H01G2/12
CPC分类号： H01G2/24 , H01F17/0013 , H01G4/40 , H05K1/0266 , H05K3/303 , H05K3/3442 , H05K2203/082 , H05K2203/168 , Y02P70/613
摘要： A composite electronic component which can adjust a capacitance obtained due to an overlap of inner layer capacitor electrode parts sandwiching dielectric sheets by changing an overlapping area of the inner layer capacitor electrode parts, and in which an identification mark has been provided lower than a height of an external electrode of a laminated body, whereby an adjustment of an electric capacitance is easy and, by the fact that the identification mark does not protrude, a mounting performance when the composite electronic component is mounted by being sucked by a suction nozzle is improved.
摘要翻译：一种复合电子部件，其可以通过改变内层电容器电极部分的重叠面积来调节由于内层电容器电极部分的重叠而获得的电容，所述内层电容器电极部分通过改变内层电容器电极部分的重叠面积而设置，并且其中设置了识别标记，层叠体的外部电极，容易调节电容，并且通过识别标记不突出的事实，提高了通过吸嘴吸附复合电子部件的安装性能。

80. 发明授权

US07019982B2 Foolproof polarity indications of poled electronic parts or devices in printed circuit board 失效
标题翻译：印刷电路板中极化电子部件或器件的防止极性指示
公开(公告)号：US07019982B2
公开(公告)日：2006-03-28
申请号：US10452455
申请日：2003-06-03
申请人： Kazuyuki Nagata
发明人： Kazuyuki Nagata
IPC分类号： H05K1/00 , H05K1/18 , H05K7/02 , H05K7/06 , H05K7/08
CPC分类号： H05K1/0266 , H05K1/0295 , H05K1/18 , H05K2201/09936 , H05K2201/09954 , H05K2201/10015 , H05K2201/10174 , H05K2201/10204 , H05K2201/10522 , H05K2203/168
摘要： A foolproof polarity indication for poled electronics parts or devices to be mounted to a printed circuit board assures that the poled electronics parts and/or devices are correctly mounted with respect of their polarities to meet occasional requirements dependent on different specifications. Each pair of terminal holes is allotted to a given poled electronics part or device. Two symbols representative of such electronics part or device are arranged side by side on either side of a line drawn from one terminal hole to the other terminal hole. The poled electronics part or device symbols are of reversed polarities. This dual symbol arrangement is effective to draw a worker's attention in the mounting of electrode components in terms of their polarities. When extra components or dummy components are combined with such a poled component, they are encircled by a boundary line, thereby showing the correct polarity direction of the poled component with respect to whether it is enclosed or not.
摘要翻译：用于安装到印刷电路板的极化电子部件或设备的绝对极性指示确保极化的电子部件和/或设备相对于它们的极性被正确地安装以满足取决于不同规格的偶尔要求。每对终端孔分配给给定的极化电子部件或设备。代表这种电子部件或装置的两个符号并列地布置在从一个端子孔到另一个端子孔的线的任一侧上。极化的电子部件或器件符号具有相反的极性。这种双重符号排列在使用工作人员的极性方面有助于注意电极组件的安装。当额外的部件或虚拟部件与这种极化部件组合时，它们被边界线包围，从而显示极化部件相对于是否被封闭的正确的极性方向。

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