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    • 71. 发明申请
    • SENSOR PART FOR AN INFRARED SENSOR AND METHOD FOR PRODUCING SAME
    • 红外传感器的传感器部件及其生产方法
    • US20130075616A1
    • 2013-03-28
    • US13641200
    • 2011-04-06
    • Martin KramGerhard Röhner
    • Martin KramGerhard Röhner
    • G01J5/04G01R3/00G01J5/10
    • G01J5/04G01J1/02G01J1/0271G01J1/04G01J1/0403G01J5/02G01J5/0205G01J5/08G01J5/0893G01J5/10G01R3/00H05K1/028Y10T29/49002
    • A sensor part for an infrared sensor, including an IR-sensitive detector (1), at least one reference source (2) emitting IR radiation, and an IR-sensitive reference detector (3) which, in the direction of the incident IR radiation, is at a distance from the detector (1), wherein the at least one reference source (2) is arranged at the side of the reference detector (3), and including a support (5), on the first side (6) of which the detector (1), the at least one reference source (2) and the reference detector (3) are arranged. The support (5) includes a blank made of a flexible material bent in some sections, in particular a blank made of a flexible printed circuit board bent in some sections. The invention achieves the aim of specifying a three-dimensional sensor part for an IR sensor that can be produced by a simple method. The invention further relates to a method for producing a sensor part and to an IR sensor.
    • 一种用于红外传感器的传感器部件,包括IR敏感检测器(1),至少一个发射IR辐射的参考源(2)和IR敏感参考检测器(3),其在入射IR辐射的方向上 与所述检测器(1)相距一定距离,其中所述至少一个参考源(2)布置在所述参考检测器(3)的侧面,并且在所述第一侧(6)上包括支撑件(5) 其中检测器(1),至少一个参考源(2)和参考检测器(3)被布置。 支撑件(5)包括由在一些部分中弯曲的柔性材料制成的坯料,特别是由在一些部分弯曲的柔性印刷电路板制成的坯料。 本发明实现了通过简单的方法制造用于IR传感器的三维传感器部件的目的。 本发明还涉及一种用于制造传感器部件和IR传感器的方法。
    • 72. 发明授权
    • Temperature measuring apparatus
    • 温度测量仪
    • US08371748B2
    • 2013-02-12
    • US13157299
    • 2011-06-09
    • Ta Chieh Yang
    • Ta Chieh Yang
    • G01J5/00
    • G01J5/0011G01J5/0205G01J5/027G01J5/049
    • A temperature measuring apparatus comprises a casing, an infrared sensor assembly, a probe, and a trigger device. The infrared sensor assembly is disposed in the casing. The trigger device is connected between the casing and the probe in such manner that when the probe moves toward the casing, the trigger device is activated by the probe to trigger the infrared sensor assembly to proceed sensing. The temperature measuring apparatus could be operated to measure without pressing any measuring button, so that the temperature measuring apparatus could have a stable operation in the measuring process. Hence, the error of the temperature measuring is reduced and the operation is more convenient.
    • 温度测量装置包括壳体,红外传感器组件,探针和触发装置。 红外传感器组件设置在壳体中。 触发装置以这样的方式连接在壳体和探头之间,使得当探头向壳体移动时,触发装置被探头激活以触发红外传感器组件以进行感测。 可以在不按任何测量按钮的情况下操作温度测量装置进行测量,使得测量装置在测量过程中可以具有稳定的操作。 因此,降低了温度测量的误差,操作更方便。
    • 74. 发明申请
    • EAR THERMOMETER AND MEASURING APPARATUS USED WITH IT
    • 使用的高温仪和测量装置
    • US20120257649A1
    • 2012-10-11
    • US13479755
    • 2012-05-24
    • Hideki TANAKA
    • Hideki TANAKA
    • G01K7/00
    • G01J5/04G01J3/0202G01J3/0243G01J5/0011G01J5/02G01J5/0205G01J5/025G01J5/028G01J5/048G01J5/049G01J5/08G01J5/085G01J5/14G01J2005/068H05K1/189H05K2201/09063H05K2201/10151H05K2201/10606
    • An object is to realize an ear thermometer that is configured to easily arrange a sensor in a sensor mirror and is suitable for mass production. The ear thermometer has a probe. The probe includes a probe body and a temperature measuring part joined with the probe body. The temperature measuring part includes a flange coupled with the probe body and a front end part extending from the flange, the front end part incorporating a sensor mirror. The sensor mirror includes a cylindrical holder with an internal concave reflection face, a connection shaft extending from the back of the cylindrical holder, a flexible printed circuit board with a circuit conductor of predetermined pattern, stretched in a front space of the cylindrical holder, a temperature measuring first sensor and a correcting second sensor spaced by a predetermined distance from each other in a longitudinal direction of the board and soldered to the circuit conductor on the board, and a protection cover covering a front face of the cylindrical holder. The board is electrically connected, in the temperature measuring part, to the cable passing through the probe body.
    • 一个目的是实现一种耳式温度计,其配置为能够将传感器轻松地布置在传感器镜中,并且适合于批量生产。 耳温度计有一个探头。 探针包括探针体和与探针体接合的温度测量部。 温度测量部件包括与探针本体连接的凸缘和从凸缘延伸的前端部,前端部分包括传感器镜。 传感镜包括一个带有内凹反射面的圆筒形保持器,从圆柱形支架的背面延伸的连接轴,具有预定图案的电路导体的柔性印刷电路板,在柱形保持器的前部空间中被拉伸, 温度测量第一传感器和校正第二传感器,其在板的纵向方向上彼此间隔开预定距离并且焊接到板上的电路导体,以及覆盖圆柱形保持器的前表面的保护盖。 该板在温度测量部分电连接到穿过探头主体的电缆。
    • 77. 发明授权
    • Multi function thermometer
    • 多功能温度计
    • US07520668B2
    • 2009-04-21
    • US11657349
    • 2007-01-24
    • Ieon Chen
    • Ieon Chen
    • G01J5/04G01K13/00
    • G01J5/02G01J5/0205G01J5/025G01J5/026G01J5/0265G01J5/028G01J5/04G01J5/047G01J5/08G01J5/0846G01J5/0893G01J5/0896G01K1/14G01K2207/06
    • A multi function thermometer is provided which operates to display temperatures sensed by one or more temperature sensors. The thermometer comprises a thermometer housing and a temperature probe engaged to the housing, the probe being translatable between a first stowed position and a second deployed position. An infrared temperature reader element is also engaged to the housing, and operative to sense the temperature of objects remote from the housing, within a field of view of the infrared reader element. A temperature display is connected to the retractable probe and to the infrared temperature reader element. The display is operative to display temperatures sensed by the retractable probe and/or the infrared reader element.
    • 提供了一种多功能温度计,其操作以显示由一个或多个温度传感器感测的温度。 温度计包括温度计壳体和接合到壳体的温度探测器,探头可在第一收起位置和第二展开位置之间平移。 红外温度读取器元件还接合到壳体,并且可操作以在红外读取器元件的视场内感测远离壳体的物体的温度。 温度显示器连接到可伸缩探头和红外温度读数器元件。 显示器用于显示由可伸缩探头和/或红外读取器元件感测的温度。
    • 78. 发明申请
    • Multi function thermometer
    • 多功能温度计
    • US20080175301A1
    • 2008-07-24
    • US11657349
    • 2007-01-24
    • Ieon Chen
    • Ieon Chen
    • G01J5/00
    • G01J5/02G01J5/0205G01J5/025G01J5/026G01J5/0265G01J5/028G01J5/04G01J5/047G01J5/08G01J5/0846G01J5/0893G01J5/0896G01K1/14G01K2207/06
    • A multi function thermometer is provided which operates to display temperatures sensed by one or more temperature sensors. The thermometer comprises a thermometer housing and a temperature probe engaged to the housing, the probe being translatable between a first stowed position and a second deployed position. An infrared temperature reader element is also engaged to the housing, and operative to sense the temperature of objects remote from the housing, within a field of view of the infrared reader element. A temperature display is connected to the retractable probe and to the infrared temperature reader element. The display is operative to display temperatures sensed by the retractable probe and/or the infrared reader element.
    • 提供了一种多功能温度计,其操作以显示由一个或多个温度传感器感测的温度。 温度计包括温度计壳体和接合到壳体的温度探测器,探头可在第一收起位置和第二展开位置之间平移。 红外温度读取器元件还接合到壳体,并且可操作以在红外读取器元件的视场内感测远离壳体的物体的温度。 温度显示器连接到可伸缩探头和红外温度读数器元件。 显示器用于显示由可伸缩探头和/或红外读取器元件感测的温度。
    • 80. 发明申请
    • Temperature-measuring device
    • 温度测量装置
    • US20030231694A1
    • 2003-12-18
    • US10394206
    • 2003-03-24
    • Akihiro Ohsawa
    • G01J005/00
    • G01J5/522G01J5/0003G01J5/0096G01J5/0205G01J5/08G01J5/0821G01J5/0896G01J5/10
    • At the time when a temperature of a semiconductor wafer or the like is measured by light without contacting to it, its temperature is measured with high precision without suffering from an influence of changes in temperature of a light source, an influence of a bent degree or the like of an optical fiber or an influence of a displacement of an optical system such as a lens or the like. Light output from the light source is irradiated to the semiconductor wafer through an optical fiber for irradiated light. The light reflected from the semiconductor wafer is output as reflected light through an optical fiber for the reflected light. An optical fiber for reference light having substantially the same route as those of the optical fiber for irradiated light and the optical fiber for reflected light is disposed. The light output from the light source is output as the reference light through the optical fiber for reference light without being irradiated to or reflected from the semiconductor wafer. And, a temperature of the semiconductor wafer is measured according to the reflected light output from the optical fiber for reflected light and the reference light output from the optical fiber for reference light.
    • 当半导体晶片等的温度通过光而不与其接触时,其温度以高精度测量,而不受光源温度变化的影响,弯曲度的影响或 光纤的类似物或诸如透镜等的光学系统的位移的影响。 从光源输出的光通过用于照射光的光纤照射到半导体晶片。 从半导体晶片反射的光作为反射光通过反射光的光纤输出。 布置具有与用于照射光的光纤基本相同的路径的参考光的光纤和用于反射光的光纤。 从光源输出的光作为参考光通过用于参考光的光纤输出,而不照射或从半导体晶片反射。 并且,根据从用于反射光的光纤的反射光和从用于参考光的光纤输出的参考光来测量半导体晶片的温度。