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71. 发明授权

US08604622B2 Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device 有权
标题翻译：半导体芯片封装，半导体芯片组装及其制造方法
公开(公告)号：US08604622B2
公开(公告)日：2013-12-10
申请号：US13495687
申请日：2012-06-13
申请人： Thorsten Meyer , Markus Brunnbauer , Jens Pohl
发明人： Thorsten Meyer , Markus Brunnbauer , Jens Pohl
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40
CPC分类号： H01L21/565 , H01L21/561 , H01L21/568 , H01L24/19 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/24146 , H01L2224/32145 , H01L2224/73267 , H01L2224/83101 , H01L2224/92244 , H01L2224/97 , H01L2225/06524 , H01L2225/06548 , H01L2225/06565 , H01L2225/06568 , H01L2225/06586 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , H01L2924/15311 , H01L2924/181 , H01L2924/19042 , H01L2924/19043 , H05K1/185 , H05K2201/09118 , H05K2201/10515 , H05K2201/10674 , H05K2203/016 , H05K2203/1316 , H05K2203/1469 , H01L2224/82 , H01L2924/00
摘要： A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element.
摘要翻译：公开了一种制造器件，半导体芯片封装和半导体芯片组件的方法。一个实施例包括在第一成形元件上施加至少一个半导体芯片。至少一个元素被应用在第二个表单元素上。在至少一个半导体芯片上和该至少一个元件上施加材料。

72. 发明授权

US08592997B2 Molded underfill flip chip package preventing warpage and void 有权
标题翻译：成型底部填充倒装芯片封装，防止翘曲和空隙
公开(公告)号：US08592997B2
公开(公告)日：2013-11-26
申请号：US12916677
申请日：2010-11-01
申请人： Hae-jung Yu , Hyeong-seob Kim , Jong-ho Lee , Jin-woo Park
发明人： Hae-jung Yu , Hyeong-seob Kim , Jong-ho Lee , Jin-woo Park
IPC分类号： H01L23/28
CPC分类号： H01L23/13 , H01L21/563 , H01L23/3128 , H01L23/562 , H01L2224/16225 , H01L2224/73203 , H01L2924/3511 , H05K1/0271 , H05K3/1225 , H05K3/284 , H05K2201/09063 , H05K2203/1316
摘要： A molded underfill flip chip package may include a printed circuit board, a semiconductor chip mounted on the printed circuit board, and a sealant. The printed circuit board has at least one resin passage hole passing through the printed circuit board and at least one resin channel on a bottom surface of the printed circuit board, the at least one resin channel extending from the at least one resin passage hole passing through the printed circuit board. The sealant seals a top surface of the printed circuit board, the semiconductor chip, the at least one resin passage hole, and the at least one resin channel.
摘要翻译：模制底部填充倒装芯片封装可以包括印刷电路板，安装在印刷电路板上的半导体芯片和密封剂。印刷电路板具有穿过印刷电路板的至少一个树脂通孔和印刷电路板的底表面上的至少一个树脂通道，所述至少一个树脂通道从至少一个树脂通道孔延伸通过印刷电路板。密封剂密封印刷电路板，半导体芯片，至少一个树脂通孔和至少一个树脂通道的顶表面。

73. 发明授权

US08567050B2 Single shot molding method for COB USB/EUSB devices with contact pad ribs 有权
标题翻译：具有接触垫肋骨的COB USB / EUSB设备的单次成型方法
公开(公告)号：US08567050B2
公开(公告)日：2013-10-29
申请号：US13274188
申请日：2011-10-14
申请人： Siew S. Hiew , Abraham C. Ma , Nan Nan
发明人： Siew S. Hiew , Abraham C. Ma , Nan Nan
IPC分类号： H05K3/34
CPC分类号： G06F1/1632 , H01L24/97 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , H01L2924/19041 , H01R12/57 , H05K1/117 , H05K3/0052 , H05K3/284 , H05K3/326 , H05K3/4046 , H05K5/0278 , H05K2201/0311 , H05K2201/09472 , H05K2203/1316 , Y10T29/49124 , Y10T29/49144 , Y10T29/49155 , Y10T29/49158 , Y10T29/4916 , Y10T29/53209 , H01L2224/85 , H01L2924/00014
摘要： A dual-personality extended USB (EUSB) system supports both USB and EUSB memory cards using an extended 9-pin EUSB socket. Each EUSB device 101 includes a PCBA having four standard USB metal contact pads disposed on an upper side of a PCB, and several extended purpose contact springs that extend through openings defined in the PCB. A single-shot molding process is used to form both an upper housing portion on the upper PCB surface that includes ribs extending between adjacent contact pads, and a lower molded housing portion that is formed over passive components and IC dies disposed on the lower PCB surface. The passive components are mounted using SMT methods, and the IC dies are mounted using COB methods. The extended 9-pin EUSB socket includes standard USB contacts and extended use contacts that communicate with the PCBA through the standard USB metal contacts and the contact springs.
摘要翻译：双重个性扩展USB（EUSB）系统支持使用扩展的9针EUSB插座的USB和EUSB存储卡。每个EUSB装置101包括PCBA，PCBA具有布置在PCB的上侧上的四个标准USB金属接触垫，以及延伸通过PCB中限定的开口的多个扩展用途接触弹簧。使用单次成型工艺来形成上PCB表面上的上壳体部分，其包括在相邻接触垫之间延伸的肋，以及形成在无源部件上的下模制壳体部分和设置在下PCB表面上的IC管芯。使用SMT方法安装无源部件，并使用COB方法安装IC管芯。扩展的9针EUSB插座包括通过标准USB金属触点和接触弹簧与PCBA通信的标准USB触点和扩展使用触点。

74. 发明申请

US20130193592A1 Coating Method for an Optoelectronic Chip-on-Board Module 有权
标题翻译：光电芯片模块的涂覆方法
公开(公告)号：US20130193592A1
公开(公告)日：2013-08-01
申请号：US13818868
申请日：2011-08-29
申请人： Michael Peil , Florin Oswald , Harald Maiweg
发明人： Michael Peil , Florin Oswald , Harald Maiweg
IPC分类号： H01L33/54 , H01L31/0203
CPC分类号： H01L31/0203 , F21K9/00 , F21K9/90 , F21Y2115/10 , H01L21/56 , H01L23/3121 , H01L25/0753 , H01L25/13 , H01L31/02322 , H01L31/02325 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2924/1815 , H01L2933/005 , H05K3/284 , H05K2201/0108 , H05K2201/0162 , H05K2201/10106 , H05K2201/10121 , H05K2201/10151 , H05K2203/1316 , H01L2924/00
摘要： A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone.
摘要翻译：提出了一种用于涂覆光电芯片组件模块的方法，该模块包括平坦衬底，所述平坦衬底填充有一个或多个具有至少一个主要光学布置和可选择的至少一个次级光学布置的光电子部件。通过以下步骤，将由硅树脂制成的透明耐紫外线和耐温涂层涂覆在光电芯片模块上：（a）将液体硅胶浇铸到朝向顶部打开的模具中，并具有相应的外部尺寸达到或超过衬底的外部尺寸; （b）将基底插入模具中，其中光电子部件完全浸入硅树脂中，并且基底的表面完全接触硅树脂或基底至少部分地以完全表面接触的方式浸入硅树脂中; （c）固化和交联硅氧烷与光电子部件和基底; 和（d）用固化的硅氧烷涂层从模具中除去基材。

75. 发明申请

US20130161800A1 PCB FOR MUF AND MOLDING STRUCTURE OF THE PCB 审中-公开
标题翻译：印刷电路板用于印刷电路板和模具结构的PCB
公开(公告)号：US20130161800A1
公开(公告)日：2013-06-27
申请号：US13674328
申请日：2012-11-12
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Hak-kyoon BYUN , Tae-hun KIM , Ji-hyun PARK , Byung-cheol JEON , Seung-jin CHEON
IPC分类号： H01L23/18
CPC分类号： H01L23/18 , H01L21/561 , H01L21/565 , H01L23/3121 , H01L25/0652 , H01L25/0655 , H01L2224/16145 , H01L2224/16225 , H01L2924/01327 , H01L2924/18161 , H05K3/284 , H05K2203/1316 , H05K2203/1327 , H01L2924/00
摘要： A printed circuit board (PCB) for molded underfill (MUF) and a PCB molding structure that may expand a range of applying the PCB and may resolve a problem of generation of a void during manufacturing of a semiconductor package. The PCB includes: a molding area on which a plurality of semiconductor chips are mounted and that is sealed; and a peripheral area that is formed around the molding area, contacts a mold for molding during a molding process, and includes a first side adjacent to a portion into which a molding material is injected and a second side that faces the first side that is adjacent to a portion from which air may be discharged, wherein an active area where the semiconductor chips are disposed in the molding area is disposed nearer the first side than to the second side.
摘要翻译：用于模制底部填充物（MUF）的印刷电路板（PCB）和可以扩大施加PCB的范围的PCB模制结构，并且可以解决在制造半导体封装期间产生空隙的问题。 PCB包括：多个半导体芯片安装在其上并被密封的成型区域; 以及围绕成型区域形成的周边区域，在模制过程中与模具接触，并且包括与模制材料注入的部分相邻的第一侧和面向相邻的第一侧的第二侧到可以排出空气的部分，其中在模制区域中设置半导体芯片的有源区域设置在比第二侧更靠近第一侧的位置。

76. 发明授权

US08461698B1 PCB external ground plane via conductive coating 有权
标题翻译： PCB外部接地层通过导电涂层
公开(公告)号：US08461698B1
公开(公告)日：2013-06-11
申请号：US12892617
申请日：2010-09-28
申请人： Brandon C. Hamilton , Alan P. Boone , Guy N. Smith
发明人： Brandon C. Hamilton , Alan P. Boone , Guy N. Smith
IPC分类号： H01L23/28 , H01L23/34 , H05K1/00
CPC分类号： H01L23/3128 , H01L21/563 , H01L23/3121 , H01L23/49883 , H01L23/49894 , H01L23/552 , H01L25/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73265 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H05K1/0218 , H05K3/284 , H05K2201/0715 , H05K2203/049 , H05K2203/1316 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： An integrated circuit assembly (ex.—a flip chip package, a wire bond chip package) is provided which includes a substrate (ex.—a printed circuit board) and a die assembly. The die assembly includes an integrated circuit chip which is connected to the printed circuit board. Further, an external dielectric layer (ex.—a solder mask layer) of the printed circuit board is at least substantially coated with a conductive coating (ex.—a low sintering temperature, nano-particle silver coating). The conductive coating is not in contact with the die assembly and/or passive electronics which are connected to the printed circuit board, however the conductive coating is electrically connected to the printed circuit board. The conductive coating provides (ex—acts as) an external ground plane for the printed circuit board.
摘要翻译：提供集成电路组件（例如，倒装芯片封装，引线接合芯片封装），其包括基板（例如印刷电路板）和模具组件。模具组件包括连接到印刷电路板的集成电路芯片。此外，印刷电路板的外部电介质层（例如焊料掩模层）至少基本上涂覆有导电涂层（例如，低烧结温度，纳米颗粒银涂层）。导电涂层不与连接到印刷电路板的模具组件和/或无源电子器件接触，然而导电涂层电连接到印刷电路板。导电涂层为印刷电路板提供（作为）外部接地平面。

77. 发明申请

US20130135802A1 METHOD AND APPARATUS FOR POTTING AN ELECTRONIC DEVICE 有权
标题翻译：用于电子设备的方法和装置
公开(公告)号：US20130135802A1
公开(公告)日：2013-05-30
申请号：US13751350
申请日：2013-01-28
申请人： ENPHASE ENERGY, INC.
发明人： Martin Fornage
IPC分类号： H05K5/06
CPC分类号： H05K5/064 , H05K3/284 , H05K2203/1316
摘要： Method and apparatus for potting an electronic device. In one embodiment, the method comprises providing an enclosure having a first inner volume with the electronic device disposed therein; placing a fill control element within the enclosure such that a second inner volume of the fill control element is fluidly coupled to the first inner volume; and filling a remaining portion of the first inner volume, the remaining portion not occupied by the electronic device or the fill control element, with a sealant such that air is trapped within at least a first portion of the second inner volume.
摘要翻译：灌封电子装置的方法和装置。在一个实施例中，该方法包括提供具有设置在其中的电子设备的第一内部容积的外壳; 将填充控制元件放置在所述外壳内，使得所述填充控制元件的第二内部容积流体地联接到所述第一内部容积; 并且用密封剂填充第一内部容积的剩余部分，未被电子装置或填充控制元件占据的剩余部分，使得空气被捕获在第二内部容积的至少第一部分内。

78. 发明申请

US20130133412A1 METHOD OF MANUFACTURING A MOLDED SENSOR SUBASSEMBLY 有权
标题翻译：制造传感器模块的方法
公开(公告)号：US20130133412A1
公开(公告)日：2013-05-30
申请号：US13685806
申请日：2012-11-27
申请人： ZF FRIEDRICHSHAFEN AG
发明人： Herbert WALLNER , Roland FRIEDL
IPC分类号： H05K3/28 , G01M13/02
CPC分类号： H05K3/284 , G01M13/02 , H05K2201/10151 , H05K2201/10303 , H05K2203/1316 , Y10T29/49002
摘要： A method of producing an insert molded sensor assembly having at least one sensor element accommodated on a first side of a circuit board of the sensor assembly. During a first step, a plurality of pins are introduced and penetrate through the circuit board. The circuit board, including the at least one sensor element, is then disposed, during a second step, into a two-part insert mold tool so that the pins are supported on both sides of the circuit board in a direction transverse to a plane defined by the circuit board. A defined spacing distance, between a surface of the sensor element and the insert mold tool, is produced by the pins. During a third step of the method, the insert mold tool is filled with insert molding material, particularly a duroplast.
摘要翻译：一种制造插入模制传感器组件的方法，其具有容纳在传感器组件的电路板的第一侧上的至少一个传感器元件。在第一步骤期间，引入多个引脚并穿过电路板。然后，将包括至少一个传感器元件的电路板在第二步骤期间设置成两部分插入式模具，以使销在横向于所定义的平面的方向上被支撑在电路板的两侧由电路板。在传感器元件的表面和插入模具之间的限定的间隔距离由销钉产生。在该方法的第三步骤期间，插入模具具有嵌入成型材料，特别是硬质塑料。

79. 发明申请

US20130082364A1 EMI Package AND METHOD FOR MAKING SAME 有权
标题翻译： EMI封装及其制造方法
公开(公告)号：US20130082364A1
公开(公告)日：2013-04-04
申请号：US13250697
申请日：2011-09-30
申请人： Chuei-Tang Wang , Der-Chyang Yeh
发明人： Chuei-Tang Wang , Der-Chyang Yeh
IPC分类号： H01L23/58 , H01L21/768
CPC分类号： H01L23/552 , H01L21/565 , H01L21/76802 , H01L21/76877 , H01L21/76898 , H01L23/3128 , H01L24/16 , H01L24/64 , H01L25/0655 , H01L25/16 , H01L25/50 , H01L2224/02317 , H01L2224/02372 , H01L2224/02373 , H01L2224/0401 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16235 , H01L2224/81191 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H05K3/284 , H05K2201/0715 , H05K2201/09972 , H05K2201/10378 , H05K2203/1316 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： An integrated circuit structure includes a substrate, a photosensitive molding on a first side of the substrate, a via formed in the molding, and a conformable metallic layer deposited over the first side of the substrate and in the via. A through via may be formed through the substrate aligned with the via in the molding with an electrically conductive liner deposited in the through via in electrical contact with the conformable metallic layer. The integrated circuit structure may further include a connector element such as a solder ball on an end of the through via on a second side of the substrate opposite the first side. The integrated circuit structure may further include a die on the first side of the substrate in electrical contact with another through via or with a redistribution layer.
摘要翻译：集成电路结构包括基板，在基板的第一侧上的感光模制件，在模制件中形成的通孔，以及沉积在基板的第一侧和通孔中的一致的金属层。可以通过在模制件中与通孔对准的基板形成贯通孔，其中导电衬垫沉积在贯通通孔中，以与适形金属层电接触。集成电路结构还可以包括诸如焊球之间的连接器元件，该连接器元件在通孔的端部上，与第一侧相反的第二面上。集成电路结构还可以包括在基板的第一侧上的与另一通孔或再分布层电接触的管芯。

80. 发明申请

US20130077265A1 PRINTED CIRCUIT BOARD ASSEMBLY 有权
标题翻译：印刷电路板组装
公开(公告)号：US20130077265A1
公开(公告)日：2013-03-28
申请号：US13610145
申请日：2012-09-11
申请人： Yong Won Lee , Tae Sang Park , Hvo Young Shin , Ji Young Jang , Young Jun Moon , Soon Min Hong
发明人： Yong Won Lee , Tae Sang Park , Hvo Young Shin , Ji Young Jang , Young Jun Moon , Soon Min Hong
IPC分类号： H05K1/18
CPC分类号： H05K1/147 , H01L2224/16225 , H01L2924/181 , H05K1/148 , H05K1/189 , H05K3/284 , H05K3/323 , H05K3/361 , H05K5/065 , H05K2201/055 , H05K2203/1316 , H01L2924/00012
摘要： A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.
摘要翻译：一种印刷电路板组件，其能够通过使用晶片本身作为印刷电路板而具有安装在晶片级的电子部件，所述印刷电路板组件包括多个电子部件，安装有多个电子部件的印刷电路板其上配置有完全覆盖印刷电路板的保护体，以及连接单元，该连接单元的一端暴露于用于印刷电路板的保护体的外部，以与电路板电连接，其中印刷电路板包括形成有晶片的晶片印刷电路板。

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