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71. 发明申请

US20080061458A1 Mold for forming lens of light emitting diode package and method of manufacturing light emitting diode package using the same 审中-公开
标题翻译：用于形成发光二极管封装透镜的模具及使用其的制造发光二极管封装的方法
公开(公告)号：US20080061458A1
公开(公告)日：2008-03-13
申请号：US11896975
申请日：2007-09-07
申请人： Young Sam Park , Hun Joo Hahm , Seong Yeon Han , Chul Hee Yoo
发明人： Young Sam Park , Hun Joo Hahm , Seong Yeon Han , Chul Hee Yoo
IPC分类号： B29D11/00 , B28B7/36
CPC分类号： B29D11/00278 , B29C33/62 , G02B3/0031 , G02B3/0037
摘要： There is provided a mold formed of fluorocarbon resin to prevent a resin, which is a material of a lens of a LED package, from adhering to the mold even without using a separate release film, and a method of manufacturing the light emitting package using the mold. The mold includes a plurality of cavities formed in an upper surface thereof to hold a resin for forming lenses of the light emitting diode package. The mold and the method using the mold prevents adherence of the resin without using a separate release film, allowing formation of a lens with a smooth surface and formation of a protrusion or an indentation on the surface of the lens.
摘要翻译：提供一种由碳氟树脂形成的模具，以防止作为LED封装的透镜的材料的树脂即使不使用单独的脱模膜也粘附到模具上，以及使用该方法制造发光封装模子。模具包括形成在其上表面中的多个空腔，以容纳用于形成发光二极管封装的透镜的树脂。使用模具的模具和方法防止树脂粘附，而不使用单独的脱模膜，允许形成具有光滑表面的透镜并在透镜表面上形成突起或凹陷。

72. 发明授权

US08680585B2 Light emitting diode package and method of manufacturing the same 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US08680585B2
公开(公告)日：2014-03-25
申请号：US12944401
申请日：2010-11-11
申请人： Young Sam Park , Hun Joo Hahm
发明人： Young Sam Park , Hun Joo Hahm
IPC分类号： H01L27/148
CPC分类号： H01L33/54 , H01L24/97 , H01L33/505 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/12041 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： There is provided a light emitting diode package and a method of manufacturing the same. A light emitting diode package according to an aspect of the invention may include: an LED chip; a body part having the LED chip mounted thereon; a pair of reflective parts extending from the body part to face each other while interposing the LED chip therebetween, and reflecting light emitted from the LED chip; and a molding part provided between the pair of reflective parts to encapsulate the LED chip and having a top surface whose central region is curved inwards.
摘要翻译：提供一种发光二极管封装及其制造方法。根据本发明的一个方面的发光二极管封装可以包括：LED芯片; 具有安装在其上的LED芯片的主体部分; 一对反射部件，其从身体部分延伸到彼此面对，同时插入LED芯片，并且反射从LED芯片发射的光; 以及设置在所述一对反射部件之间的模制部件，以封装所述LED芯片并具有其中心区域向内弯曲的顶表面。

73. 发明申请

US20050263785A1 LIGHT EMITTING DIODE DEVICE 失效
标题翻译：发光二极管装置
公开(公告)号：US20050263785A1
公开(公告)日：2005-12-01
申请号：US10916525
申请日：2004-08-12
申请人： Hyung Kim , Young Sam Park , Hun Joo Hahm , Jung Park , Young Jeong
发明人： Hyung Kim , Young Sam Park , Hun Joo Hahm , Jung Park , Young Jeong
IPC分类号： G02F1/13357 , H01L29/22 , H01L33/54 , H01L33/60 , H01L33/00
CPC分类号： H01L33/54 , H01L33/60
摘要： Disclosed herein is a light emitting diode (LED) device. The light emitting diode device comprises a package formed with a terminal for applying an electrical signal, one or more LED chips mounted on the package such that the LED chips are electrically connected to the terminal, a lens formed to surround the LED chips on the package for changing path of light emitted from the LED chips to the horizontal direction with the difference of the refraction rates of the media, and a reflector formed on the lens for reflecting the light, emitted above the lens without being refracted in the horizontal direction at the lens, to the horizontal direction. The LED device reflects the light, which is deviated from the optical design range of the lens and emitted above the lens, back to the lens, thereby preventing the hot spot from being generated, and enhancing horizontal emission efficiency of the light.
摘要翻译：这里公开了一种发光二极管（LED）装置。发光二极管装置包括形成有用于施加电信号的端子的封装，安装在封装上的一个或多个LED芯片，使得LED芯片电连接到端子，形成为围绕封装上的LED芯片的透镜用于随着介质的折射率的差异而将从LED芯片发射的光的路径改变到水平方向，以及形成在透镜上的用于反射透镜的反射器的反射器，而不是在透镜的上方沿水平方向折射镜头，水平方向。 LED装置将从透镜的光学设计范围偏离的光反射回透镜，从而防止产生热点，提高光的水平发光效率。

74. 发明申请

US20100134405A1 EDGE TYPE BACKLIGHT UNIT HAVING LOCAL DIMMING FUNCTION 审中-公开
标题翻译：具有本地调光功能的边缘型背光单元
公开(公告)号：US20100134405A1
公开(公告)日：2010-06-03
申请号：US12615072
申请日：2009-11-09
申请人： Jung Kyu PARK , Hun Joo Hahm
发明人： Jung Kyu PARK , Hun Joo Hahm
IPC分类号： G09G3/36
CPC分类号： G09G3/342 , G02B6/005 , G02B6/0051 , G02B6/0053 , G02B6/0055 , G02B6/3522 , G02F2001/133601 , G09G2320/062 , G09G2320/066
摘要： Disclosed is an edge type backlight unit having a local dimming function realized by adjusting the distance between a light guide plate and a plurality of optical systems disposed under the light guide plate. The edge type backlight unit includes a light guide plate guiding light emitted from a light source, and a luminance control unit including a plurality of optical systems reflecting light guided by the light guide plate and emitting the light to a liquid crystal panel, and controlling luminance by controlling the reflectance of each of the plurality of optical systems according to an input image signal.
摘要翻译：公开了一种边缘型背光单元，其具有通过调整导光板与设置在导光板下方的多个光学系统之间的距离而实现的局部调光功能。边缘型背光单元包括：导光板，其引导从光源发射的光;以及亮度控制单元，包括反射由导光板引导的光并将光发射到液晶面板的多个光学系统，并且控制亮度通过根据输入图像信号控制多个光学系统中的每一个的反射率。

75. 发明授权

US07705278B2 Backlight unit and method of driving the same controlling temperature of the backlight unit 失效
标题翻译：背光单元和驱动背光单元相同控制温度的方法
公开(公告)号：US07705278B2
公开(公告)日：2010-04-27
申请号：US12000959
申请日：2007-12-19
申请人： Jung Kyu Park , Seong Ah Joo , Hun Joo Hahm
发明人： Jung Kyu Park , Seong Ah Joo , Hun Joo Hahm
IPC分类号： G01J1/32 , G09G3/36
CPC分类号： G01J5/60 , G01J1/32 , G01J2001/4252
摘要： Provided is a backlight unit including one or more white light emitting diodes (LEDs) for generating light; an LED module having a printed circuit board (PCB), the LED module supporting and driving the white LED; a sensor for detecting the color temperature of the white LED; a heat generating element connected to the LED module; and a controller for controlling the sensor, the LED module, and the heat generating element.
摘要翻译：提供了一种背光单元，其包括用于产生光的一个或多个白色发光二极管（LED）具有印刷电路板（PCB）的LED模块，所述LED模块支撑并驱动所述白色LED; 用于检测白色LED的色温的传感器; 连接到所述LED模块的发热元件; 以及用于控制传感器，LED模块和发热元件的控制器。

76. 发明授权

US07833811B2 Side-emitting LED package and method of manufacturing the same 有权
标题翻译：侧面发光LED封装及其制造方法
公开(公告)号：US07833811B2
公开(公告)日：2010-11-16
申请号：US12155961
申请日：2008-06-12
申请人： Kyung Taeg Han , Myoung Soo Choi , Seon Goo Lee , Hun Joo Hahm , Seong Yeon Han , Chang Ho Song , Young Sam Park
发明人： Kyung Taeg Han , Myoung Soo Choi , Seon Goo Lee , Hun Joo Hahm , Seong Yeon Han , Chang Ho Song , Young Sam Park
IPC分类号： H01L27/15 , H01L29/24
CPC分类号： H01L33/54 , H01L24/97 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/12035 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射模制部件形成透光表面。封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。本发明还可以通过PCB工艺处理衬底，从而实现批量生产。

77. 发明申请

US20080254558A1 Side-emitting LED package and method of manufacturing the same 有权
标题翻译：侧面发光LED封装及其制造方法
公开(公告)号：US20080254558A1
公开(公告)日：2008-10-16
申请号：US12155961
申请日：2008-06-12
申请人： Kyung Taeg Han , Myoung Soo Choi , Seon Goo Lee , Hun Joo Hahm , Seong Yeon Han , Chang Ho Song , Young Sam Park
发明人： Kyung Taeg Han , Myoung Soo Choi , Seon Goo Lee , Hun Joo Hahm , Seong Yeon Han , Chang Ho Song , Young Sam Park
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L24/97 , H01L25/0753 , H01L33/60 , H01L2224/48091 , H01L2924/12035 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00014
摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.
摘要翻译：本发明涉及一种侧面发光LED封装及其制造方法。侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射模制部件形成透光表面。封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。本发明还可以通过PCB工艺处理衬底，从而实现批量生产。

78. 发明授权

US07663199B2 High power light emitting diode package and fabrication method thereof 失效
标题翻译：大功率发光二极管封装及其制造方法
公开(公告)号：US07663199B2
公开(公告)日：2010-02-16
申请号：US11442414
申请日：2006-05-30
申请人： Seon Goo Lee , Hun Joo Hahm , Dae Yeon Kim , Young Jae Song , Young Sam Park , Chang Ho Song
发明人： Seon Goo Lee , Hun Joo Hahm , Dae Yeon Kim , Young Jae Song , Young Sam Park , Chang Ho Song
IPC分类号： H01L29/78
CPC分类号： H01L33/647 , H01L24/97 , H01L33/60 , H01L33/62 , H01L33/641 , H01L2224/48247 , H01L2924/181 , H01L2224/48091 , H01L2924/00014 , H01L2924/00012
摘要： The invention relates to a high power LED package and a fabrication method thereof. The LED package includes a light emitting part for generating light in response to power applied, a heat conducting member with the light emitting part mounted thereon, a lead part for electrically connecting the light emitting part and a board, and a mold part for integrally fixing the heat conducting member and the lead part. The heat conducting member is composed of at least two metal layers in a height direction, and the lead part includes at least one first lead extended out of the heat conducting member and at least one second lead separated from the heat conducting member. The invention allows integration of two components into a single one, reducing the number of components and simplifying the assembly process, thereby reducing the manufacturing costs.
摘要翻译：本发明涉及一种大功率LED封装及其制造方法。 LED封装包括响应于施加的功率而产生光的发光部，安装有发光部的导热部件，用于电连接发光部和板的引线部，以及用于一体地固定的模具部导热部件和引线部分。导热构件由高度方向上的至少两个金属层构成，引线部包括从导热构件延伸的至少一个第一引线和与导热构件分离的至少一个第二引线。本发明允许将两个组件集成到一个组件中，减少组件的数量并简化组装过程，从而降低制造成本。

79. 发明申请

US20090072119A1 Backlight unit and method of driving the same 失效
标题翻译：背光单元及其驱动方法
公开(公告)号：US20090072119A1
公开(公告)日：2009-03-19
申请号：US12000959
申请日：2007-12-19
申请人： Jung Kyu Park , Seong Ah Joo , Hun Joo Hahm
发明人： Jung Kyu Park , Seong Ah Joo , Hun Joo Hahm
IPC分类号： G01J1/44
CPC分类号： G01J5/60 , G01J1/32 , G01J2001/4252
摘要： Provided is a backlight unit including one or more white light emitting diodes (LEDs) for generating light; an LED module having a printed circuit board (PCB), the LED module supporting and driving the white LED; a sensor for detecting the color temperature of the white LED; a heat generating element connected to the LED module; and a controller for controlling the sensor, the LED module, and the heat generating element.
摘要翻译：提供了一种背光单元，其包括用于产生光的一个或多个白色发光二极管（LED）具有印刷电路板（PCB）的LED模块，所述LED模块支撑并驱动所述白色LED; 用于检测白色LED的色温的传感器; 连接到所述LED模块的发热元件; 以及用于控制传感器，LED模块和发热元件的控制器。

80. 发明授权

US08664687B2 Nitride semiconductor light-emitting device and process for producing the same 失效
标题翻译：氮化物半导体发光器件及其制造方法
公开(公告)号：US08664687B2
公开(公告)日：2014-03-04
申请号：US10898204
申请日：2004-07-26
申请人： Dong Hyun Cho , Masayoshi Koike , Yuiji Imai , Min Ho Kim , Bang Won Oh , Hun Joo Hahm
发明人： Dong Hyun Cho , Masayoshi Koike , Yuiji Imai , Min Ho Kim , Bang Won Oh , Hun Joo Hahm
IPC分类号： H01L33/00
CPC分类号： H01L33/0075 , H01L21/02389 , H01L21/02458 , H01L21/0254 , H01L21/02639 , H01L21/02647
摘要： Provided are a nitride semiconductor light-emitting device comprising a polycrystalline or amorphous substrate made of AlN; a plurality of dielectric patterns formed on the AlN substrate and having a stripe or lattice structure; a lateral epitaxially overgrown-nitride semiconductor layer formed on the AlN substrate having the dielectric patterns by Lateral Epitaxial Overgrowth; a first conductive nitride semiconductor layer formed on the nitride semiconductor layer; an active layer formed on the first conductive nitride semiconductor layer; and a second conductive nitride semiconductor layer formed on the active layer; and a process for producing the same.
摘要翻译：提供一种氮化物半导体发光器件，其包括由AlN制成的多晶或非晶衬底; 形成在所述AlN基板上并具有条纹或格子结构的多个电介质图案; 通过横向外延生长形成在具有电介质图案的AlN衬底上的侧向外延氮化半导体层; 形成在所述氮化物半导体层上的第一导电氮化物半导体层; 形成在所述第一导电氮化物半导体层上的有源层; 以及形成在所述有源层上的第二导电氮化物半导体层; 及其制造方法。

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