专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

71. 发明授权

US07655492B2 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates 有权
标题翻译：在晶片衬底上沉积，释放和封装微机电器件的方法
公开(公告)号：US07655492B2
公开(公告)日：2010-02-02
申请号：US11102183
申请日：2005-04-07
申请人： Satyadev R. Patel , Andrew G. Huibers , Steve S. Chiang
发明人： Satyadev R. Patel , Andrew G. Huibers , Steve S. Chiang
IPC分类号： H01L29/82
CPC分类号： B81C1/00214 , B81B7/0077 , B81B2201/042 , B81C1/00333 , B81C1/00896 , B81C1/00904 , B81C2203/0118 , B82Y30/00 , G02B26/0833 , H01L24/97 , H01L2224/48091 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/01054 , H01L2924/01058 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/04953 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12036 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
摘要翻译：公开了一种用于形成MEMS器件的方法，其中在晶片接合步骤之前执行最终释放步骤以保护MEMS器件免受污染，物理接触或其它有害的外部事件。除了可选的静态处理之外，在释放和晶片接合和分离之间的MEMS结构没有额外的变化的情况下，MEMS器件是最佳保护的并且整个工艺流程得到改善。该方法适用于任何MEMS器件的生产，并且特别有利于制造易碎的微镜。

72. 发明授权

US07629190B2 Method for making a micromechanical device by using a sacrificial substrate 有权
公开(公告)号：US07629190B2
公开(公告)日：2009-12-08
申请号：US11094086
申请日：2005-03-29
申请人： Satyadev R. Patel , Andrew G. Huibers
发明人： Satyadev R. Patel , Andrew G. Huibers
IPC分类号： H01L21/00
CPC分类号： B81C1/00214 , B81B7/0077 , B81B2201/042 , B81C1/00333 , B81C1/00896 , B81C1/00904 , B81C2203/0118 , B82Y30/00 , G02B26/0833 , H01L24/97 , H01L2224/48091 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/01054 , H01L2924/01058 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/04953 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12036 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： A method is disclosed for forming a micromechanical device. The method includes fully or partially forming one or more micromechanical structures multiple times on a first substrate. A second substrate is bonded onto the first substrate so as to cover the multiple areas each having one or more micromechanical structures, so as to form a substrate assembly. The substrate assembly is then separated into individual dies, each die having the one or more micromechanical structures held on a portion of the first substrate, with a portion of the second substrate bonded to the first substrate portion. Finally, the second substrate portion is removed from each die to expose the one or more micromechanical structures on the first substrate portion. The invention is also directed to a method for forming a micromechanical device, including: forming one or more micromechanical structures in one or more areas on a first substrate; bonding caps onto the first substrate so as to cover the one or more areas each having one or more micromechanical structures, so as to form a substrate assembly; after a period of time, removing the caps to expose the one or more micromechanical structures. During the period of time between bonding the caps and later removing the caps, the substrate assembly can be singulated, inspected, irradiated, annealed, die attached, shipped and/or stored.

73. 发明授权

US07573111B2 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates 有权
标题翻译：在晶片衬底上沉积，释放和封装微机电器件的方法
公开(公告)号：US07573111B2
公开(公告)日：2009-08-11
申请号：US11101939
申请日：2005-04-07
申请人： Satyadev R. Patel , Andrew G. Huibers , Steve S. Chiang
发明人： Satyadev R. Patel , Andrew G. Huibers , Steve S. Chiang
IPC分类号： H01L29/00
CPC分类号： B81C1/00214 , B81B7/0077 , B81B2201/042 , B81C1/00333 , B81C1/00896 , B81C1/00904 , B81C2203/0118 , B82Y30/00 , G02B26/0833 , H01L24/97 , H01L2224/48091 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/01054 , H01L2924/01058 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/04953 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12036 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
摘要翻译：公开了一种用于形成MEMS器件的方法，其中在晶片接合步骤之前执行最终释放步骤以保护MEMS器件免受污染，物理接触或其它有害的外部事件。除了可选的静态处理之外，在释放和晶片接合和分离之间的MEMS结构没有额外的变化的情况下，MEMS器件是最佳保护的并且整个工艺流程得到改善。该方法适用于任何MEMS器件的生产，并且特别有利于制造易碎的微镜。

74. 发明申请

US20090011373A1 METHOD OF MANUFACTURING MECHANICAL AND MICROMECHANICAL PARTS 有权
标题翻译：制造机械和微生物部件的方法
公开(公告)号：US20090011373A1
公开(公告)日：2009-01-08
申请号：US12167691
申请日：2008-07-03
申请人： Yvan Gonin , Vittorio Emilio Marsico
发明人： Yvan Gonin , Vittorio Emilio Marsico
IPC分类号： G03F7/20
CPC分类号： B81C1/00214 , B81C99/008
摘要： The invention concerns a method of manufacturing parts of a first material able to be etched, from a substrate including at least one superficial layer of said first material. The method includes the following steps: forming a substantially uniform superficial layer of a second material at the surface of said superficial layer of the first material, said second material being able to resist a selective etch of the first material, forming a bead of said second material at the periphery of said superficial layer of said second material, structuring the layer of second material and the bead by a standard photolithographic process including an etch step of sufficient duration to etch the superficial layer of second material over the entire thickness thereof, but insufficient to etch said bead over the entire thickness thereof, so as to obtain a mask of said second material extending as far as the periphery of said layer of first material, cutting out the parts made of the first material through said mask of said second material, by directional etching.
摘要翻译：本发明涉及一种从包括所述第一材料的至少一个表面层的衬底制造能够被蚀刻的第一材料的部件的方法。该方法包括以下步骤：在第一材料的所述表面层的表面处形成第二材料的基本均匀的表面层，所述第二材料能够抵抗对第一材料的选择性蚀刻，形成所述第二材料的珠粒在所述第二材料的所述表层的周边处的材料，通过标准光刻工艺来构造第二材料层和珠粒，该标准光刻工艺包括具有足够持续时间的蚀刻步骤以在整个厚度上蚀刻第二材料的表层，但不足在其整个厚度上蚀刻所述珠，以便获得所述第二材料的掩模，其延伸到所述第一材料层的周边，通过所述第二材料的掩模切割由第一材料制成的部件，通过定向蚀刻。

75. 发明申请

US20080023435A1 METHOD FOR SELF-ASSEMBLING MICROSTRUCTURES 有权
标题翻译：自组装微结构的方法
公开(公告)号：US20080023435A1
公开(公告)日：2008-01-31
申请号：US11866273
申请日：2007-10-02
申请人： Enboa WU , Chian-Shou Chang
发明人： Enboa WU , Chian-Shou Chang
IPC分类号： C23F1/00
CPC分类号： B23K3/0623 , B23K2101/40 , B81C1/00214 , B81C3/002 , H01L24/95 , H01L25/50 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/95001 , H01L2224/95085 , H01L2224/95092 , H01L2224/95122 , H01L2224/95146 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/15153 , H01L2924/15155 , H01L2924/15165 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A method for self-assembling a plurality of microstructures onto a substrate comprising using a bonding material to make the microstructure assembled onto the substrate by a physical attraction force The microstructures are self-aligned with the substrate, and further permanently fixed on and electrical connection with the substrate by the solder bumps between the microstructures and the substrate, which is formed by the solder bumps via reflow process. There is no need for the using of the conventional pick-and-place device in the present method. The present method could be applied to light emitting diodes, RFID tags, micro-integrated circuits or other types of microstructures.
摘要翻译：一种用于将多个微结构自组装到衬底上的方法，包括使用接合材料通过物理吸引力将微结构组装在衬底上。微结构与衬底自对准，并进一步永久地固定在电连接所述基板通过由所述焊料凸块经由回流工艺形成的所述微结构与所述基板之间的焊料凸点。在本方法中不需要使用传统的拾放装置。本方法可以应用于发光二极管，RFID标签，微集成电路或其他类型的微结构。

76. 发明授权

US07156916B2 Monolithic integrated crystal-structure-processed mechanical, and combined mechanical and electrical devices, and methods and systems for making 有权
标题翻译：整体式晶体结构加工的机械，机电一体化装置及其制造方法和系统
公开(公告)号：US07156916B2
公开(公告)日：2007-01-02
申请号：US10131549
申请日：2002-04-23
申请人： John W. Hartzell
发明人： John W. Hartzell
IPC分类号： C30B25/16
CPC分类号： B81C1/00214 , Y10S117/904
摘要： Monolithic integrated crystalline-structure-processed arrays of mechanical, and combined mechanical and electrical devices, and related systems and processing methods.
摘要翻译：机械和组合机电设备的单片整体结晶加工阵列及相关系统及处理方法。

77. 发明授权

US07010854B2 Re-assembly process for MEMS structures 失效
公开(公告)号：US07010854B2
公开(公告)日：2006-03-14
申请号：US10119963
申请日：2002-04-10
申请人： Benjamin N. Eldridge , Gaetan L. Mathieu
发明人： Benjamin N. Eldridge , Gaetan L. Mathieu
IPC分类号： H05K3/30
CPC分类号： B81C1/00214 , B81B7/04 , B81C3/002 , B81C2203/051 , G01R1/06711 , G01R1/06744 , G01R1/07314 , G01R1/07342 , G01R3/00 , H01L23/49827 , H01L2924/0002 , H01L2924/15174 , Y10T29/49004 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49151 , Y10T29/49204 , H01L2924/00
摘要： Methods of fabricating an array of aligned microstructures on a substrate are disclosed. The microstructures may be spring contacts or other microelements. The methods disclosed include construction of an alignment substrate, alignment of die elements with the alignment substrate, and fixation of the aligned die elements to a backing substrate.

78. 发明申请

US20050191790A1 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates 审中-公开
公开(公告)号：US20050191790A1
公开(公告)日：2005-09-01
申请号：US11102295
申请日：2005-04-07
申请人： Satyadev Patel , Andrew Huibers , Steve Chiang
发明人： Satyadev Patel , Andrew Huibers , Steve Chiang
IPC分类号： B81B3/00 , B81B7/00 , B81C1/00 , B81C99/00 , G02B26/08 , H01L21/44 , H01L21/48
CPC分类号： B81C1/00214 , B81B7/0077 , B81B2201/042 , B81C1/00333 , B81C1/00896 , B81C1/00904 , B81C2203/0118 , B82Y30/00 , G02B26/0833 , H01L24/97 , H01L2224/48091 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/01054 , H01L2924/01058 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/04953 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12036 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

79. 发明申请

US20050170614A1 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates 有权
公开(公告)号：US20050170614A1
公开(公告)日：2005-08-04
申请号：US11093927
申请日：2005-03-29
申请人： Satyadev Patel , Andrew Huibers , Steve Chiang
发明人： Satyadev Patel , Andrew Huibers , Steve Chiang
IPC分类号： B81B3/00 , B81B7/00 , B81C1/00 , B81C99/00 , G02B26/08 , H01L21/301 , H01L21/00 , H01L21/44
CPC分类号： B81C1/00214 , B81B7/0077 , B81B2201/042 , B81C1/00333 , B81C1/00896 , B81C1/00904 , B81C2203/0118 , B82Y30/00 , G02B26/0833 , H01L24/97 , H01L2224/48091 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01039 , H01L2924/01049 , H01L2924/01054 , H01L2924/01058 , H01L2924/01072 , H01L2924/01074 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/04953 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12036 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/15787 , H01L2924/19041 , H01L2924/19042 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.

80. 发明授权

US06819822B2 Two-dimensional gimbaled scanning actuator with vertical electrostatic comb-drive for actuation and/or sensing 有权
标题翻译：具有垂直静电梳状驱动器的二维万向扫描执行器用于致动和/或感测
公开(公告)号：US06819822B2
公开(公告)日：2004-11-16
申请号：US09751660
申请日：2000-12-28
申请人： Behrang Behin , Michael J. Daneman , Meng-Hsiung Kiang , Kam-Yin Lau , Satinderpall Pannu
发明人： Behrang Behin , Michael J. Daneman , Meng-Hsiung Kiang , Kam-Yin Lau , Satinderpall Pannu
IPC分类号： G02B635
CPC分类号： G02B6/3556 , B81B3/0021 , B81B2201/033 , B81B2201/045 , B81B2203/0181 , B81B2203/058 , B81B2207/07 , B81C1/00214 , G02B6/3512 , G02B6/3518 , G02B6/3542 , G02B6/3546 , G02B6/356 , G02B6/357 , G02B6/3584 , G02B26/0833 , G02B26/085 , G02B26/0858 , G02B26/0866 , H02N1/008
摘要： A two-dimensional scanner consists of a rotatable gimbal structure with vertical electrostatic comb-drive actuators and sensors. The scanner's two axes of rotation may be controlled independently by activating two sets of vertical comb-drive actuators. The first set of vertical comb-drive actuator is positioned in between a outer frame of the gimbal structure and the base, and the second set of vertical comb-drive actuator is positioned in between the inner part of the gimbal structure and the outer frame of the gimbal structure. The inner part of the gimbal structure may include a reflective surface, and the device may be used as a mirror. Furthermore, the capacitance of the vertical comb-drives may be measured to monitor the angular position of the mirror, and the capacitive position-monitoring signal may be used to implement closed-loop feedback control of the mirror angle. The two-dimensional scanner may be fabricated in a semiconductor process. Two-dimensional scanners may be used to produce fiber-optic switches.
摘要翻译：二维扫描器由可旋转的万向架结构与垂直静电梳状驱动致动器和传感器组成。扫描仪的两个旋转轴可以通过激活两组垂直梳齿驱动执行器来独立控制。第一组垂直梳齿驱动致动器位于万向架结构的外框架和基座之间，第二组垂直梳齿驱动致动器定位在万向架结构的内部和外框之间万向架结构。万向节结构的内部可以包括反射表面，并且该装置可以用作反射镜。此外，可以测量垂直梳状驱动器的电容以监视反射镜的角度位置，并且可以使用电容位置监视信号来实现镜角的闭环反馈控制。二维扫描器可以在半导体工艺中制造。二维扫描仪可用于生产光纤交换机。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式