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    • 71. 发明授权
    • Seamless earbud structures and methods for making the same
    • 无缝耳塞结构及其制作方法
    • US08965030B2
    • 2015-02-24
    • US13251002
    • 2011-09-30
    • Jonathan Aase
    • Jonathan Aase
    • H04R25/00
    • H04R1/1016H04R1/1058H04R1/1066H04R1/1075H04R2201/105H04R2460/09H04R2460/11Y10T29/49176
    • Seamless earbud structures and methods for making the same are disclosed. Seamless earbud structures can be constructed using an insert molding construction method, which overmolds a cosmetic material over two sub-enclosures that are mated together. The two sub-enclosures form a housing that can encompass a driver assembly (e.g., woofer and tweeter), a conductor bundle, and provide one or more acoustic volumes. The housing has a non-occluding member and a neck member, and has a seamless or nearly seamless construction. The cosmetic material is insert molded around the housing to provide a smooth and seamless surface disposed around the periphery of the housing.
    • 公开了无缝耳塞结构及其制造方法。 无缝耳塞结构可以使用嵌入式成型施工方法来构造,该方法在两个配合在一起的子壳体上包覆模塑化妆品材料。 两个子外壳形成可以包括驱动器组件(例如低音扬声器和高音单元),导体束并提供一个或多个声学体积的壳体。 壳体具有非阻塞构件和颈部构件,并且具有无缝或几乎无缝结构。 化妆品材料被嵌入模制在壳体周围以提供围绕壳体的周边布置的平滑且无缝的表面。