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    • 71. 发明授权
    • Semiconductor laser device and manufacturing method thereof
    • 半导体激光器件及其制造方法
    • US07508001B2
    • 2009-03-24
    • US11154807
    • 2005-06-17
    • Tetsuzo UedaMasaaki Yuri
    • Tetsuzo UedaMasaaki Yuri
    • H01L27/15H01L31/12H01L33/00
    • H01S5/34333B82Y20/00H01S5/0213H01S5/0422H01S5/0655H01S5/2009H01S5/2206H01S5/2218H01S5/2232H01S5/3063H01S2304/04H01S2304/12
    • The present invention aims to provide a long-lived semiconductor laser device with low threshold current and available for high-output operation in a blue-violet semiconductor laser device using a nitride semiconductor layer. In the semiconductor laser device, the following layers are sequentially formed on a GaN substrate 1: an n-type GaN layer 2; an n-type AlGaN cladding layer 3, a first n-type GaN guiding layer 4; and a p-type AlGaN blocking layer 6 (current-blocking layer), further a striped opening is formed on a portion of the p-type AlGaN blocking layer 6, a second n-type GaN guiding layer 5 is formed to cover the opening, and the following layers are sequentially formed on the second n-type GaN guiding layer 5: an InGaN multiple quantum well active layer 7; an undoped GaN guiding layer 8; a p-type AlGaN electron overflow suppression layer 9, a p-type AlGaN cladding layer 10, and a p-type GaN contact layer 11.
    • 本发明旨在提供一种具有低阈值电流的长寿命半导体激光器件,并且可用于使用氮化物半导体层的蓝紫色半导体激光器件中的高输出操作。 在半导体激光器件中,在GaN衬底1上依次形成以下层:n型GaN层2; n型AlGaN包覆层3,第一n型GaN引导层4, 和p型AlGaN阻挡层6(电流阻挡层),另外在p型AlGaN阻挡层6的一部分上形成条状开口,形成第二n型GaN引导层5以覆盖开口 并且在第二n型GaN引导层5上依次形成以下层:InGaN多量子阱有源层7; 未掺杂的GaN引导层8; p型AlGaN电子溢出抑制层9,p型AlGaN包覆层10和p型GaN接触层11。
    • 77. 发明授权
    • Semiconductor device
    • 半导体器件
    • US07217960B2
    • 2007-05-15
    • US11325340
    • 2006-01-05
    • Hiroaki UenoTetsuzo UedaYasuhiro UemotoDaisuke UedaTsuyoshi TanakaManabu YanagiharaYutaka HiroseMasahiro Hikita
    • Hiroaki UenoTetsuzo UedaYasuhiro UemotoDaisuke UedaTsuyoshi TanakaManabu YanagiharaYutaka HiroseMasahiro Hikita
    • H01L33/00
    • H01L29/7786H01L29/2003
    • It is an object of the present invention to provide a semiconductor device, which can simultaneously achieve a normally-off mode of HFET and an improvement in Imax, and further achieve an improvement in gm and a reduction in gate leakage current. In order to keep a thin barrier layer 13 on an operation layer 12 of a substrate 11 directly under a gate electrode for mostly contributing to achieve the normally-off mode and also implement the high Imax, it is configured in such a way that a thickness of the barrier layer 13 can be increased by the semiconductor layer 17 between gate and source regions and between gate and drain regions. It is therefore possible to achieve the normally-off mode and an improvement in Imax as compared with an FET in which a thickness of the barrier layer is designed so as to be uniform. An insulating film 18 with a dielectric constant higher than that of the barrier layer is further inserted between a gate electrode 16 and the barrier layers 13, so that an improvement in gm and a reduction in gate leakage current can be achieved.
    • 本发明的一个目的是提供一种半导体器件,其可以同时实现HFET的常闭模式和改进的最大值,并进一步实现gm的改善 和栅极漏电流的减小。 为了在栅电极正下方的基板11的操作层12上保持薄势垒层13,主要用于实现常关模式并且还实现高I max, 配置成使得栅极和源极区域之间以及栅极和漏极区域之间的半导体层17可以增加阻挡层13的厚度。 因此与阻挡层的厚度被设计为均匀的FET相比,可以实现常关模式和I 的改善。 介电常数高于阻挡层的绝缘膜18进一步插入在栅电极16和阻挡层13之间,从而改善gm和栅极漏电流的减小 可以实现。
    • 80. 发明申请
    • Field effect transistor and method for manufacturing the same
    • 场效应晶体管及其制造方法
    • US20060157804A1
    • 2006-07-20
    • US11287482
    • 2005-11-28
    • Tetsuzo Ueda
    • Tetsuzo Ueda
    • H01L29/76
    • H01L29/8122H01L29/2003H01L29/66856
    • A first SiO2 thin film, a tungsten gate electrode, and a second SiO2 thin film are selectively formed on a first n+-type GaN contact semiconductor layer in that order and in a multilayer film structure having the three layers, a stripe-shaped opening is formed. Via the opening, an undoped GaN channel semiconductor layer and the second n+-type GaN contact semiconductor layer are formed so that both the layers are regrown by, for example, metal organic chemical vapor deposition. A source electrode and a drain electrode are formed so as to contact the corresponding second and first n+-type GaN contact semiconductor layers. The regrown undoped GaN channel semiconductor layer and the regrown second n+-type GaN contact semiconductor layer are horizontally grown portions and hence, the contact area of the electrode can be made larger than the area of the opening.
    • 第一个SiO 2薄膜,钨栅电极和第二SiO 2薄膜选择性地形成在第一n + + / GaN接触半导体层,并且在具有三层的多层膜结构中形成条形开口。 通过开口,形成未掺杂的GaN沟道半导体层和第二n + + + GaN接触半导体层,使得这两个层通过例如金属有机化学气相沉积而再生长。 源电极和漏电极形成为与相应的第二和第n + +型GaN接触半导体层接触。 再生未掺杂的GaN沟道半导体层和再生长的第二n + + + GaN接触半导体层是水平生长的部分,因此可以使电极的接触面积大于开口的面积。