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    • 71. 发明申请
    • Double Polysilicon Process for Non-Volatile Memory
    • 用于非易失性存储器的双重多晶硅工艺
    • US20100140680A1
    • 2010-06-10
    • US12331263
    • 2008-12-09
    • Jeong Y. ChoiKameswara K. Rao
    • Jeong Y. ChoiKameswara K. Rao
    • H01L29/788H01L21/336
    • H01L29/66825
    • A process flow for creating a non-volatile memory cell, the process flow including the steps of forming a doped well in a semiconducting portion of a substrate, forming a gate dielectric layer on top of the substrate, depositing a first polysilicon layer on top of the gate dielectric layer, patterning and etching the first polysilicon layer, selectively oxidizing the first polysilicon layer, implanting lightly-doped source/drain regions into the well, forming sidewall spacers adjacent the first polysilicon layer, implanting source/drain regions into the well, thereby forming a channel area, depositing a dielectric layer on top of the first polysilicon layer, depositing a second polysilicon layer on top of the dielectric layer, forming a masking layer on the second polysilicon layer, and etching both the second polysilicon layer and the dielectric layer using the masking layer.
    • 一种用于产生非易失性存储器单元的工艺流程,所述工艺流程包括以下步骤:在衬底的半导体部分中形成掺杂阱,在所述衬底的顶部上形成栅极电介质层,在所述衬底的顶部上形成第一多晶硅层; 栅极电介质层,图案化和蚀刻第一多晶硅层,选择性地氧化第一多晶硅层,将轻掺杂的源极/漏极区域注入到阱中,形成与第一多晶硅层相邻的侧壁间隔物,将源极/漏极区域注入到阱中, 从而形成通道区域,在第一多晶硅层的顶部上沉积电介质层,在介电层的顶部上沉积第二多晶硅层,在第二多晶硅层上形成掩模层,并蚀刻第二多晶硅层和电介质层 层使用掩模层。
    • 74. 发明授权
    • Dual-port SRAM memory using single-port memory cell
    • 使用单端口存储单元的双端口SRAM存储器
    • US07533222B2
    • 2009-05-12
    • US11427785
    • 2006-06-29
    • Wingyu Leung
    • Wingyu Leung
    • G06F13/00
    • G11C7/1075G11C11/406G11C11/40603
    • A dual-port memory system is implemented using single-port memory cells. An access arbiter having a synchronization circuit is used to prioritize and synchronize the access requests associated with the two ports. The access arbiter can also prioritize and synchronize refresh requests, in the case where the single-port memory cells require refresh. Access requests on the two ports and the refresh requests can be asynchronous. The access arbiter synchronizes the various requests by latching the requests into first-stage registers when a row access signal (RAS) is activated, and subsequently latching the contents of the first-stage registers into second-stage registers after a selected delay.
    • 使用单端口存储器单元实现双端口存储器系统。 具有同步电路的访问仲裁器用于对与两个端口相关联的访问请求进行优先级排列和同步。 在单端口存储器单元需要刷新的情况下,访问仲裁器还可以对刷新请求进行优先级排序并同步。 两个端口上的访问请求和刷新请求可以是异步的。 接入仲裁器通过在行接入信号(RAS)被激活时将请求锁存到第一级寄存器中,并且随后在选择的延迟之后将第一级寄存器的内容锁存到第二级寄存器中来同步各种请求。
    • 75. 发明授权
    • Word line driver for DRAM embedded in a logic process
    • 用于嵌入在逻辑过程中的DRAM的字线驱动器
    • US07447104B2
    • 2008-11-04
    • US11559870
    • 2006-11-14
    • Wingyu Leung
    • Wingyu Leung
    • G11C8/00G11C7/00G11C5/14G11C7/02
    • G11C8/08G11C11/4085G11C2207/104H01L27/10897
    • A word line driver is provided for accessing a DRAM cell embedded in a conventional logic process. The DRAM cell includes a p-channel access transistor coupled to a cell capacitor. The word line driver includes an n-channel transistor located in a p-well, wherein the p-well is located in a deep n-well. The deep n-well is located in a p-type substrate. A word line couples the drain of the n-channel transistor to the gate of the p-channel access transistor. A negative boosted voltage supply applies a negative boosted voltage to the p-well and the source of the n-channel transistor. The negative boosted voltage is less than ground by an amount equal to or greater than the threshold voltage of the p-channel access transistor. The deep n-well and the p-type substrate are coupled to ground. The various polarities can be reversed in another embodiment.
    • 提供了用于访问嵌入在常规逻辑处理中的DRAM单元的字线驱动器。 DRAM单元包括耦合到单元电容器的p沟道存取晶体管。 字线驱动器包括位于p阱中的n沟道晶体管,其中p阱位于深n阱中。 深n阱位于p型衬底中。 字线将n沟道晶体管的漏极耦合到p沟道存取晶体管的栅极。 负升压电压对p沟道和n沟道晶体管的源极施加负升压电压。 负升压电压小于接地,等于或大于p沟道存取晶体管的阈值电压。 深n阱和p型衬底耦合到地面。 在另一个实施例中,各种极性可以颠倒。