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71. 发明授权

US06310755B1 Electrostatic chuck having gas cavity and method 有权
标题翻译：具有气腔和方法的静电吸盘
公开(公告)号：US06310755B1
公开(公告)日：2001-10-30
申请号：US09307215
申请日：1999-05-07
申请人： Arnold Kholodenko , Shamouil Shamouilian , You Wang , Wing L. Cheng , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Ananda H. Kumar
发明人： Arnold Kholodenko , Shamouil Shamouilian , You Wang , Wing L. Cheng , Alexander M. Veytser , Surinder S. Bedi , Kadthala R. Narendrnath , Semyon L. Kats , Dennis S. Grimard , Ananda H. Kumar
IPC分类号： H01G2300
CPC分类号： C04B35/565 , C04B35/185 , C04B35/806 , C04B37/006 , C04B37/026 , C04B41/009 , C04B41/5155 , C04B41/88 , C04B2235/402 , C04B2235/5248 , C04B2235/616 , C04B2235/96 , C04B2235/9607 , C04B2237/121 , C04B2237/343 , C04B2237/365 , C04B2237/366 , C04B2237/405 , C04B2237/60 , C22C29/00 , C22C2204/00 , H01L21/67109 , H01L21/6831 , H01L21/6833 , C04B38/00 , C04B41/4523
摘要： An electrostatic chuck 55 has an electrostatic member 100 including a dielectric 115 having a surface 120 adapted to receive the substrate 30. The dielectric 115 covers an electrode 105 that is chargeable to electrostatically hold the substrate 30. A support 190 below the electrostatic member 100 has a cavity 300 adapted to hold a gas to serve as a thermal insulator to regulate the flow of heat from the electrostatic chuck 55 to a surface 120 of the chamber 25. The cavity 300 has a cross-sectional profile that is shaped to provide a predetermined temperature profile across the substrate 30.
摘要翻译：静电吸盘55具有静电构件100，静电构件100包括具有适于接纳衬底30的表面120的电介质115.电介质115覆盖电极105，电极105可充电以静电保持衬底30.静电构件100下方的支撑件190具有空腔300适于保持气体以用作热绝缘体，以调节从静电卡盘55到腔室25的表面120的热量流动。空腔300具有截面轮廓，其形状设置成提供预定的跨越衬底30的温度分布。

72. 发明授权

US06306528B1 Method for the controlling of certain second phases in aluminum nitride 失效
标题翻译：用于控制氮化铝中某些第二相的方法
公开(公告)号：US06306528B1
公开(公告)日：2001-10-23
申请号：US09311812
申请日：1999-05-13
申请人： Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
发明人： Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
IPC分类号： B32B1800
CPC分类号： C04B41/009 , C04B41/5133 , C04B41/88 , C04B2111/00844 , H01L23/15 , H01L2924/0002 , H05K1/0306 , H05K1/092 , Y10T428/265 , C04B41/4539 , C04B41/4556 , C04B41/4578 , C04B41/5032 , C04B41/526 , C04B35/581 , H01L2924/00
摘要： Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.
摘要翻译：用橡皮布金属覆盖面积百分比高的电子封装可能容易产生某些种类的陶瓷缺陷。在氮化铝中，这些缺陷可能与液体烧结助剂的分解有关。在该实验中，金属化的独特添加防止了某些陶瓷缺陷的形成。我们的方法涉及在现有过程中使用的独特组合。

73. 发明申请

US20010026838A1 Monolithic catalysts and related process for manufacture 审中-公开
标题翻译：单片催化剂及相关制造工艺
公开(公告)号：US20010026838A1
公开(公告)日：2001-10-04
申请号：US09873979
申请日：2001-06-01
申请人： ENGELHARD CORPORATION
发明人： Joseph C. Dettling , Victor Rosynsky , Chung-Zong Wan
IPC分类号： B05D007/22
CPC分类号： B01J23/63 , B01J35/0006 , B01J35/04 , B01J37/0215 , B05D3/0493 , B05D7/22 , C04B41/009 , C04B41/4535 , C04B41/5105 , C04B41/81 , C04B41/88 , C04B2111/0081 , C23C2/006 , C23C2/28 , C23C10/04 , C23C10/18 , C23C10/26 , C23C26/00 , Y02T50/67 , Y02T50/6765 , C04B41/457 , C04B35/00 , C04B38/0006
摘要： The present invention is directed to a substrate, such as a honeycomb having a plurality of parallel channels defined by the honeycomb walls. The honeycomb has different zones along the length of the channels. The zones are defined by their coating (or lack of coating) and extend for a length of the channel in which there is the same coating and architecture. Soluble components in coating compositions are fixed in their respective zones.
摘要翻译：本发明涉及一种基底，例如具有由蜂窝壁限定的多个平行通道的蜂窝体。蜂窝具有沿通道长度的不同区域。这些区域由它们的涂层（或不含涂层）限定，并延伸一段具有相同涂层和结构的通道的长度。涂料组合物中的可溶组分固定在它们各自的区域中。

74. 发明授权

US06200526B1 Method of controlling infiltration of complex-shaped ceramic-metal composite articles and the products produced thereby 有权
标题翻译：控制复合陶瓷 - 金属复合制品渗透的方法及由此产生的产品
公开(公告)号：US06200526B1
公开(公告)日：2001-03-13
申请号：US09297968
申请日：1999-05-11
申请人： Richard T. Fox , Aleksander J. Pyzik , Chan Han , Robert T. Nilsson
发明人： Richard T. Fox , Aleksander J. Pyzik , Chan Han , Robert T. Nilsson
IPC分类号： B22F326
CPC分类号： G11B5/7315 , C04B41/5155 , C04B41/52 , C04B41/88 , C04B41/89 , C22C1/1036 , C22C2001/1021 , C22C2001/1057 , G11B5/8404
摘要： A process for preparing complex-shaped, ceramic-metal composite articles, comprising: (a) contacting a non-wettable powder that is non-wetting to a metal to be used for infiltration with a shaped ceramic body to form a layer of the non-wettable powder on one or more surfaces of the shaped ceramic body, wherein the shaped ceramic body has a region where there is no layer of the non-wettable powder, and (b) infiltration the shaped ceramic body with the metal through the region or regions where there is no layer of the non-wettable powder, such that a complex-shaped ceramic-metal composite comprising one or more metal phases and one or more ceramic phases is formed, wherein the article has substantially the net shape of the shaped ceramic body and undesirable regions of excess metal on the surface and undesirable phases within the complex-shaped ceramic-metal composite article near the surface are located only in the region or regions where there is no layer of the non-wettable powder. The process of the invention allows the preparation of complex-shaped ceramic-metal composite articles with undesirable regions of excess metal and undesirable phases on the surface(s), of, or within, the article only in the regions where there is, or was, no layer of non-wettable powder. The process of the invention allows the preparation of a complex-shaped ceramic-metal composite article which requires little or no machining of the surface(s) to achieve a finished article. A complex-shaped ceramic-metal composite article is prepared which contains few undesirable regions of excess metal and undesirable phases.
摘要翻译：一种制备复杂形状的陶瓷 - 金属复合制品的方法，包括：（a）将不湿润的非可润湿粉末与用于渗透的金属与成形陶瓷体接触以形成非 - 在成形陶瓷体的一个或多个表面上的可润湿粉末，其中成形陶瓷体具有不存在不可湿性粉末层的区域，（b）使成形陶瓷体与金属渗透穿过该区域或没有不可湿粉末层的区域，使得形成包含一个或多个金属相和一个或多个陶瓷相的复合形状的陶瓷 - 金属复合材料，其中制品具有基本上成形陶瓷的净形状表面上的多余金属的主体和不期望的区域以及表面附近的复合陶瓷 - 金属复合制品内的不期望的相位仅位于不具有不可湿性粉末层的区域或区域中。本发明的方法允许制备复合形状的陶瓷 - 金属复合制品，其具有不需要的过量金属区域和不期望的相，仅在制品的表面上或内部存在，，无层不可湿粉。本发明的方法允许制备复杂形状的陶瓷 - 金属复合制品，其需要很少或不需要加工表面以实现最终制品。制备复杂形状的陶瓷 - 金属复合制品，其包含少量不需要的过量金属和不期望的相的区域。

75. 发明授权

US06200373B1 Method for controlling of certain second phases in aluminum nitride 失效
标题翻译：用于控制氮化铝中某些第二相的方法
公开(公告)号：US06200373B1
公开(公告)日：2001-03-13
申请号：US09311811
申请日：1999-05-13
申请人： Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
发明人： Richard A. Bates , Carla N. Cordero , Benjamin V. Fasano , David B. Goland , Robert Hannon , Lester W. Herron , Gregory M. Johnson , Andrew Reitter , Subhash L. Shinde , Lisa Studzinski
IPC分类号： B32B1700
CPC分类号： C04B41/009 , C04B41/5133 , C04B41/88 , C04B2111/00844 , H01L23/15 , H01L2924/0002 , H05K1/0306 , H05K1/092 , Y10T428/265 , C04B41/4539 , C04B41/4556 , C04B41/4578 , C04B41/5032 , C04B41/526 , C04B35/581 , H01L2924/00
摘要： Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.
摘要翻译：用橡皮布金属覆盖面积百分比高的电子封装可能容易产生某些种类的陶瓷缺陷。在氮化铝中，这些缺陷可能与液体烧结助剂的分解有关。在该实验中，金属化的独特添加防止了某些陶瓷缺陷的形成。我们的方法涉及在现有过程中使用的独特组合。

76. 发明授权

US06171710B2 Surface treating agent for plating and base material with the plating adhered thereto 失效
标题翻译：电镀表面处理剂和附着于其上的电镀基材
公开(公告)号：US06171710B2
公开(公告)日：2001-01-09
申请号：US08638170
申请日：1996-04-26
申请人： Masayuki Ogino , Shigehiko Hayashi , Masahito Kawahara , Kazuo Goto , Toru Noguchi , Yoshio Yamaguchi
发明人： Masayuki Ogino , Shigehiko Hayashi , Masahito Kawahara , Kazuo Goto , Toru Noguchi , Yoshio Yamaguchi
IPC分类号： B22F704
CPC分类号： C03C17/3607 , C03C17/007 , C03C17/008 , C03C17/36 , C03C17/3644 , C03C2217/45 , C03C2217/479 , C04B41/009 , C04B41/4507 , C04B41/51 , C04B41/52 , C04B41/81 , C04B41/88 , C04B41/89 , C04B2111/00491 , C23C24/085 , Y10T428/12028 , Y10T428/12049 , Y10T428/12104 , C04B41/463 , C04B41/48 , C04B35/00
摘要： A layer is provided for bonding a conductive plating to a substrate which substrate normally does not provide firm bonding of plating directly thereto. The bonding layer forms a matrix in which are dispersed ultrafine metal particles. The bonding layer is formed in situ on the substrate surface with the metal particles being maintained unaggregated in the matrix as it is formed on the surface. Plating subsequently formed on the outer surface of the bonding layer is effectively firmly bonded to the substrate through the intermediary of the matrix and metal particles distributed therein. The bonding layer includes a fixative formed of an organic compound including a metal and an organic solvent. The bonding layer may further include a film strengthener.
摘要翻译：提供了一层用于将导电镀层接合到衬底上的衬底，衬底通常不能直接提供电镀牢固的结合。结合层形成其中分散有超细金属颗粒的基质。接合层在基材表面上原位形成，金属颗粒在其形成在表面上时在基体中保持不分散。随后在接合层的外表面上形成的电镀通过分布在其中的基质和金属颗粒的介质有效地牢固地结合到基底。粘合层包括由包含金属和有机溶剂的有机化合物形成的固定剂。接合层还可以包括膜强化剂。

77. 依法登记的发明

USH1861H Composite production with continuous metal and ceramic phases 有权
标题翻译：空值
公开(公告)号：USH1861H
公开(公告)日：2000-09-05
申请号：US176421
申请日：1998-10-21
申请人： Darin J. Aldrich , Rajan Tandon
发明人： Darin J. Aldrich , Rajan Tandon
IPC分类号： C04B41/88
CPC分类号： C04B41/009 , C04B41/5127 , C04B41/88 , C04B2111/00931 , C04B41/4517 , C04B41/4521 , C04B41/4523 , C04B41/4556 , C04B41/5068 , C04B41/5133 , C04B35/584
摘要： The present invention relates to a ceramic alloy composite composition having the alloy spontaneously infiltrated into the ceramic, with the preferred ceramic alloy composite composition being a Si.sub.3 N.sub.4 /TiN/Cu-Ti composite composition and a method for forming the ceramic alloy composite composition.
摘要翻译：本发明涉及具有自发渗入陶瓷中的合金的陶瓷合金复合组合物，优选的陶瓷合金复合组合物是Si 3 N 4 / TiN / Cu-Ti复合组合物和形成陶瓷合金复合组合物的方法。

78. 发明授权

US6071332A Decorative preparations for producing gold-containing decorations and their use 失效
标题翻译：用于生产含金装饰品的装饰制剂及其用途
公开(公告)号：US6071332A
公开(公告)日：2000-06-06
申请号：US19927
申请日：1998-02-06
申请人： Andreas Schulz , Norbert Giesecke
发明人： Andreas Schulz , Norbert Giesecke
IPC分类号： A44C25/00 , A44C27/00 , C03C8/18 , C03C17/00 , C04B41/51 , C04B41/87 , C04B41/88 , C09D17/00 , C09D11/02
CPC分类号： C04B41/009 , C03C17/007 , C03C17/009 , C03C8/18 , C04B41/5116 , C04B41/88 , C09D17/001 , C03C2217/44 , C03C2217/479 , C04B2111/82
摘要： Decorative preparations according to the invention for producing gold-containing decorations, in particular decorations on fireable substrates, contain as a source of gold a ligand-stabilized gold cluster or a ligand-stabilized gold colloid and also an organic binder and/or an inorganic component from the group consisting of glass frits, silicates, oxides and oxide/silicate precursors. The preferred source of gold is Au.sub.55 [(C.sub.2 H.sub.5).sub.2 P(m-C.sub.6 H.sub.4 SO.sub.3 Na)].sub.12 Cl.sub.6 or a gold colloid stabilized with the same phosphane. Bright gold, burnished gold and lustre preparations contain, in addition to the source of ligand-stabilized gold, an organic binder. A decorative preparation for purple decorations generally also contains, in addition to the decorative color consisting of the source of gold and the inorganic components, a medium consisting of an organic binder and a solvent. The decorative preparations are suitable either for producing ceramic decorations or for coloring plastics and lacquers.
摘要翻译：根据本发明的用于生产含金装饰品，特别是可燃基材上的装饰品的装饰制剂包含作为金的来源，配体稳定的金簇或配体稳定的金胶体以及有机粘合剂和/或无机成分由玻璃料，硅酸盐，氧化物和氧化物/硅酸盐前体组成的组。优选的金源是Au55 [（C2H5）2P（m-C6H4SO3Na）] 12Cl6或用相同磷烷稳定的金胶体。明亮的金，抛光的金和光泽的制剂除了配体稳定的金的来源外还含有有机粘合剂。用于紫色装饰品的装饰品除了由金源和无机成分组成的装饰颜色外，还包含由有机粘合剂和溶剂组成的介质。装饰性制剂适用于生产陶瓷装饰品或用于着色塑料和漆。

79. 发明授权

US06022505A Process for manufacturing ceramic metal composite bodies, the ceramic metal composite body and its use 失效
标题翻译：制造陶瓷金属复合体的方法，陶瓷金属复合体及其用途
公开(公告)号：US06022505A
公开(公告)日：2000-02-08
申请号：US26549
申请日：1998-02-20
申请人： Steffen Rauscher , Michael Scheydecker , Karl Weisskopf , Tilmann Haug
发明人： Steffen Rauscher , Michael Scheydecker , Karl Weisskopf , Tilmann Haug
IPC分类号： C04B41/51 , C04B41/88 , C22C1/05 , C04B35/03 , C04B35/46 , C04B35/653 , C04B35/76 , C04B35/80
CPC分类号： C04B41/88 , C04B41/5155 , C22C1/051
摘要： A process for manufacturing a ceramic metal composite body in the case of which a dimensionally stable and porous sacrificial body is produced from ceramic initial products and is filled at a filling temperature with a softened metal, particularly under an increased pressure. The filled sacrificial body is heated to a reaction temperature and the metal to be filled in, BMe, is reacted with a metal of the ceramics. KMe, forming the ceramic metal composite body which has a ceramic phase having KMe.sub.m B.sub.x and/or KMe.sub.n C.sub.y and/or KMe.sub.o CN and BMe.sub.p O.sub.3 and has a metallic phase having an intermetallic compound which is formed of KMe and BMe, the filling temperature being lower than the reaction temperature and higher than or equal to the softening temperature of the metal.
摘要翻译：在陶瓷金属复合体的制造方法中，由陶瓷初始产品制造尺寸稳定且多孔的牺牲体，并且在软化金属的填充温度下填充，特别是在增加的压力下。将填充的牺牲体加热至反应温度，并将待填充的金属（BMe）与陶瓷的金属反应。 KMe，形成具有具有KMemBx和/或KMenCy和/或KMeoCN和BMepO3的陶瓷相的陶瓷金属复合体，并且具有由KMe和BMe形成的金属间化合物的金属相，填充温度低于反应温度高于或等于金属的软化温度。

80. 发明授权

US5965193A Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material 失效
标题翻译：制备陶瓷电子电路板的方法和制备铝或铝合金结合陶瓷材料的方法
公开(公告)号：US5965193A
公开(公告)日：1999-10-12
申请号：US902054
申请日：1997-07-29
申请人： Xiao-Shan Ning , Choju Nagata , Masami Sakuraba , Toshikazu Tanaka , Katsuaki Suganuma , Masami Kimura
发明人： Xiao-Shan Ning , Choju Nagata , Masami Sakuraba , Toshikazu Tanaka , Katsuaki Suganuma , Masami Kimura
IPC分类号： C04B41/51 , C04B41/81 , C04B41/88 , H01L21/48 , H01L23/373 , H05K1/02 , H05K1/03 , H05K3/00 , B05D5/12 , B05D3/02 , B05D3/12
CPC分类号： H05K3/0061 , C04B41/5155 , C04B41/81 , C04B41/88 , H01L21/4871 , H01L23/3735 , H01L2924/0002 , H05K1/0271 , H05K1/0306 , Y10T428/31678
摘要： Molten aluminum and a ceramic substrate are held in direct contact with each other and thereafter cooled to have the aluminum joined directly to the ceramic substrate. This method is capable of consistent and easy production of aluminum-ceramics composite substrates having satisfactory joint strength, thermal conductivity and heat resistance characteristics. A ceramic member is fed successively into and through molten metal to directly bond the metal on the ceramic to produce a metal-bonded-ceramic (MBC) material at a low cost. An electronic circuit substrate made of an aluminum ceramic composite material wherein an electronic circuit is formed on an aluminum surface of the aluminum-ceramic composite material. The aluminum-ceramic composite material is made by directly solidifying molten aluminum or an aluminum alloy on at least a portion of a ceramic substrate.
摘要翻译：熔融铝和陶瓷基板保持彼此直接接触，然后冷却以使铝直接接合到陶瓷基板。该方法能够一致且容易地生产具有令人满意的接合强度，导热性和耐热特性的铝 - 陶瓷复合基材。陶瓷构件依次进入熔融金属并通过熔融金属直接接合在陶瓷上，以低成本制造金属粘结陶瓷（MBC）材料。一种由铝陶瓷复合材料制成的电子电路基板，其中在铝 - 陶瓷复合材料的铝表面上形成电子电路。铝陶瓷复合材料通过在陶瓷基板的至少一部分上直接凝固熔融铝或铝合金制成。

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