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71. 发明授权

US07611919B2 Bonding interface for micro-device packaging 失效
标题翻译：微型封装接合界面
公开(公告)号：US07611919B2
公开(公告)日：2009-11-03
申请号：US11112406
申请日：2005-04-21
申请人： Kirby Sand , Charles C. Haluzak , Chien-Hua Chen
发明人： Kirby Sand , Charles C. Haluzak , Chien-Hua Chen
IPC分类号： H01L21/00
CPC分类号： B81C3/002 , B81C1/00269 , B81C2203/051
摘要： In one embodiment, a method for making a cover for a micro-device package includes forming a layer of silicon on a transparent substrate and selectively removing parts of the silicon layer to form a bonding ring and an alignment target.
摘要翻译：在一个实施例中，制造用于微器件封装的盖的方法包括在透明衬底上形成硅层，并选择性地去除硅层的部分以形成结合环和对准靶。

72. 发明授权

US07576439B2 Electrically connecting substrate with electrical device 有权
标题翻译：电气连接基板与电气设备
公开(公告)号：US07576439B2
公开(公告)日：2009-08-18
申请号：US12234459
申请日：2008-09-19
申请人： David M. Craig , Chien-Hua Chen
发明人： David M. Craig , Chien-Hua Chen
IPC分类号： H01L23/52 , H01L23/48 , H01L29/40 , H01L21/44 , B23K31/02 , B23K1/00 , B23K1/06
CPC分类号： H01L24/85 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/80 , H01L2224/05554 , H01L2224/45144 , H01L2224/45147 , H01L2224/4809 , H01L2224/48091 , H01L2224/48227 , H01L2224/48464 , H01L2224/48471 , H01L2224/48475 , H01L2224/48599 , H01L2224/49171 , H01L2224/78301 , H01L2224/85045 , H01L2224/85051 , H01L2224/8518 , H01L2224/85186 , H01L2224/85205 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01054 , H01L2924/01079 , H01L2924/01082 , H01L2924/10161 , H01L2924/12041 , H01L2924/14 , H01L2924/1461 , H01L2924/00 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.
摘要翻译：基板与安装在基板上的电气装置电连接。在导线的第一端和基板的焊盘之间形成球接合。线内形成反向运动回路。在电线的第二端和电气装置的接合焊盘之间形成接合。

73. 发明授权

US07563691B2 Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding 有权
标题翻译：通过等离子体增强接合形成的等离子体增强接合和结合结构的方法
公开(公告)号：US07563691B2
公开(公告)日：2009-07-21
申请号：US10977141
申请日：2004-10-29
申请人： Chien-Hua Chen , Barry C. Snyder , Ronald A. Hellekson
发明人： Chien-Hua Chen , Barry C. Snyder , Ronald A. Hellekson
IPC分类号： H01L21/30
CPC分类号： B41J2/1642 , B41J2/16 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1634 , B81C3/001 , B81C2201/019 , H01L21/2007 , H01L21/76251 , H01L24/26 , H01L24/83 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/1461 , Y10T428/24322 , Y10T428/24612 , H01L2924/00
摘要： An electronic device comprises a substrate comprising a first surface and a second surface, a substrate carrier comprising a first surface and a second surface, and an inorganic material bonding the second surface of the substrate and the second surface of the substrate carrier.
摘要翻译：一种电子器件包括包括第一表面和第二表面的衬底，包括第一表面和第二表面的衬底载体，以及结合衬底的第二表面和衬底载体的第二表面的无机材料。

74. 发明申请

US20090166161A1 POWER CIRCUIT-SWITCHING DEVICE 审中-公开
标题翻译：电源电路切换装置
公开(公告)号：US20090166161A1
公开(公告)日：2009-07-02
申请号：US12184263
申请日：2008-08-01
申请人： Chien-Hua Chen
发明人： Chien-Hua Chen
IPC分类号： H01H33/02
CPC分类号： H01H13/023 , H01H9/08 , H01H9/16 , H01H13/04
摘要： A power circuit-switching device is proposed, which includes: a frame body; at least an electric control unit having a control member, provided with a plurality of first positioning portions and first coupling portions; and at least an operative element having an operating face and a coupling face opposite to the operating face, the coupling face having a plurality of second positioning portions and second coupling portions formed thereon in an corresponding manner, such that each of the second coupling portions can be coupled to first coupling portions, and each of the second positioning portions can be coupled to first positioning portions respectively, thereby providing for easy alignment in installation and avoiding misalignments and misuse that would otherwise cause damage to the components or electrical hazards.
摘要翻译：提出了一种电源电路切换装置，包括：框体; 至少一个具有控制构件的电气控制单元，设置有多个第一定位部分和第一联接部分; 并且至少具有操作面和与操作面相对的联接面的操作元件，所述连接面具有多个第二定位部和以相应的方式形成在其上的第二联接部，使得每个第二联接部可以联接到第一联接部分，并且每个第二定位部分可以分别联接到第一定位部分，从而提供在安装中的容易对准，并避免否则将导致部件损伤或电气危险的错位和误操作。

75. 发明授权

US07534662B2 Methods for hermetic sealing of post media-filled MEMS package 失效
标题翻译：填充后填充的MEMS封装的密封方法
公开(公告)号：US07534662B2
公开(公告)日：2009-05-19
申请号：US11127915
申请日：2005-05-11
申请人： Chien-Hua Chen , Charles C. Haluzak , Donald Michael
发明人： Chien-Hua Chen , Charles C. Haluzak , Donald Michael
IPC分类号： H01L21/00 , H01L23/22
CPC分类号： B81C1/00293 , B81C1/00285 , B81C2203/0145
摘要： This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port with at least one medium. A further operation can be plugging the fill port in the MEMS package with a sealant. Another operation can include depositing a metal cap over the sealant to hermetically seal the fill port.
摘要翻译：本发明提供了一种用金属盖密封填充后填充包装的系统和方法。该方法可以包括通过具有至少一种介质的填充端口填充MEMS封装的操作。进一步的操作可以用密封剂堵塞MEMS封装中的填充端口。另一种操作可以包括在密封剂上沉积金属盖以气密地密封填充口。

76. 发明授权

US07470557B2 Self-aligned coating on released MEMS 失效
标题翻译：释放的MEMS上的自对准涂层
公开(公告)号：US07470557B2
公开(公告)日：2008-12-30
申请号：US10826288
申请日：2004-04-19
申请人： Chien-Hua Chen , Bradley Charles John , Mike Groh
发明人： Chien-Hua Chen , Bradley Charles John , Mike Groh
IPC分类号： H01L21/31
CPC分类号： G11B9/14 , B82Y10/00 , G01Q80/00 , G11B9/149
摘要： A method of making a semiconductor device including the steps of fabricating at least one component on a substrate and coating the component with a first self-aligned polymer film.
摘要翻译：一种制造半导体器件的方法，包括以下步骤：在衬底上制造至少一种组分并用第一自对准聚合物膜涂覆组分。

77. 发明申请

US20080272446A1 Packaged MEMS device assembly 失效
标题翻译：封装的MEMS器件组件
公开(公告)号：US20080272446A1
公开(公告)日：2008-11-06
申请号：US11416709
申请日：2006-05-03
申请人： Charles C. Haluzak , Jeffrey R. Pollard , Kirby Sand , John R. Sterner , Henry Kang , Chien-Hua Chen , James Denning Smith
发明人： Charles C. Haluzak , Jeffrey R. Pollard , Kirby Sand , John R. Sterner , Henry Kang , Chien-Hua Chen , James Denning Smith
IPC分类号： H01L29/84 , H01L21/00
CPC分类号： B81C3/001 , H01L21/67092 , H01L25/0657 , H01L25/50 , H01L2924/0002 , H01L2924/00
摘要： A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.
摘要翻译：封装的微机电系统（MEMS）设备组件包括MEMS器件，其中设置MEMS器件的衬底以及设置在衬底上的盖子。组件可以包括盖内的一个或多个第一空腔，其具有满足封装的MEMS装置组件的包装规格的预定体积。组件可以包括盖内的一个或多个第二空腔和盖内的一个或多个对应的溢流区域，其中每个第二空腔包含材料，并且每个相应的溢流区域适于捕获材料的溢流。组件可以包括盖内的一个或多个第三空腔和衬底和盖子之一内的一个或多个通道，以将MEMS器件流体连接到第三腔。

78. 发明授权

US07436571B2 Micro-displays 失效
标题翻译：微型显示器
公开(公告)号：US07436571B2
公开(公告)日：2008-10-14
申请号：US10971637
申请日：2004-10-20
申请人： John R Sterner , Charles C Haluzak , William R Boucher , Scott Lerner , James W. Ring , Brett Dahlgren , Chien-Hua Chen , Arthur Piehl , Quan Qi
发明人： John R Sterner , Charles C Haluzak , William R Boucher , Scott Lerner , James W. Ring , Brett Dahlgren , Chien-Hua Chen , Arthur Piehl , Quan Qi
IPC分类号： G02B26/00 , G02B26/08 , G02F1/29
CPC分类号： G03B21/008 , G03B21/2073
摘要： A micro-display has a device chip with a transparent layer overlying one or more micro-electromechanical system devices. A transparent cover overlies the transparent layer. An index-of-refraction-matching medium is interposed between the transparent layer and the transparent cover. An index of refraction of the index-of-refraction-matching medium is substantially equal to an index of refraction of the transparent layer and the transparent cover.
摘要翻译：微型显示器具有覆盖一个或多个微机电系统设备的透明层的器件芯片。透明盖覆盖透明层。折射率匹配介质夹在透明层和透明罩之间。折射率匹配介质的折射率基本上等于透明层和透明盖的折射率。

79. 发明申请

US20080128390A1 Fluidic MEMS Device 有权
标题翻译：流体MEMS器件
公开(公告)号：US20080128390A1
公开(公告)日：2008-06-05
申请号：US11948891
申请日：2007-11-30
申请人： Chien-Hua Chen , Xia feng Yang
发明人： Chien-Hua Chen , Xia feng Yang
IPC分类号： B44C1/22
CPC分类号： F04B43/046 , B01D57/02 , B01D61/18 , B01D63/081 , B01D63/088 , B01D67/003 , B01D2323/30 , B01D2323/50 , B01D2325/08 , B01J19/0093 , B01J2219/00783 , B01J2219/0081 , B01J2219/00833 , B01J2219/00853 , B01J2219/00873 , B01J2219/00891 , B01J2219/00909 , B01J2219/00912 , B01J2219/00943 , B01L3/502707 , B01L3/50273 , B01L3/502738 , B01L3/502753 , B01L7/525 , B01L2200/027 , B01L2200/10 , B01L2200/12 , B01L2300/0654 , B01L2300/0681 , B01L2300/1827 , B01L2400/0415 , B01L2400/0439 , B01L2400/0442 , B01L2400/0638 , B81B2201/058 , B81C1/00119 , F04B19/24 , G01N21/05 , G01N2021/0346 , Y10T436/11 , Y10T436/117497 , Y10T436/118339 , Y10T436/25 , Y10T436/25375 , Y10T436/2575
摘要： A method includes depositing a sacrificial material on a substrate, and depositing a polymer layer on the substrate and the sacrificial material. The method further includes removing the sacrificial material to at least partially define boundaries of at least one fluidic channel of a fluidic micro electromechanical system (MEM) device, the at least one fluidic channel is at least partially defined by a portion of the polymer layer and a portion of the substrate.
摘要翻译：一种方法包括将牺牲材料沉积在基底上，以及在基底和牺牲材料上沉积聚合物层。该方法还包括去除牺牲材料以至少部分地限定流体微机电系统（MEM）装置的至少一个流体通道的边界，所述至少一个流体通道至少部分地由聚合物层的一部分限定，衬底的一部分。

80. 发明申请

US20070274669A1 Fabrication tool for bonding 有权
标题翻译：用于粘接的加工工具
公开(公告)号：US20070274669A1
公开(公告)日：2007-11-29
申请号：US11413333
申请日：2006-04-28
申请人： Chien-Hua Chen , Troy Schwinabart , William Atkinson
发明人： Chien-Hua Chen , Troy Schwinabart , William Atkinson
IPC分类号： G02B6/00
CPC分类号： H01L21/67092
摘要： A fabrication tool presses a first device surface against a second device surface after the first and the second device surfaces have been plasma activated, to bond the first device surface with the second device surface. The fabrication tool includes a bonding piston to exert force on the first device surface to press the first device surface against the second device surface. The fabrication tool also includes a pressure plate situated between the bonding piston and the first device surface. The fabrication tool further includes a mechanism to ensure that the force exerted by the bonding piston on the first device surface via the pressure plate is initially exerted at one or more first locations on the first device surface and subsequently exerted at one or more second locations on the first device surface.
摘要翻译：在第一和第二装置表面已被等离子体激活之后，制造工具将第一装置表面压靠第二装置表面，以将第一装置表面与第二装置表面结合。制造工具包括粘合活塞，以在第一装置表面施加力以将第一装置表面压靠第二装置表面。制造工具还包括位于接合活塞和第一装置表面之间的压力板。制造工具还包括机构，以确保由第一装置表面经由压板施加的结合活塞的力最初施加在第一装置表面上的一个或多个第一位置上，随后在一个或多个第二位置上施加第一个设备表面。

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