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71. 发明申请

US20120289028A1 WAFER DIVIDING METHOD 有权
标题翻译：波分方法
公开(公告)号：US20120289028A1
公开(公告)日：2012-11-15
申请号：US13462229
申请日：2012-05-02
申请人： Jun Abatake
发明人： Jun Abatake
IPC分类号： H01L21/78
CPC分类号： H01L21/6836 , B23K26/0006 , B23K26/032 , B23K26/0622 , B23K26/0853 , B23K26/53 , B23K2101/40 , B23K2103/50 , H01L21/78 , H01L2221/68327
摘要： A wafer dividing method including a step of applying a laser beam to a wafer along division lines with the focal point of the laser beam set inside the wafer, thereby forming modified layers inside the wafer along the division lines; a step of attaching an adhesive tape to the wafer, the adhesive tape having a base sheet and an adhesive layer; a dividing step of applying an external force to the wafer by expanding the adhesive tape, thereby dividing the wafer along the division lines to obtain a plurality of device chips; and a debris catching step of heating the adhesive tape to thereby soften the adhesive layer such that it enters the space between any adjacent ones of the device chips obtained by the dividing step, thereby catching debris generated on the side surface of each device chip in the dividing step to the adhesive layer by adhesion.
摘要翻译：一种晶片分割方法，其特征在于包括：沿着分割线将激光束施加到晶片内的激光束的焦点的步骤，从而沿着分割线在晶片内部形成改质层; 将粘合带粘附到晶片上的步骤，所述胶带具有基片和粘合剂层; 通过使粘合带膨胀而向晶片施加外力，从而沿着分割线分割晶片以获得多个器件芯片的分割步骤; 以及碎片捕捉步骤，加热粘合带，从而软化粘合剂层，使其进入通过分割步骤获得的任何相邻的装置芯片之间的空间，从而捕获在每个装置芯片的侧表面上产生的碎屑通过粘合分离步骤到粘合剂层。

72. 发明授权

US08299396B2 Method for laser scribing of solar panels 失效
标题翻译：太阳能电池板激光划片方法
公开(公告)号：US08299396B2
公开(公告)日：2012-10-30
申请号：US12059305
申请日：2008-03-31
申请人： Philipp Grunewald , Phil Rumsby
发明人： Philipp Grunewald , Phil Rumsby
IPC分类号： B23K26/36
CPC分类号： B23K26/16 , B23K26/0823 , B23K26/0853 , B23K26/351 , B23K26/40 , B23K2101/36 , B23K2103/50 , H01L31/186 , H01L31/208 , Y02E10/50 , Y02P70/521
摘要： A method and device for ablation of thin layers on the rim region of the surface of a plane substrate coated with a thin film. The rim region runs along the edge or edges of the substrate, and the thin layers should be ablated in at least two, not necessarily unconnected areas of the rim region along edge pieces not parallel to one another. A laser beam is pointed toward an ablation area. The areas of the rim region to be ablated are guided through the area so that in a plane of the surface of the substrate, during the whole ablation process, there is basically a constant distance in the space that lies partly in the ablation area and has its starting point outside the substrate surface and its end point within the substrate surface.
摘要翻译：一种用于在涂覆有薄膜的平面基板的表面的边缘区域上消融薄层的方法和装置。边缘区域沿着基底的边缘或边缘延伸，并且薄层应当沿着彼此不平行的边缘片段在边缘区域的至少两个，但不一定是未连接的区域中被消融。激光束指向消融区域。要消除的边缘区域的区域被引导穿过该区域，使得在基板表面的平面中，在整个烧蚀过程中，在空间中基本上具有恒定的距离，部分位于消融区域中，并且具有其起始点在基板表面之外，其端点在基板表面内。

73. 发明申请

US20120234808A1 LASER PROCESSING METHOD 审中-公开
标题翻译：激光加工方法
公开(公告)号：US20120234808A1
公开(公告)日：2012-09-20
申请号：US13511664
申请日：2010-11-24
申请人： Makoto Nakano , Takashi Inoue , Shinji Kohyama
发明人： Makoto Nakano , Takashi Inoue , Shinji Kohyama
IPC分类号： B23K26/00
CPC分类号： B28D5/0011 , B23K26/0006 , B23K26/03 , B23K26/0622 , B23K26/0676 , B23K26/0853 , B23K26/354 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B23K2103/56 , H01L33/0095
摘要： Laser lights L1 to L3 are relatively moved along a line to cut 5, while repeating a converging step of simultaneously converging the laser lights L1 to L3 at converging positions P1 to P3 separated from each other along the line 5. This forms a plurality of modified spots S along the line 5 and causes the plurality of modified spots S to form a modified region 7. The converging positions P1 to P3 in the repeated converging steps are kept from being superposed on each other, while at least one of converging positions P21 to P23 in the converging step in a later stage is located between converging positions P11 to P13 in the converging step in an earlier stage.
摘要翻译：激光L1〜L3沿着切线5相对移动，同时重复在沿线5彼此分离的会聚位置P1〜P3的同时会聚激光L1至L3的会聚步骤。这形成多个修改沿着线5的斑点S，并且使多个改质斑点S形成改质区域7.在反复收敛步骤中的会聚位置P1〜P3保持彼此重叠，而会聚位置P21〜在后期的会聚步骤中的P23位于收敛步骤中的收敛位置P11至P13之间。

74. 发明授权

US08263479B2 Method for cutting semiconductor substrate 有权
标题翻译：半导体衬底切割方法
公开(公告)号：US08263479B2
公开(公告)日：2012-09-11
申请号：US10537509
申请日：2003-09-11
申请人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Ryuji Sugiura
发明人： Fumitsugu Fukuyo , Kenshi Fukumitsu , Naoki Uchiyama , Ryuji Sugiura
IPC分类号： H01L21/00
CPC分类号： H01L21/2633 , B23K26/0853 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D1/221 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2221/68327 , H01L2221/68336 , H01L2224/274 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/0103 , H01L2924/01033 , H01L2924/01039 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01082 , H01L2924/07802 , H01L2924/10329 , H01L2924/12042 , H01L2924/12043 , H01L2924/351 , H01L2924/3512 , H01L2924/00
摘要： Multiphoton absorption is generated, so as to form a part which is intended to be cut 9 due to a molten processed region 13 within a silicon wafer 11, and then an adhesive sheet 20 bonded to the silicon wafer 11 is expanded. This cuts the silicon wafer 11 along the part which is intended to be cut 9 with a high precision into semiconductor chips 25. Here, opposing cut sections 25a, 25a of neighboring semiconductor chips 25, 25 are separated from each other from their close contact state, whereby a die-bonding resin layer 23 is also cut along the part which is intended to be cut 9. Therefore, the silicon wafer 11 and die-bonding resin layer 23 can be cut much more efficiently than in the case where the silicon wafer 11 and die-bonding resin layer 23 are cut with a blade without cutting a base 21.
摘要翻译：产生多光子吸收，从而形成由于硅晶片11内的熔融处理区域13而被切割的部分9，然后，粘合到硅晶片11的粘合片20膨胀。这样，将硅晶片11沿着要被切割的部分9以高精度切割成半导体芯片25.这里，相邻的半导体芯片25,25的相对的切割部分25a，25a从它们的紧密接触状态彼此分离由此，沿着要切割的部分9也切割芯片接合树脂层23.因此，与硅晶片11和芯片接合树脂层23的情况相比，可以更有效地切割硅晶片11和芯片接合树脂层23。 11和芯片接合树脂层23用刀片切割而不切割基部21。

75. 发明申请

US20120111840A1 LASER PROCESSING APPARATUS 审中-公开
标题翻译：激光加工设备
公开(公告)号：US20120111840A1
公开(公告)日：2012-05-10
申请号：US13281971
申请日：2011-10-26
申请人： Keiji Nomaru
发明人： Keiji Nomaru
IPC分类号： B23K26/06
CPC分类号： B23K26/0853 , B23K26/0006 , B23K26/0613 , B23K26/0652 , B23K26/0676 , B23K26/0876 , B23K26/53 , B23K2103/56
摘要： A laser processing apparatus including a laser beam applying unit for applying a laser beam having a transmission wavelength to a workpiece held on a chuck table. The laser beam applying unit includes a laser beam oscillating unit for oscillating the laser beam, a focusing lens for focusing the laser beam oscillated by the laser beam oscillating unit, and a diffractive optic element interposed between the laser beam oscillating unit and the focusing lens. The laser beam oscillated by the laser beam oscillating unit is separated into a plurality of laser beams having different divergence angles by the diffractive optic element. The plurality of laser beams are next focused by the focusing lens to thereby form a plurality of focal points on the optical axis of the focusing lens.
摘要翻译：一种激光加工设备，包括：激光束施加单元，用于向保持在卡盘台上的工件施加具有透射波长的激光束。激光束施加单元包括用于振荡激光束的激光束振荡单元，用于聚焦由激光束振荡单元振荡的激光束的聚焦透镜，以及置于激光束振荡单元和聚焦透镜之间的衍射光学元件。由激光束振荡单元振荡的激光束被衍射光学元件分离成具有不同发散角的多个激光束。接着，多个激光束被聚焦透镜聚焦，从而在聚焦透镜的光轴上形成多个焦点。

76. 发明授权

US08138058B2 Substrate with marker, manufacturing method thereof, laser irradiation apparatus, laser irradiation method, light exposure apparatus, and manufacturing method of semiconductor device 有权
标题翻译：具有标记的基板，其制造方法，激光照射装置，激光照射方法，曝光装置以及半导体装置的制造方法
公开(公告)号：US08138058B2
公开(公告)日：2012-03-20
申请号：US11942133
申请日：2007-11-19
申请人： Koichiro Tanaka , Takatsugu Omata
发明人： Koichiro Tanaka , Takatsugu Omata
IPC分类号： H01L21/76
CPC分类号： H01L21/02675 , B23K26/042 , B23K26/0738 , B23K26/0853 , G03F7/7085 , G03F9/7065 , G03F9/7076 , G03F9/7088 , H01L21/02678 , H01L21/2026 , H01L27/1214 , H01L27/1218 , H01L27/1266 , H01L27/1285 , Y10S438/942
摘要： To provide a laser irradiation apparatus which performs alignment of an irradiated object and emits a laser beam precisely, a laser irradiation method, and a manufacturing method of a TFT with high reliability with the use of a method for precisely targeting a desired irradiation position of the laser beam. A substrate with marker is mounted on a stage formed using a material which transmits infrared light; a marker, which is provided in the substrate with marker mounted on the stage, is detected using a camera capable of sensing infrared light, and a position of the stage is controlled; a laser beam is emitted from a laser oscillator; the laser beam emitted from the laser oscillator is processed into a linear shape by an optical system, and the substrate with marker mounted on the stage is irradiated with the laser beam.
摘要翻译：为了提供一种激光照射装置，其通过使用精确地瞄准所需照射位置的方法，可以精确地瞄准被照射物体的对准并发射激光束，激光照射方法和具有高可靠性的TFT的制造方法激光束。具有标记的基板安装在使用透射红外光的材料形成的台上; 使用能够感测红外光的照相机检测在基板中设置有安装在平台上的标记的标记，并且控制台的位置; 从激光振荡器发射激光束; 从激光振荡器发射的激光束通过光学系统被处理为线状，并且用激光束照射安装在台上的标记的基板。

77. 发明申请

US20120018412A1 OPTICAL DEVICE AND LASER BEAM MACHINING APPARATUS HAVING OPTICAL DEVICE 有权
标题翻译：光学装置和具有光学装置的激光束加工装置
公开(公告)号：US20120018412A1
公开(公告)日：2012-01-26
申请号：US13179131
申请日：2011-07-08
申请人： Yusaku ITO
发明人： Yusaku ITO
IPC分类号： B23K26/00 , F21V9/14 , G02B27/10
CPC分类号： B23K26/0853 , B23K26/0676
摘要： An optical device includes: a beam splitter by which a laser beam oscillated from an oscillator is branched into a first branch beam going ahead through transmission and a second branch beam going ahead through reflection; a first mirror by which the first branch beam going out of the beam splitter is reflected to go again toward the beam splitter; a second mirror by which the second branch beam going out of the beam splitter is reflected to go again toward the beam splitter; and a circular disk-like rotating unit for integrally rotating the first mirror and a second mirror, with a laser beam branch point in the beam splitter as a center of rotation.
摘要翻译：光学装置包括：分束器，从振荡器振荡的激光束通过该分束器分支成通过透射向前延伸的第一分支光束和通过反射向前延伸的第二分支光束; 第一反射镜通过该第一反射镜反射离开分束器的第一分支光束再次朝向分束器; 第二反射镜通过该第二反射镜反射离开分束器的第二分支光束再次朝向分束器移动; 以及用于使第一反射镜和第二反射镜整体旋转的圆盘状旋转单元，其中分束器中的激光束分支点为旋转中心。

78. 发明授权

US08089024B2 Torch spacing apparatus 有权
标题翻译：手电筒间距装置
公开(公告)号：US08089024B2
公开(公告)日：2012-01-03
申请号：US12212001
申请日：2008-09-17
申请人： Murray Houlton Forlong
发明人： Murray Houlton Forlong
IPC分类号： B23K10/00
CPC分类号： B23K7/06 , B23K7/10 , B23K26/0853 , B23K37/0211
摘要： A torch spacing apparatus for a plasma or flame cutting machine includes a gantry that is guided to travel in an X axis. Mounted to the gantry is at least one carriage that is/are guided to travel in a Y axis. Mounted to each carriage are selected tooling having at least two cutting torches mounted thereon with an active cutting tool in an active cutting position. The carriage is mounted to enable tooling substitution whereby the torch spacing apparatus includes a substitution mechanism which is operatively attached to the carriage and tooling such that the said substitution mechanism is adapted to allow the position of a cutting torch or active cutting torch to be substituted with another cutting torch currently in the active position to space the torches accordingly by rotating the cutting tools about a Z axis.
摘要翻译：用于等离子体或火焰切割机的割炬间隔装置包括被引导以在X轴上行进的台架。安装到台架的是至少一个被引导到Y轴行进的托架。安装到每个托架的选择的工具具有至少两个安装在其上的切割炬，其中主动切割工具处于主动切割位置。滑架被安装成能够进行工具替换，由此割炬间距装置包括可操作地附接到滑架和工具的替代机构，使得所述替代机构适于允许切割炬或主动割炬的位置被目前处于主动位置的另一个割炬相应地通过围绕Z轴旋转切割工具来使火炬空间。

79. 发明申请

US20110315334A1 HOLE OPENING DEVICE AND HOLE OPENING METHOD FOR EYELESS NEEDLE 审中-公开
标题翻译：孔眼打开装置和开孔方法
公开(公告)号：US20110315334A1
公开(公告)日：2011-12-29
申请号：US13121950
申请日：2009-09-28
申请人： Kazuaki Katoh , Kanji Matsutani
发明人： Kazuaki Katoh , Kanji Matsutani
IPC分类号： B21G3/18
CPC分类号： B21G1/08 , A61B2017/00526 , A61B2017/06028 , B23K26/032 , B23K26/0853 , B23K26/0861 , B23K26/389
摘要： There is provided a hole opening device and a hold opening method for an eyeless needle capable of accurately aligning the center of a needle material and the optical axis of a laser beam as well as opening a hole precisely even with a thin needle material. A plurality of needle materials 1 are arranged in a row and mounted on a table 21, base ends of several needle materials 1 are photographed by a camera 25, a needle material 1 to be processed is located from the photographed image, and the center location of the needle material is calculated. The optical axis of a laser of a laser oscillator and center location of a base end of the needle material 1 to be processed are matched, and a hole 1c of a predetermined depth is opened by the laser. The plurality of needle materials are shifted, a needle material 1 to be processed next of the plurality of needle materials is located from the image photographed by the camera, the center location of the base end is located from the image of the base end of the needle material, and the plurality of needle materials are shifted so as to match the center location of the base end to be processed and the optical axis of the laser of the laser oscillator.
摘要翻译：提供一种用于无眼针的开孔装置和保持打开方法，其能够精确地对准针材的中心和激光束的光轴，并且即使用细针材料也能精确地打开孔。多个针材1排列成一排并安装在工作台21上，由摄像机25对若干针材1的基端进行摄影，将被处理针材1从拍摄图像定位，中心位置计算针材。激光振荡器的激光的光轴和待处理的针材1的基端的中心位置相匹配，并且通过激光打开预定深度的孔1c。多个针材移动，接下来的多个针材的待处理针材1位于由照相机拍摄的图像上，基端的中心位置位于针状材料，并且多个针状材料被移动以与待处理的基端的中心位置和激光振荡器的激光的光轴相匹配。

80. 发明申请

US20110312115A1 LASER MACHINING METHOD AND METHOD FOR MANUFACTURING COMPOUND SEMICONDUCTOR LIGHT-EMITTING ELEMENT 有权
标题翻译：激光加工方法和制造化合物半导体发光元件的方法
公开(公告)号：US20110312115A1
公开(公告)日：2011-12-22
申请号：US13203112
申请日：2010-02-25
申请人： Kazuhiro Kato
发明人： Kazuhiro Kato
IPC分类号： H01L21/268 , H01L33/16
CPC分类号： B23K26/0853 , B23K26/0622 , B23K26/082 , B23K26/0823 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/0011 , H01L21/67092 , H01L33/0095 , H01L2924/0002 , H01L2924/00
摘要： Provided is a laser machining method in which, when modified regions are formed plural number of times by changing the depth in the thickness direction of a substrate, displacement of the formed modified regions from a planned cutting line is inhibited. Specifically provided is a laser machining method for cutting a substrate (10) into chips. Modified regions are formed at a deep distance (d1) inside the substrate from the entrance surface of a laser beam by first scanning (a) in which the substrate is scanned with the laser beam along a planned cutting line (21a) in the X direction of the substrate and second scanning (b) in which the substrate is scanned with the laser beam along a planned cutting line (21b) in the Y direction. Modified regions are again formed at a shallow distance (d2) (d1>d2) inside the substrate by third scanning (c) in which the substrate is scanned with the laser beam along the planned cutting line (21a) in the X direction and fourth scanning (d) in which the substrate is scanned with the laser beam along the planned cutting line (21b) in the Y direction. The third scanning is performed by scanning from a U end portion at the periphery to the center and scanning from a D end portion at the periphery to the center.
摘要翻译：提供了一种激光加工方法，其中当通过改变基板的厚度方向的深度来改变多个次数时，抑制了所形成的改质区域与预定切割线的位移。具体提供了一种用于将基板（10）切割成芯片的激光加工方法。通过第一次扫描（a），沿着X方向沿着规划的切割线（21a）用激光束扫描基板，从而从激光束的入射面形成在基板内部的深度（d1）处的改质区域以及沿着Y方向沿着规划切割线（21b）用激光束扫描基板的第二扫描（b）。通过第三扫描（c）在衬底内部的浅距离（d2）（d1> d2）处再次形成改质区域，其中沿X方向沿着规划切割线（21a）用激光束扫描基板，第四扫描沿着Y方向沿着规划切割线（21b）用激光束扫描基板的扫描（d）。第三扫描通过从周边的U端部到中心进行扫描，并且从周边的D端部到中心进行扫描来进行。

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