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71. 发明申请

US20050007133A1 Articles of manufacture and wafer processing apparatuses 失效
标题翻译：制造和晶圆加工设备
公开(公告)号：US20050007133A1
公开(公告)日：2005-01-13
申请号：US10911119
申请日：2004-08-03
申请人： David Hembree
发明人： David Hembree
IPC分类号： H01L21/00 , B25J15/02
CPC分类号： H01L21/67253 , H01L21/67248
摘要： The present invention includes an electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus. One embodiment of s an electronic device workpiece processing apparatus includes a chuck including a surface, an electrical coupling adjacent the surface, and electrical interconnect configured to connect with the electrical coupling of the chuck and conduct a signal within the chuck; an intermediate member having a first surface and a second surface and the intermediate member including: an electrical coupling adjacent the first surface and configured to couple with the electrical coupling of the chuck; an electrical coupling adjacent the second surface; and an electrical interconnect configured to connect the electrical coupling adjacent the first surface and the electrical coupling adjacent the second surface; and an electronic device workpiece configured to couple with the second surface of the intermediate member, the electronic device workpiece including a sensor and an electrical coupling configured to provide electrical connection of the sensor with the electrical coupling of the second surface of the intermediate member.
摘要翻译：本发明包括电子装置工件处理装置和在电子装置工件处理装置内传送信号的方法。电子设备工件处理设备的一个实施例包括：卡盘，其包括表面，邻近表面的电耦合;以及被配置为与卡盘的电耦合连接并在卡盘内传导信号的电互连; 中间构件，具有第一表面和第二表面，并且所述中间构件包括：与所述第一表面相邻并且被配置为与所述卡盘的电耦合耦合的电耦合; 邻近第二表面的电耦合; 以及电互连，其被配置为将邻近所述第一表面的所述电耦合和邻近所述第二表面的所述电耦合连接; 以及电子设备工件，被配置为与所述中间构件的第二表面联接，所述电子设备工件包括传感器和电耦合，所述电耦合被配置为提供所述传感器与所述中间构件的第二表面的电耦合的电连接。

72. 发明申请

US20070246819A1 Semiconductor components and systems having encapsulated through wire interconnects (TWI) and wafer level methods of fabrication 有权
标题翻译：半导体元件和系统已通过电线互连（TWI）和晶圆级制造方法封装
公开(公告)号：US20070246819A1
公开(公告)日：2007-10-25
申请号：US11409638
申请日：2006-04-24
申请人： David Hembree , Alan Wood
发明人： David Hembree , Alan Wood
IPC分类号： H01L23/04
CPC分类号： H01L24/16 , G01R1/06716 , G01R1/07307 , H01L21/486 , H01L21/565 , H01L21/568 , H01L21/76877 , H01L21/76885 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/81 , H01L24/85 , H01L25/0657 , H01L25/105 , H01L2224/02125 , H01L2224/0233 , H01L2224/02333 , H01L2224/02335 , H01L2224/02372 , H01L2224/02373 , H01L2224/02375 , H01L2224/0333 , H01L2224/0401 , H01L2224/04042 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05548 , H01L2224/05552 , H01L2224/05554 , H01L2224/05555 , H01L2224/05567 , H01L2224/05572 , H01L2224/05624 , H01L2224/05647 , H01L2224/06181 , H01L2224/1134 , H01L2224/13009 , H01L2224/13024 , H01L2224/13082 , H01L2224/131 , H01L2224/16146 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45116 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45639 , H01L2224/45644 , H01L2224/45655 , H01L2224/45684 , H01L2224/45698 , H01L2224/48091 , H01L2224/4813 , H01L2224/48145 , H01L2224/48455 , H01L2224/48463 , H01L2224/4847 , H01L2224/48471 , H01L2224/48475 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2224/4899 , H01L2224/48992 , H01L2224/78301 , H01L2224/85051 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85951 , H01L2225/06506 , H01L2225/06527 , H01L2225/06541 , H01L2225/06562 , H01L2225/1058 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/07811 , H01L2924/10155 , H01L2924/10161 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/1461 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3011 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/45164 , H01L2924/013 , H01L2924/00013
摘要： A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) attached to the substrate contact. The through wire interconnect provides a multi level interconnect having contacts on opposing first and second sides of the semiconductor substrate. The through wire interconnect (TWI) includes a via through the substrate contact and the substrate, a wire in the via having a bonded connection with the substrate contact, a first contact on the wire proximate to the first side, and a second contact on the wire proximate to the second side. The through wire interconnect (TWI) also includes a polymer layer which partially encapsulates the through wire interconnect (TWI) while leaving the first contact exposed. The semiconductor component can be used to fabricate stacked-systems, module systems and test systems. A method for fabricating the semiconductor component can include a film assisted molding process for forming the polymer layer.
摘要翻译：半导体部件包括具有衬底接触的半导体衬底和附着到衬底触点的通线互连（TWI）。通线互连提供了在半导体衬底的相对的第一和第二侧上具有触点的多电平互连。通线互连（TWI）包括穿过基板触点和基板的通孔，通孔中的导线与基板接触具有接合连接，接近第一侧的导线上的第一触点和第二触点电线靠近第二侧。通线互连（TWI）还包括聚合物层，其部分地封装通孔互连（TWI），同时使第一触点暴露。半导体组件可用于制造堆叠系统，模块系统和测试系统。制造半导体部件的方法可以包括用于形成聚合物层的膜辅助成型工艺。

73. 发明申请

US20070200575A1 Circuit and method for error test, recordation, and repair 审中-公开
标题翻译：错误测试，记录和修复的电路和方法
公开(公告)号：US20070200575A1
公开(公告)日：2007-08-30
申请号：US11653066
申请日：2007-01-12
申请人： David Hembree
发明人： David Hembree
IPC分类号： G01R31/02
CPC分类号： G01R1/07371 , G01R1/07357
摘要： A contactor card assembly for use with a semiconductor substrate. An upper keeper plate and a lower keeper plate each include a number of conductive pins extending therethrough, situated in vias filled with an elastomeric material and extending beyond the keeper plates to contact a substrate for testing. An intermediate keeper plate is situated between the upper and lower keeper plates and includes conductive pivot bars in channels filled with elastomeric material. Each conductive pin contacts a pivot bar on one side thereof to electrically communicate with a corresponding pin on the opposite side. Under compression, variations in the height of contacts on the substrate under test are adjusted for by the movement of the pins and pivoting of the pivot bar in the elastomeric material. Methods and process for creating the keeper plates and semiconductor and testing assemblies are also included in the present invention.
摘要翻译：一种与半导体衬底一起使用的接触器卡组件。上保持板和下保持板各自包括延伸穿过其中的多个导电销，其位于填充有弹性体材料并延伸超过保持板的通孔中以接触用于测试的基板。中间保持板位于上部和下部保持板之间，并且在通道中包括导电枢转杆，该通道填充有弹性体材料。每个导电针与其一侧的枢轴接触，以与相对侧上的对应销电连通。在压缩下，通过销的移动和枢转杆在弹性体材料中的枢转来调节被测衬底上的触点高度的变化。用于产生保持板，半导体和测试组件的方法和方法也包括在本发明中。

74. 发明申请

US20070200255A1 SYSTEM FOR FABRICATING SEMICONDUCTOR COMPONENTS WITH THROUGH WIRE INTERCONNECTS 有权
标题翻译：通过电线互连制造半导体器件的系统
公开(公告)号：US20070200255A1
公开(公告)日：2007-08-30
申请号：US11743689
申请日：2007-05-03
申请人： David Hembree
发明人： David Hembree
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L25/0657 , B23K20/004 , B23K20/005 , H01L21/76898 , H01L23/481 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/81 , H01L24/85 , H01L25/50 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/45565 , H01L2224/45644 , H01L2224/4807 , H01L2224/48091 , H01L2224/4813 , H01L2224/48145 , H01L2224/48455 , H01L2224/48471 , H01L2224/48599 , H01L2224/48699 , H01L2224/48992 , H01L2224/78301 , H01L2224/8121 , H01L2224/81224 , H01L2224/81815 , H01L2224/85043 , H01L2224/85045 , H01L2224/85201 , H01L2224/85205 , H01L2224/85951 , H01L2224/9202 , H01L2225/06506 , H01L2225/06527 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/06596 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/0102 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/10329 , H01L2924/12044 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/20751 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/30105 , H01L2924/3025 , H05K3/4046 , H05K2201/10287 , H05K2203/049 , Y10T29/49117 , Y10T29/49147 , Y10T29/49149 , Y10T29/49162 , Y10T29/49169 , Y10T29/53213 , H01L2924/20752 , H01L2924/00 , H01L2924/2075 , H01L2224/05599 , H01L2924/00012 , H01L2224/0555 , H01L2224/0556
摘要： A method for fabricating a semiconductor component with a through wire interconnect includes the step of providing a substrate having a circuit side, a back side, and a through via. The method also includes the steps of: threading a wire through the via, forming a contact on the wire on the back side, forming a bonded contact on the wire on the circuit side, and then severing the wire from the bonded contact. The through wire interconnect includes the wire in the via, the contact on the back side and the bonded contact on the circuit side. The contact on the back side, and the bonded contact on the circuit side, permit multiple components to be stacked with electrical connections between adjacent components. A system for performing the method includes the substrate with the via, and a wire bonder having a bonding capillary configured to thread the wire through the via, and form the contact and the bonded contact. The semiconductor component can be used to form chip scale components, wafer scale components, stacked components, or interconnect components for electrically engaging or testing other semiconductor components.
摘要翻译：用于通过导线互连制造半导体部件的方法包括提供具有电路侧，背面和通孔的基板的步骤。该方法还包括以下步骤：将导线穿过通孔，在背面的导线上形成接触，在电路侧的导线上形成接合接触，然后将线从接合接触件断开。通线互连包括通孔中的导线，背侧的触点和电路侧的接合触点。背面的触点和电路侧的接合触点允许多个部件与相邻部件之间的电连接层叠。用于执行该方法的系统包括具有通孔的基板和具有接合毛细管的引线接合器，所述接合毛细管被配置为使线穿过通孔，并形成接触和接合接触。半导体部件可用于形成用于电接合或测试其它半导体部件的芯片级部件，晶片级部件，堆叠部件或互连部件。

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