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71. 发明授权

US5751003A Loadlock assembly for an ion implantation system 失效
标题翻译：用于离子注入系统的负载锁组件
公开(公告)号：US5751003A
公开(公告)日：1998-05-12
申请号：US779901
申请日：1997-01-07
申请人： Peter H. Rose , Adam A. Brailove
发明人： Peter H. Rose , Adam A. Brailove
IPC分类号： C23C14/48 , H01J27/14 , H01J37/08 , H01J37/18 , H01J37/20 , H01J37/30 , H01J37/317 , H01L21/00 , H01L21/265 , H01L21/677 , H01L21/683
CPC分类号： H01L21/67109 , H01J27/14 , H01J37/08 , H01J37/18 , H01J37/3002 , H01J37/3007 , H01J37/3171 , H01L21/67069 , H01L21/67201 , H01L21/67739 , H01L21/67748 , H01L21/67751 , H01L21/67778 , H01L21/6838 , H01J2237/022 , H01J2237/083 , H01J2237/184 , H01J2237/2001 , H01J2237/2007 , H01J2237/20228 , H01J2237/204 , H01J2237/31701 , H01J2237/31705
摘要： The present invention provides a loadlock assembly for a high throughput ion implantation system that rapidly and efficiently processes large quantities of workpieces, such as flat panel displays. The loadlock assembly increases the throughput of the implantation system by continuously cycling workpieces through the process chamber, thus increasing the system's throughput. The loadlock assembly includes a plurality of loadlock stacking elements that are axially positioned relative to each other to form a stacked array of loadlocks. Additionally, the loadlocks of the array are configured to nest with an adjacent loadlock to form a stackable and nestable loadlock assembly.
摘要翻译：本发明提供一种用于高通量离子注入系统的负载锁组件，其快速且有效地处理诸如平板显示器之类的大量工件。负载锁定组件通过连续地将工件循环通过处理室来增加植入系统的吞吐量，从而增加系统的生产量。负载锁组件包括多个负载锁定堆叠元件，其相对于彼此轴向定位，以形成堆叠的负荷锁定阵列。此外，阵列的负载锁被配置为与相邻的负载锁定嵌套以形成可堆叠和可嵌套的负载锁组件。

72. 发明授权

US5229615A End station for a parallel beam ion implanter 失效
标题翻译：并联光束离子注入机的终端
公开(公告)号：US5229615A
公开(公告)日：1993-07-20
申请号：US847766
申请日：1992-03-05
申请人： Robert A. Brune , Dorsey T. Smith , Andrew M. Ray
发明人： Robert A. Brune , Dorsey T. Smith , Andrew M. Ray
IPC分类号： C23C14/48 , H01J37/20 , H01J37/317 , H01L21/265
CPC分类号： H01J37/3171 , H01J2237/184 , H01J2237/20207 , H01J2237/20214 , H01J2237/20228 , H01J2237/31703
摘要： An end station for an ion implanter includes a loading station, a loadlock station, a vacuum chamber and a wafer handler within the vacuum chamber. The wafer handler includes a wafer-receiving platen assembly on the end of a multiple axis arm system wherein the arm system is capable of positioning the wafer for low and high angle of incidence implantation, rotating the wafer about an axis perpendicular to the wafer surface, and effecting scanning motion of the wafer along a straight line which intercepts the wafer tilt axis in any tilt position of the platen assembly. The invention further includes a loadlock including an upper element receiving wafers from the loading station and a lower element operable to position wafers for engagement by a transfer arm which transfers wafers from the loadlock to the wafer handler.

73. 发明授权

US12051607B2 Substrate positioning device with remote temperature sensor 有权
公开(公告)号：US12051607B2
公开(公告)日：2024-07-30
申请号：US17257900
申请日：2019-06-27
申请人： ASML NETHERLANDS B.V.
发明人： Patriek Adrianus Alphonsus Maria Bruurs , Dennis Herman Caspar Van Banning , Jan-Gerard Cornelis Van Der Toorn , Edwin Cornelis Kadijk
IPC分类号： H01L21/67 , G01K1/14 , G01K11/125 , H01J37/20 , H01J37/244 , H01L21/68
CPC分类号： H01L21/67248 , G01K1/14 , G01K11/125 , H01J37/20 , H01J37/244 , H01L21/68 , H01J2237/20228 , H01J2237/20235
摘要： A stage apparatus including: an object table configured to hold an object; a positioning device configured to position the object table and the object held by the object table; and a remote temperature sensor configured to measure a temperature of the object table and/or the object, wherein the remote temperature sensor comprises a passive temperature sensing element.

74. 发明授权

US11961708B2 Charged particle beam writing apparatus, charged particle beam writing method, and a non-transitory computer-readable storage medium 有权
公开(公告)号：US11961708B2
公开(公告)日：2024-04-16
申请号：US17236007
申请日：2021-04-21
申请人： NuFlare Technology, Inc.
发明人： Haruyuki Nomura , Noriaki Nakayamada
IPC分类号： H01J37/00 , G03F7/00 , H01J37/12 , H01J37/147 , H01J37/153 , H01J37/302 , H01J37/317 , H01L21/027
CPC分类号： H01J37/3174 , G03F7/70008 , G03F7/70558 , H01J37/12 , H01J37/1472 , H01J37/153 , H01J37/3026 , H01L21/0274 , H01J2237/20228 , H01J2237/31761
摘要： Position shifts caused by charging phenomena can be corrected with high accuracy. A charged particle beam writing apparatus includes an exposure-amount distribution calculator calculating an exposure amount distribution of a charged particle beam using a pattern density distribution and a dose distribution, a fogging charged particle amount distribution calculator calculating a plurality of fogging charged particle amount distributions by convoluting each of a plurality of distribution functions for fogging charged particles with the exposure amount distribution, a charge-amount distribution calculator calculating a charge amount distribution due to direct charge using the pattern density distribution, the dose distribution, and the exposure amount distribution, and calculating a plurality of charge amount distributions due to fogging charge using the plurality of fogging charged particle amount distributions, a position shift amount calculator calculating a position shift amount of a writing position based on the charge amount distribution due to direct charge and the plurality of charge amount distributions due to fogging charge, a corrector correcting an exposure position using the position shift amount, and a writer exposing the corrected exposure position to a charged particle beam.

75. 发明公开

US20230238214A1 REAL TIME PHOTORESIST OUTGASSING CONTROL SYSTEM AND METHOD 审中-公开
公开(公告)号：US20230238214A1
公开(公告)日：2023-07-27
申请号：US17582655
申请日：2022-01-24
申请人： Applied Materials, Inc.
发明人： Nevin Clay , David Roger Timberlake , Christopher R. Campbell
IPC分类号： H01J37/304 , H01J37/317 , H01J37/20
CPC分类号： H01J37/304 , H01J37/20 , H01J37/3171 , H01J2237/20228 , H01J2237/24564 , H01J2237/24585
摘要： A system and method for controlling an amount of outgassing caused by implanting ions into a photoresist disposed on a workpiece. The amount of outgassing is based on the species being implanted, the type of photoresist, the energy of the implant, and the amount of dose that has already been implanted, among other effects. By controlling the effective beam current, the amount of outgassing may be maintained below a predetermined threshold. By developing and utilizing the relationship between effective beam current, dose completed and rate of outgassing, the effective beam current may be controlled more precisely to implant the workpiece in the most efficient manner while remaining below the predetermined outgassing threshold.

76. 发明授权

US10497540B2 Compensated location specific processing apparatus and method 有权
公开(公告)号：US10497540B2
公开(公告)日：2019-12-03
申请号：US15863732
申请日：2018-01-05
申请人： TEL Epion Inc.
发明人： Matthew C. Gwinn , Martin D. Tabat , Kenneth Regan , Allen J. Leith , Michael Graf
IPC分类号： H01J37/304 , H01J37/20 , H01J37/08 , H01J37/147
CPC分类号： H01J37/304 , H01J37/08 , H01J37/147 , H01J37/20 , H01J2237/0473 , H01J2237/0812 , H01J2237/202 , H01J2237/20228 , H01J2237/30472
摘要： An apparatus and method for processing a workpiece with a beam is described. The apparatus includes a vacuum chamber having a beam-line for forming a particle beam and treating a workpiece with the particle beam, and a scanner for translating the workpiece through the particle beam. The apparatus further includes a scanner control circuit coupled to the scanner, and configured to control a scan property of the scanner, and a beam control circuit coupled to at least one beam-line component, and configured to control the beam flux of the particle beam according to a duty cycle for switching between at least two different states during processing.

77. 发明申请

US20170148633A1 ION IMPLANTATION APPARATUS AND ION IMPLANTATION METHOD 审中-公开
公开(公告)号：US20170148633A1
公开(公告)日：2017-05-25
申请号：US15424470
申请日：2017-02-03
申请人： SEN CORPORATION
发明人： Shiro NINOMIYA , Tetsuya KUDO
IPC分类号： H01L21/265 , C23C14/54 , C23C14/48
CPC分类号： H01L21/26586 , C23C14/48 , C23C14/54 , H01J37/3171 , H01J2237/20214 , H01J2237/20228 , H01J2237/30483 , H01J2237/3171
摘要： An ion implantation method in which an ion beam is scanned in a beam scanning direction and a wafer is mechanically scanned in a direction perpendicular to the beam scanning direction, includes setting a wafer rotation angle with respect to the ion beam so as to be varied, wherein a set angle of the wafer rotation angle is changed in a stepwise manner so as to implant ions into the wafer at each set eagle, and wherein a wafer scanning region length is set to be varied, and, at the same time, a beam scanning speed of the ion beam is changed, in ion implantation at each set angle in a plurality of ion implantation operations during one rotation of the wafer, such that the ions are implanted into the wafer and dose amount non-uniformity in a wafer surface in other semiconductor manufacturing processes is corrected.

78. 发明授权

US09415508B1 Multi-link substrate scanning device 有权
标题翻译：多链路基板扫描装置
公开(公告)号：US09415508B1
公开(公告)日：2016-08-16
申请号：US14713456
申请日：2015-05-15
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： Robert J. Mitchell , William Weaver
IPC分类号： B25J9/12 , B25J9/10 , B25J9/06 , B25J9/16
CPC分类号： B25J9/1694 , H01J37/20 , H01J2237/20228 , H01J2237/20285 , H01J2237/31701 , Y10S901/09 , Y10S901/23
摘要： A substrate scanning device includes first, second and third linkages, and a direct drive motor coupled between a process chamber and a first end of the first linkage. A first gear motor coupled between a second end of the first linkage and a first end of the second linkage and a second gear motor coupled between a second end of the second linkage and a first end of the third linkage. A substrate support surface coupled to a second end of the third linkage. The direct drive motor for moving the substrate support surface parallel to a scan axis as the direct drive motor moves the substrate support surface along the scan axis. The first and second gear motors can be configured to maintain the substrate support surface in a plane approximately parallel with the scan axis.
摘要翻译：基板扫描装置包括第一，第二和第三连杆，以及耦合在处理室和第一连杆的第一端之间的直接驱动马达。耦合在第一连杆的第二端和第二连杆的第一端之间的第一齿轮马达和耦合在第二连杆的第二端和第三连杆的第一端之间的第二齿轮马达。耦合到第三连杆的第二端的基板支撑表面。直接驱动马达，当直接驱动马达沿着扫描轴移动基板支撑表面时，用于使基板支撑表面平行于扫描轴移动。第一和第二齿轮马达可以被配置为将基板支撑表面保持在与扫描轴线大致平行的平面中。

79. 发明授权

US09368326B2 Scan head and scan arm using the same 有权
标题翻译：扫描头和扫描臂使用相同的
公开(公告)号：US09368326B2
公开(公告)日：2016-06-14
申请号：US13919651
申请日：2013-06-17
申请人： ADVANCED ION BEAM TECHNOLOGY, INC.
发明人： Richard F. McRay
IPC分类号： G01N23/00 , H01J37/317 , H01J37/20
CPC分类号： H01J37/3171 , H01J37/20 , H01J2237/20207 , H01J2237/20228 , H01J2237/20285
摘要： A scan head assembled to a scan arm for an ion implanter and a scan arm using the same are provided, wherein the scan head comprises a case, a shaft assembly, an ESC, a first driving mechanism and a second driving mechanism. The case has a normal center line. The shaft assembly passes through a first side of the case and has a twist axis, a first pivot point fixed relative to the case and a first end located outside the case. The ESC is fastened on the first end and capable of holding a work piece. The first driving mechanism is capable of driving the shaft assembly, the ESC and the work piece to tilt relative to the normal center line. The second driving mechanism is capable of driving the shaft assembly, the ESC and the work piece to rotate about the twist axis.
摘要翻译：提供了组装到用于离子注入机的扫描臂和使用其的扫描臂的扫描头，其中扫描头包括壳体，轴组件，ESC，第一驱动机构和第二驱动机构。案件有正常的中心线。轴组件穿过壳体的第一侧并且具有扭转轴线，相对于壳体固定的第一枢转点和位于壳体外部的第一端部。 ESC紧固在第一端并能够固定工件。第一驱动机构能够驱动轴组件，ESC和工件相对于正常中心线倾斜。第二驱动机构能够驱动轴组件，ESC和工件围绕扭转轴线旋转。

80. 发明授权

US09337076B2 Workpiece support structure with four degree of freedom air bearing for high vacuum systems 有权
标题翻译：工件支撑结构，四自由度空气轴承用于高真空系统
公开(公告)号：US09337076B2
公开(公告)日：2016-05-10
申请号：US13798909
申请日：2013-03-13
申请人： Varian Semiconductor Equipment Associates, Inc.
发明人： James P. Buonodono , Michael Esposito
IPC分类号： H01L21/687 , H01J37/30 , H01J37/317
CPC分类号： H01L21/68764 , H01J37/20 , H01J37/30 , H01J37/3171 , H01J2237/2005 , H01J2237/20207 , H01J2237/20228 , H01J2237/20235 , H01J2237/20242
摘要： A workpiece adjustment assembly is disclosed. The assembly can include a shaft, a spherical bearing, and a wafer support. A spherical housing receives the spherical bearing and allows the bearing to rotate therein. The housing and bearing may form an air bearing. A seal may be formed in the housing to prevent gas from the air bearing and the ambient atmosphere from migrating to a process chamber side of the housing. A set of spherical air pads may be positioned on an ambient side of the bearing to press the bearing against the housing when the process chamber is not under vacuum conditions. The seal can include a set of differentially pumped grooves. The spherical bearing enables the wafer manipulation end, and a wafer attached thereto, to be moved with four degrees of freedom. The arrangement facilitates isocentric scanning of a workpiece. Methods for using the assembly are also disclosed.
摘要翻译：公开了一种工件调整组件。组件可以包括轴，球面轴承和晶片支撑件。球形壳体接收球面轴承并允许轴承在其中旋转。外壳和轴承可以形成空气轴承。可以在壳体中形成密封件，以防止来自空气轴承和周围空气的气体迁移到壳体的处理室侧。当处理室不在真空条件下时，一组球形空气垫可以定位在轴承的环境侧上，以将轴承压靠在壳体上。密封件可以包括一组差异泵浦的凹槽。球面轴承使得晶片操纵端和附接到其上的晶片以四个自由度移动。该装置有助于工件的等中心扫描。还公开了使用组件的方法。

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