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71. 发明授权

US07819301B2 Bumping electronic components using transfer substrates 有权
标题翻译：使用转移底物冲击电子部件
公开(公告)号：US07819301B2
公开(公告)日：2010-10-26
申请号：US11925493
申请日：2007-10-26
申请人： John Mackay
发明人： John Mackay
IPC分类号： B23K37/00
CPC分类号： B23K37/00 , B23K3/0623 , B23K2101/36 , H01L21/6835 , H01L24/11 , H01L24/742 , H01L2224/11003 , H01L2224/11334 , H01L2224/13099 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H01L2224/0401
摘要： A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of silicone rubber having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.
摘要翻译：一种在电子部件上形成焊料凸点的方法。提供具有多个焊球的转印衬底，将转印衬底设置在电子部件的表面上，加热以将焊球回流到电子部件上; 并去除牺牲衬底。转移衬底可以包括牺牲膜和用掩模图案化的金属层，该掩模用于在转移衬底上形成焊球。或者，转印衬底可以包括具有至少部分地嵌入片材中的焊球的硅橡胶片。公开了一种使用梭机构和取向膜将被凸起部分与转印衬底对准的方法。

72. 发明申请

US20100230475A1 ELECTRICAL INTERCONNECT FORMING METHOD 有权
公开(公告)号：US20100230475A1
公开(公告)日：2010-09-16
申请号：US12787527
申请日：2010-05-26
申请人： Stephen Leslie Buchwalter , Bruce K. Furman , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
发明人： Stephen Leslie Buchwalter , Bruce K. Furman , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
IPC分类号： B23K31/02
CPC分类号： H01L24/16 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/27 , H01L24/28 , H01L24/31 , H01L24/73 , H01L24/81 , H01L24/94 , H01L2221/68377 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/11822 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/136 , H01L2224/16 , H01L2224/16225 , H01L2224/17051 , H01L2224/274 , H01L2224/29111 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3436 , H05K2201/0379 , H05K2201/094 , H05K2201/10234 , H05K2201/10242 , H05K2201/10977 , Y02P70/613 , Y10T29/49165 , H01L2224/45111 , H01L2924/01047 , H01L2224/13099 , H01L2924/01083 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

73. 发明申请

US20100230474A1 ELECTRICAL INTERCONNECT FORMING METHOD 有权
标题翻译：电气互连形成方法
公开(公告)号：US20100230474A1
公开(公告)日：2010-09-16
申请号：US12787503
申请日：2010-05-26
申请人： Stephen Leslie Buchwalter , Bruce K. Furman , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
发明人： Stephen Leslie Buchwalter , Bruce K. Furman , Peter A. Gruber , Jae-Woong Nah , Da-Yuan Shih
IPC分类号： B23K31/02 , B23K1/20
CPC分类号： H01L24/16 , H01L21/563 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/27 , H01L24/28 , H01L24/31 , H01L24/73 , H01L24/81 , H01L24/94 , H01L2221/68377 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/1131 , H01L2224/11334 , H01L2224/114 , H01L2224/116 , H01L2224/11822 , H01L2224/1308 , H01L2224/13082 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1357 , H01L2224/136 , H01L2224/16 , H01L2224/16225 , H01L2224/17051 , H01L2224/274 , H01L2224/29111 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/8121 , H01L2224/81815 , H01L2924/0001 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3436 , H05K2201/0379 , H05K2201/094 , H05K2201/10234 , H05K2201/10242 , H05K2201/10977 , Y02P70/613 , Y10T29/49165 , H01L2224/45111 , H01L2924/01047 , H01L2224/13099 , H01L2924/01083 , H01L2924/00 , H01L2224/29099 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.
摘要翻译：电互连形成方法。电互连包括包括第一导电焊盘的第一衬底，包括第二导电焊盘的第二衬底以及将第一导电焊盘电连接和机械地连接到第二导电焊盘的互连结构。互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

74. 发明授权

US07754529B2 Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method 有权
标题翻译：倒装芯片安装体和安装这种倒装芯片安装体和凸块成型方法
公开(公告)号：US07754529B2
公开(公告)日：2010-07-13
申请号：US11814337
申请日：2006-02-02
申请人： Yoshihiro Tomita , Koichi Hirano , Seiji Karashima , Takashi Ichiryu , Toshio Fujii
发明人： Yoshihiro Tomita , Koichi Hirano , Seiji Karashima , Takashi Ichiryu , Toshio Fujii
IPC分类号： H01L21/00
CPC分类号： H05K3/3436 , H01L21/565 , H01L21/6835 , H01L24/11 , H01L24/742 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/1152 , H01L2224/13099 , H01L2224/16238 , H01L2224/83205 , H01L2224/83801 , H01L2224/83886 , H01L2924/00014 , H01L2924/01006 , H01L2924/01009 , H01L2924/01012 , H01L2924/01019 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/30105 , H05K3/323 , H05K3/3484 , H05K2201/10977 , H05K2203/0285 , Y02P70/613 , H01L2224/05599
摘要： In a flip chip mounted body in which a semiconductor chip (20) having a plurality of electrode terminals (21) is disposed so as to be opposed to a wiring board (10) having a plurality of connection terminals (11), with the connection terminals (11) and the electrode terminals (21) being connected electrically, a resin (13) containing electrically conductive particles (12) is supplied between the connection terminals (11) and the electrode terminals (21), the electrically conductive particles (12) and the resin (13) are heated and melted, and vibrations are applied so as to make them flow. The molten electrically conductive particles (12) are allowed to self-assemble between the connection terminals (11) and the electrode terminals (21), thereby forming connectors (22) that connect them electrically. It becomes more likely that the molten electrically conductive particles in the resin contact the connection terminals or the electrode terminals, whereby the molten electrically conductive particles self-assemble between the electrode terminals and the connection terminals that have a high wettability, making it possible to form connectors for establishing an electric connection between these terminals in a uniform manner.
摘要翻译：在其中具有多个电极端子（21）的半导体芯片（20）设置成与具有多个连接端子（11）的布线板（10）相对的倒装芯片安装体中，连接端子（11）和电极端子（21）电连接，在连接端子（11）和电极端子（21）之间提供包含导电颗粒（12）的树脂（13），导电颗粒（12））和树脂（13）被加热和熔化，并且施加振动以使其流动。允许熔融的导电颗粒（12）在连接端子（11）和电极端子（21）之间自组装，从而形成将它们电连接的连接器（22）。树脂中的熔融的导电性粒子更可能接触连接端子或电极端子，由此熔融的导电性粒子在电极端子和具有高润湿性的连接端子之间自组装，从而形成用于以均匀的方式在这些端子之间建立电连接的连接器。

75. 发明申请

US20100155923A1 Microball assembly methods, and packages using maskless microball assemblies 有权
标题翻译：微球组装方法和使用无孔微球组件的包装
公开(公告)号：US20100155923A1
公开(公告)日：2010-06-24
申请号：US12317587
申请日：2008-12-23
申请人： Erasenthiran Poonjolai , Lakshmi Supriva
发明人： Erasenthiran Poonjolai , Lakshmi Supriva
IPC分类号： H01L23/488 , H01L21/60 , H01L21/326
CPC分类号： H01L24/742 , H01L21/6835 , H01L24/11 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11332 , H01L2224/13099 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/16152 , Y10T29/49155 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method of forming a microball grid array includes adhering a microball precursor material to a transfer medium under conditions to reflect a selective charge pattern. The method includes transferring the microball precursor material from the transfer medium across a gap and to an integrated circuit substrate under conditions to reflect the selective charge pattern. The method includes achieving the microball grid array without the aid of a mask.
摘要翻译：形成微球栅格阵列的方法包括在反映选择性电荷图案的条件下将微球前体材料粘附到转印介质上。该方法包括在反映选择性电荷模式的条件下将微珠前体材料从转印介质跨越间隙转移到集成电路基板。该方法包括在没有掩模的帮助下实现微球栅格阵列。

76. 发明申请

US20100093229A1 MICROELECTRONIC CONTACT STRUCTURE AND METHOD OF MAKING SAME 有权
标题翻译：微电子接触结构及其制造方法
公开(公告)号：US20100093229A1
公开(公告)日：2010-04-15
申请号：US12577444
申请日：2009-10-12
申请人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu
IPC分类号： H01R4/48
CPC分类号： G01R1/06727 , G01R1/06738 , H01L21/6835 , H01L2221/68359 , H01L2224/11003 , H01L2224/111 , H01L2224/11826 , H01L2224/13017 , H01L2224/13018 , H01L2224/13019 , H01L2224/13565 , H01L2224/13582 , H01L2224/819 , H01L2924/01019 , H01L2924/01074 , H01L2924/01078 , H01L2924/14 , H01L2924/1433 , H01L2924/3011 , H01L2924/3025
摘要： Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined on a sacrificial substrate. The openings may be within the surface of the substrate, or in one or more layers deposited on the surface of the sacrificial substrate. Each spring contact element has a base end portion, a contact end portion, and a central body portion. The contact end portion is offset in the z-axis (at a different height) than the central body portion. The base end portion is preferably offset in an opposite direction along the z-axis from the central body portion. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the sacrificial substrate. The spring contact elements are suitably mounted by their base end portions to corresponding terminals on an electronic component, such as a space transformer or a semiconductor device, whereupon the sacrificial substrate is removed so that the contact ends of the spring contact elements extend above the surface of the electronic component. In an exemplary use, the spring contact elements are thereby disposed on a space transformer component of a probe card assembly so that their contact ends effect pressure connections to corresponding terminals on another electronic component, for the purpose of probing the electronic component.
摘要翻译：通过将至少一层金属材料沉积到限定在牺牲衬底上的开口中来制造弹簧接触元件。开口可以在衬底的表面内，或者在沉积在牺牲衬底的表面上的一个或多个层中。每个弹簧接触元件具有基端部分，接触端部分和中心体部分。接触端部在与中心体部分相同的z轴（不同高度）偏移。基端部优选地沿着与中心主体部分的z轴相反的方向偏移。以这种方式，在牺牲基板上以规定的空间关系制造多个弹簧接触元件。弹簧接触元件通过它们的基端部适当地安装在诸如空间变压器或半导体器件的电子部件上的对应端子上，从而去除牺牲基板，使得弹簧接触元件的接触端部在表面上方延伸的电子元件。在示例性用途中，弹簧接触元件因此被布置在探针卡组件的空间变换器部件上，使得它们的接触端在另一电子部件上实现与相应端子的压力连接，以便探测电子部件。

77. 发明申请

US20100089983A1 Forming Solder Balls on Substrates 有权
标题翻译：在基体上形成焊球
公开(公告)号：US20100089983A1
公开(公告)日：2010-04-15
申请号：US12639782
申请日：2009-12-16
申请人： John MacKay , Tom Molinaro
发明人： John MacKay , Tom Molinaro
IPC分类号： B23K31/02 , B23K3/06 , B23K3/08
CPC分类号： B23K35/22 , B23K3/0623 , H01L24/11 , H01L2224/0401 , H01L2224/05551 , H01L2224/05578 , H01L2224/0603 , H01L2224/11003 , H01L2224/1131 , H01L2224/13012 , H01L2224/13028 , H01L2224/13099 , H01L2224/14 , H01L2224/1403 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/351 , H01L2924/00
摘要： A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.
摘要翻译：具有电池（开口）的面罩（模板）设置在加热器台的表面上，然后用焊膏填充（印刷）。然后将基板组装到掩模的相对侧。然后焊膏被回流。这可能会部分颠倒。然后在冷却之前或之后将掩模与基底分离。因此，焊盘形成在衬底上，该衬底可以是半导体晶片。偏置的卡盘促使基底与掩模紧密接触。描述了用焊膏印刷掩模的方法。描述形成高纵横比焊料凸块（包括球和可回流互连结构）的方法。

78. 发明申请

US20100025863A1 Integrated Circuit Interconnect Method and Apparatus 审中-公开
标题翻译：集成电路互连方法与装置
公开(公告)号：US20100025863A1
公开(公告)日：2010-02-04
申请号：US12510650
申请日：2009-07-28
申请人： Peter Alfred Gruber , Jae-Woong Nah
发明人： Peter Alfred Gruber , Jae-Woong Nah
IPC分类号： H01L23/50
CPC分类号： H01L23/49894 , H01L21/563 , H01L21/6835 , H01L23/49811 , H01L23/49816 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/11003 , H01L2224/11334 , H01L2224/13111 , H01L2224/16225 , H01L2224/81192 , H01L2224/8121 , H01L2224/81815 , H01L2924/01006 , H01L2924/01033 , H01L2924/0105 , H01L2924/01055 , H01L2924/01075 , H01L2924/01082 , H01L2924/01087 , H01L2924/01322 , H01L2924/10253 , H01L2924/14 , H01L2924/00
摘要： Techniques for interconnecting an IC chip and a receiving substrate are provided. A method includes the steps of: providing the IC chip, the IC chip including at least a first connection site formed thereon; providing the receiving substrate, the receiving substrate including at least a second connection site formed thereon; forming an alloy structure on at least a portion of an upper surface of the second connection site; orienting the IC chip relative to the receiving substrate so that the at least first connection site is aligned with the alloy deposit formed on the at least second connection site; and forming an electrical connection between the first and second connection sites, the electrical connection comprising a volume of electrically conductive fusible material, wherein a majority of the volume of electrically conductive fusible material is supplied from the alloy structure.
摘要翻译：提供了用于互连IC芯片和接收基板的技术。一种方法包括以下步骤：提供IC芯片，IC芯片至少包括形成在其上的第一连接部位; 提供接收基板，所述接收基板至少包括形成在其上的第二连接部位; 在所述第二连接部位的上表面的至少一部分上形成合金结构; 使所述IC芯片相对于所述接收基板定向，使得所述至少第一连接部位与形成在所述至少第二连接部位上的所述合金沉积物对准; 以及在所述第一和第二连接部位之间形成电连接，所述电连接包括一定体积的导电性易熔材料，其中大部分体积的导电性易熔材料从所述合金结构供给。

79. 发明授权

US07638876B2 Bumpless semiconductor device 失效
标题翻译：无铅半导体器件
公开(公告)号：US07638876B2
公开(公告)日：2009-12-29
申请号：US11486075
申请日：2006-07-14
申请人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
发明人： Yukio Yamada , Masayuki Nakamura , Hiroyuki Hishinuma
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L21/4853 , H01L24/11 , H01L24/13 , H01L2224/05571 , H01L2224/05573 , H01L2224/11003 , H01L2224/11332 , H01L2224/13099 , H01L2224/131 , H01L2224/73203 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , H01L2924/00015 , H01L2924/00 , H01L2224/05624 , H01L2924/00014
摘要： When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board while ensuring suppressing short-circuiting, lowering connection costs, suppressing stress concentrations at the joints and reducing damage of the IC chip or circuit board. The bumpless semiconductor device is provided with electrode pads 2 on the surface thereof and with a passivation film 3 at the periphery of the electrode pads 2, and conductive particles 4 are metallically bonded to the electric pads 2. Composite particles in which a metallic plating layer is formed at the surface of resin particles are employed as the conductive particles 4. This bumpless semiconductor device can be manufactured by (a) causing conductive particles to be electrostatically adsorbed onto one face of a flat plate; and (b) overlaying the surface of the plate having the adsorbed conductive particles on the surface of electrode pads of a bumpless semiconductor device which is provided with the electrode pads on the surface thereof and with a passivation film at the periphery of the electrode pads, and ultrasonically welding this assembly, so that the conductive particles are metallically bonded and transferred from the flat plate to the electrode pads.
摘要翻译：当通过倒装芯片方法将诸如IC芯片的半导体器件与电路板连接时，提供半导体器件而不在其上形成凸块，这使得IC芯片和电路板之间可以实现高可靠性和低成本的连接，同时确保抑制短路电路，降低连接成本，抑制接头处的应力集中，降低IC芯片或电路板的损坏。无电解半导体器件在其表面上设置有电极焊盘2，并且在电极焊盘2的周围具有钝化膜3，并且导电颗粒4金属地结合到电焊盘2.复合颗粒，其中金属镀层形成在树脂粒子表面的导电粒子4.这种无凸起的半导体器件可以通过（a）使导电粒子静电吸附在平板的一个面上来制造; 和（b）将具有吸附的导电颗粒的板的表面覆盖在其表面上设置有电极焊盘的无扰动半导体器件的电极焊盘的表面上，并且在电极焊盘的周围具有钝化膜，并且超声波焊接该组件，使得导电颗粒被金属地结合并从平板转移到电极焊盘。

80. 发明申请

US20090273914A1 Apparatus and methods of forming an interconnect between a workpiece and substrate 有权
标题翻译：在工件和基板之间形成互连的装置和方法
公开(公告)号：US20090273914A1
公开(公告)日：2009-11-05
申请号：US12151063
申请日：2008-05-01
申请人： Lakshmi Supriya , Anna M. Prakash , Tommy L. Ashton
发明人： Lakshmi Supriya , Anna M. Prakash , Tommy L. Ashton
IPC分类号： H01L21/768 , H01L21/50 , H05K7/00
CPC分类号： H05K3/3489 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11849 , H01L2224/13111 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/29298 , H01L2224/731 , H01L2224/73104 , H01L2224/81011 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2224/83191 , H01L2224/83193 , H01L2224/83194 , H01L2224/9211 , H01L2924/00013 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15787 , H05K3/3436 , H05K2203/0113 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929 , H01L2224/05599
摘要： Embodiments of an apparatus and methods of forming interconnect between a workpiece and substrate and its application to packaging of microelectronic devices are described herein. Other embodiments may be described and claimed.
摘要翻译：本文描述了在工件和基板之间形成互连的装置和方法的实施例及其在微电子器件的封装中的应用。可以描述和要求保护其他实施例。

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