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    • 74. 发明申请
    • Method and apparatus for preparation of binary and higher order compounds and devices fabricated using same
    • 制备二元和更高级化合物的方法和装置以及使用其制造的器件
    • US20040035356A1
    • 2004-02-26
    • US10296909
    • 2003-05-20
    • Andrea ZappettiniLucio ZanottiMingzheng ZhaFrancesco Bissoli
    • C30B023/00C30B025/00C30B028/12C30B028/14
    • C30B11/00C30B23/00C30B23/002C30B29/48
    • A heat treatment chamber (30) is provided comprising a treatment region containing a charge (5) of compound material comprising a plurality of n atomic species, each atomic species being associated with at least one gas species. The chamber (30) is placed in a furnace (7). The chamber has a gas permeable barrier, constituted by a plug (4) and wadding (6), which partially encloses the treatment region. The barrier serves as an effusive hole to inhibit, but not prevent, gas vapour release, thereby to elevate the gas vapour pressure in the treatment region. Application of inert gas through a valve (8) is also used to increase background pressure in the treatment region during heat treatment. The elevated gas pressures present in the treatment region during treatment are measurable in an absorption cell (3) adjacent to the treatment region. It is thus possible to monitor the gas pressures during heat treatment and thereby stop the heat treatment once a desired charge stoichiometry is achieved. This improves over prior art heat treatment which is carried out in vacuum and thus precludes optical absorption measurement of the gas pressures during heat treatment.
    • 提供了一种热处理室(30),其包括含有包含多个n原子物质的复合材料的电荷(5)的处理区域,每个原子物质与至少一种气体物质相关联。 室(30)放置在炉(7)中。 腔室具有气体渗透屏障,由塞子(4)和填塞物(6)构成,其部分地包围处理区域。 阻挡层用作抑制气体蒸气释放而不是防止气体蒸发的渗出孔,从而提高处理区域中的气体蒸汽压力。 惰性气体通过阀门(8)的应用也用于在热处理过程中提高处理区域的背景压力。 处理期间处理区域中存在的升高的气体压力可在与处理区域相邻的吸收池(3)中测量。 因此,可以在热处理期间监测气体压力,从而一旦达到所需的电荷化学计量即可停止热处理。 这比在真空中进行的现有技术的热处理改进,因此排除热处理期间气体压力的光吸收测量。
    • 79. 发明申请
    • Process of and apparatus for heat-treating II-VI compound semiconductors and semiconductor heat-treated by the process
    • 用于热处理II-VI化合物半导体的工艺和设备,以及通过该工艺热处理的半导体
    • US20030073259A1
    • 2003-04-17
    • US10243198
    • 2002-09-13
    • Yasuo Namikawa
    • H01L021/00
    • H01L21/385C30B29/48C30B33/00H01L33/0095H01L33/28
    • A process of heat-treating II-VI compound semiconductors reduces the electrical resistivity without the decrease in crystallinity resulting from the increase in dislocation density. The process comprises the following steps:(a) placing at least one II-VI compound semiconductor in contact with aluminum in a heat-treating chamber having the inside surface formed by at least one material selected from the group consisting of pyrolytic born nitride, hexagonal-system boron nitride, sapphire, alumina, aluminum nitride, and polycrystalline diamond; and (b) heat-treating the II-VI compound semiconductor or semiconductors in a gaseous atmosphere containing the group II element constituting part of the II-VI compound semiconductor or semiconductors. A II-VI compound semiconductor is heat-treated by the foregoing process. An apparatus for heat-treating II-VI compound semiconductors comprises components for performing the foregoing process.
    • 一种热处理II-VI化合物半导体的方法降低了电阻率,而不会由于位错密度的增加而导致结晶度的降低。 该方法包括以下步骤:(a)将至少一种与铝接触的II-VI化合物半导体放置在热处理室中,所述热处理室具有由至少一种选自热解出的氮化物,六方晶系的材料形成的内表面 系统氮化硼,蓝宝石,氧化铝,氮化铝和多晶金刚石; 和(b)在构成II-VI族化合物半导体或半导体的一部分的II族元素的气氛气氛中热处理II-VI族化合物半导体或半导体。 通过上述方法对II-VI化合物半导体进行热处理。 用于热处理II-VI化合物半导体的装置包括用于执行上述方法的组分。