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71. 发明授权

US06039157A Eddy current braking system 失效
标题翻译：涡流制动系统
公开(公告)号：US06039157A
公开(公告)日：2000-03-21
申请号：US30329
申请日：1998-02-25
申请人： Chuji Yamada , Shin Kobayashi , Makoto Ogawa , Tohru Kuwahara , Eiji Okumura
发明人： Chuji Yamada , Shin Kobayashi , Makoto Ogawa , Tohru Kuwahara , Eiji Okumura
IPC分类号： H02K49/02 , H02K49/04 , B60L7/00
CPC分类号： H02K49/043
摘要： Magnets (20) are separated by ferromagnetic plates (21) from an inner surface of a brake drum (13) made of steel and secured to a rotational shaft (4). When the rotating brake drum (13) crosses magnetic flux generated by the magnets (20), a braking force caused by eddy currents is produced in the brake drum (13). An annular body (41) formed of a good conductor such as copper is fastened adjacent to at least one side surface of the brake drum (13) in a position axially spaced from the plates (21).
摘要翻译：磁铁（20）由铁磁板（21）从钢制的制动鼓（13）的内表面分离并固定在旋转轴（4）上。当旋转的制动鼓（13）与磁体（20）产生的磁通相交时，在制动鼓（13）中产生由涡流引起的制动力。由诸如铜的良好导体形成的环形体（41）在与板（21）轴向间隔开的位置处紧邻制动鼓（13）的至少一个侧表面附近。

72. 发明授权

US5370714A Method of cultivating mushrooms and woody culture medium therefor 失效
标题翻译：培养蘑菇和木本培养基的方法
公开(公告)号：US5370714A
公开(公告)日：1994-12-06
申请号：US93873
申请日：1993-07-20
申请人： Makoto Ogawa , Takeshi Itoh , Noriaki Seki
发明人： Makoto Ogawa , Takeshi Itoh , Noriaki Seki
IPC分类号： A01G1/04 , C12N1/14
CPC分类号： A01G1/04 , C12N1/14
摘要： There is provided a culture medium for cultivating mushrooms whose material can be selected from a variety of woody materials and which can be transported in a compact form. There is also provided a method of cultivating mushrooms using such a culture medium in which pathogenic and other germs are less likely to breed and with which mushrooms can be cultivated in shorter periods. After adding nutrients such as rice and wheat brans, a mixture of dried sawdust and chip dust is heated at 150.degree.-500.degree. C. for 1-5 minutes under a pressure of 1.0-3.0 t/cm.sup.2 to form a cylindrical woody culture medium. The medium thus obtained is allowed to swell by adding water and then sterilized by sealing it in a bag. Mushroom fungi is then inoculated into it.
摘要翻译：提供了用于培养蘑菇的培养基，其材料可以从各种木质材料中选择，并且可以以紧凑形式运输。还提供了使用这样的培养基培养蘑菇的方法，其中致病性和其它细菌不太可能繁殖，并且可以在较短的时间内培养蘑菇。加入米，小麦等营养成分后，在1.0〜3.0t / cm2的压力下，将干燥的锯屑和碎屑混合物在150〜500℃加热1-5分钟，形成圆筒状的木质培养基。将这样得到的培养基通过加入水溶胀，然后通过将其密封在袋中进行灭菌。然后将蘑菇真菌接种入其中。

73. 发明授权

US5028351A Process for preparing organic smectite by solid-solid reaction 失效
标题翻译：固相反应制备有机蒙皂石的方法
公开(公告)号：US5028351A
公开(公告)日：1991-07-02
申请号：US515305
申请日：1990-04-27
申请人： Chuzo Kato , Kazuyuki Kuroda , Makoto Ogawa
发明人： Chuzo Kato , Kazuyuki Kuroda , Makoto Ogawa
IPC分类号： C04B33/00 , B28C1/10 , C01B33/40 , C01B33/44
CPC分类号： C01B33/44
摘要： A process for preparing organic smectite applied for thickener, protective colloid, dispersant and binder. The present invention features the process for preparing the organic smectite by mixing smectite incluidng 0 to 20% by weight of interlayer water in the interlayer spaces of said smectite with organic cation-supplying substance selected from at least one of aliphatic alkylamine salts, aromatic amine salts and basic organic compound having pyridine nucleus, and/or basic organic molecule in a mixing ratio of the latter to the former of 10 to 500 milliequivalents per 100 g smectite, and stirring the resulting mixture at a temperature of 5.degree. to 50.degree. C. under an applied pressure of 0.5 to 10 kg/cm.sup.2 to cause a solid-solid reaction. By the process of the present invention, exchangeable organic cations and/or basic organic molecules as a guest substance are intercalated int he interlayer spaces of the smectite as a host substance, thus the hydrophilic smectite can convert to the organic smectite by a more simplified solid-solid reaction than a liquid-liquid reaction.
摘要翻译：一种制备有机蒙皂石的方法，用于增稠剂，保护胶体，分散剂和粘合剂。本发明的特征在于通过将含有0-20％重量的层间水的蒙皂石与所述蒙皂石的层间空间中的有机阳离子供应物质混合，所述有机阳离子供体物质选自以下中的至少一种：脂族烷基胺盐，芳族胺盐和具有吡啶核的碱性有机化合物和/或碱性有机分子，其混合比例相对于每100克蒙皂石的10-500毫当量的混合比，并在5℃至50℃的温度下搅拌所得混合物。在0.5〜10kg / cm2的施加压力下进行固体 - 固体反应。通过本发明的方法，作为客体物质的交换性有机阳离子和/或碱性有机分子以蒙脱石的层间空间作为主体物质嵌入，因此亲水性绿土可以通过更简单的固体转化为有机蒙皂石固液反应比液 - 液反应。

74. 发明授权

US09418790B2 Method for manufacturing a multilayer ceramic electronic component 有权
标题翻译：多层陶瓷电子部件的制造方法
公开(公告)号：US09418790B2
公开(公告)日：2016-08-16
申请号：US13433320
申请日：2012-03-29
申请人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
发明人： Shunsuke Takeuchi , Kenichi Kawasaki , Akihiro Motoki , Makoto Ogawa , Shuji Matsumoto , Seiichi Nishihara
IPC分类号： H05K3/02 , H05K3/10 , H01G4/12 , H01G4/005 , H01G4/232
CPC分类号： H01G4/12 , H01G4/005 , H01G4/232
摘要： A multilayer ceramic electronic component including thin external terminal electrodes each having a superior bonding force to a ceramic base body is provided. In order to form the external terminal electrodes, after Cu plating films are deposited on exposed portions of internal electrodes by direct plating on a ceramic base body, a Cu liquid phase, an O2-containing liquid phase, and a Cu solid phase are generated between the Cu plating film and the ceramic base body by a heat treatment, so that Cu oxides are dispersed in the Cu plating film, at least near an interface with the ceramic base body. Since the Cu oxides function as an adhesive, a bonding force of the Cu plating film to the ceramic base body can be increased, and hence the external terminal electrode having a superior bonding force to the ceramic base body can be obtained.
摘要翻译：提供了一种多层陶瓷电子部件，其包括对陶瓷基体具有优良的结合力的薄的外部端子电极。为了形成外部端子电极，通过在陶瓷基体上直接电镀将Cu电镀膜沉积在内部电极的露出部分上之后，会产生Cu液相，含O2液相和Cu固相， Cu镀膜和陶瓷基体进行热处理，使得Cu氧化物至少在陶瓷基体的界面附近分散在Cu镀膜中。由于Cu氧化物作为粘合剂发挥功能，所以可以提高Cu镀膜对陶瓷基体的结合力，因此能够获得与陶瓷基体的粘接力优异的外部端子电极。

75. 发明申请

US20160023626A1 PASSENGER RETAINING APPARATUS 有权
标题翻译：乘客保留装置
公开(公告)号：US20160023626A1
公开(公告)日：2016-01-28
申请号：US14806298
申请日：2015-07-22
申请人： Teruhiko Hiruta , Hiroo Kawaguchi , Makoto Ogawa , Yoshitake Kitaguchi , Toshiro Koyanagi
发明人： Teruhiko Hiruta , Hiroo Kawaguchi , Makoto Ogawa , Yoshitake Kitaguchi , Toshiro Koyanagi
IPC分类号： B60R21/232 , B60R21/216 , B60R21/2342 , B60R21/213 , B60R21/231 , B60R21/2338 , B60R21/20 , B60R21/2165
CPC分类号： B60R21/232 , B60R21/231 , B60R21/2338 , B60R2021/23107
摘要： A passenger retaining apparatus includes a driver seat airbag and a curtain airbag. The curtain airbag includes first and second inflation portions and a recess portion. The first inflation portion is inflated at a passenger side with respect to the inflated driver seat airbag in a vehicle body longitudinal direction. The second inflation portion is inflated at a wind shield side with respect to the inflated driver seat airbag in the vehicle body longitudinal direction. The recess portion is formed between the first and second inflation portions to engage with the inflated driver seat airbag. The driver seat airbag retains a front surface of a head of the passenger and the first inflation portion retains a side surface of the head of the passenger.
摘要翻译：乘客保持装置包括驾驶员座椅安全气囊和帘式安全气囊。帘式安全气囊包括第一和第二充气部分和凹部。第一充气部分在乘客侧相对于充气的驾驶员座椅安全气囊在车身纵向方向上膨胀。相对于车身长度方向上的充气的驾驶员座椅安全气囊，第二充气部在风挡侧膨胀。凹部形成在第一和第二充气部之间以与充气的驾驶员座椅气囊接合。驾驶员座椅安全气囊保持乘客的头部的前表面，并且第一充气部分保持乘员的头部的侧表面。

76. 发明授权

US08804303B2 Multilayer electronic component and method for manufacturing the same 有权
标题翻译：多层电子元件及其制造方法
公开(公告)号：US08804303B2
公开(公告)日：2014-08-12
申请号：US13439916
申请日：2012-04-05
申请人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Shigeyuki Kuroda
发明人： Akihiro Motoki , Makoto Ogawa , Kenichi Kawasaki , Shunsuke Takeuchi , Shigeyuki Kuroda
IPC分类号： H01G4/228 , H01G4/005
CPC分类号： H01C7/008 , B05D5/12 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/228 , H01G4/2325 , H01G4/30 , H01G4/308 , H01L41/083
摘要： A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.
摘要翻译：一种多层电子部件的制造方法，其特征在于，具有：制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序，在所述层叠体的规定表面露出内部电极的边缘并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。形成外部电极的步骤包括：电镀步骤，通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。

77. 发明授权

US08727378B2 Air bag and air bag device 有权
标题翻译：气囊和气囊装置
公开(公告)号：US08727378B2
公开(公告)日：2014-05-20
申请号：US13883220
申请日：2011-11-02
申请人： Teruhiko Hiruta , Mitsuo Maruoka , Makoto Ogawa , Yoshihiro Kobayashi
发明人： Teruhiko Hiruta , Mitsuo Maruoka , Makoto Ogawa , Yoshihiro Kobayashi
IPC分类号： B60R21/203 , B60R21/2338 , B60R21/2342 , B60R21/239
CPC分类号： B60R21/2342 , B60R21/20 , B60R21/203 , B60R21/2338 , B60R21/239 , B60R2021/23382 , B60R2021/2395
摘要： In an air bag main body which inflates step by step in a first stage and a second stage by bonding its peripheral edge portion and bonding its inner side than the peripheral edge portion, a connecting member bridging between a lid member opening and closing a vent hole and a coupling member can be always set to a tension state by arranging an adjusting portion in the coupling member which defining a maximum facing distance between a front panel and a rear panel in the tension state in each of the first stage and the second stage, and whereby a closed state of the vent hole can be maintained.
摘要翻译：在第一阶段和第二阶段通过粘接其周边部分并使其内侧与周缘部分相粘合的气囊主体中的连接构件，其连接在打开和关闭通气孔的盖构件之间并且通过在所述联接构件中布置调节部分，通过在所述第一和第二平台的每一个中在张力状态下限定前面板和后面板之间的最大面向距离，总是将联接构件设置为张力状态，从而可以保持通气孔的关闭状态。

78. 发明授权

US08717739B2 Ceramic electronic component 有权
标题翻译：陶瓷电子元件
公开(公告)号：US08717739B2
公开(公告)日：2014-05-06
申请号：US13419545
申请日：2012-03-14
申请人： Yoji Yamamoto , Akihiro Motoki , Syunsuke Takeuchi , Makoto Ogawa , Toshiyuki Iwanaga
发明人： Yoji Yamamoto , Akihiro Motoki , Syunsuke Takeuchi , Makoto Ogawa , Toshiyuki Iwanaga
IPC分类号： H01G4/005 , H01G4/228
CPC分类号： H01C7/008 , H01C1/14 , H01G4/005 , H01G4/008 , H01G4/012 , H01G4/12
摘要： A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.
摘要翻译：陶瓷电子部件包括大致矩形的陶瓷元件组件，第一外部电极和第二外部电极。第一外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第一镀膜。类似地，第二外部电极包括至少一个镀膜，其包括从外部直接设置在陶瓷元件组件上的第二镀膜。在平面图中，第一和第二电镀膜的每单位面积的表面积等于或大于约1.02。

79. 发明授权

US08631549B2 Method for manufacturing multilayer electronic component 有权
标题翻译：多层电子部件的制造方法
公开(公告)号：US08631549B2
公开(公告)日：2014-01-21
申请号：US13051013
申请日：2011-03-18
申请人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
发明人： Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232
摘要： A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
摘要翻译：层压陶瓷电容器的制造方法包括：制备具有第一主表面，第二主表面，第一端面，第二端面，第一侧表面和第二侧表面的层压体的步骤，绝缘层和具有在第一或第二端面露出的端部的内部电极; 在所述第一和第二端面上形成外部电极的步骤，使得在所述内部电极的所述暴露端部上形成电镀沉积物以彼此连接; 以及形成与外部电极电连接的厚端电极的步骤，使得将导电浆料施加到层压体的第一和第二主表面和第一和第二侧表面的边缘部分上，然后烘烤。

80. 发明授权

US08520361B2 Laminated electronic component 有权
标题翻译：层压电子部件
公开(公告)号：US08520361B2
公开(公告)日：2013-08-27
申请号：US13045585
申请日：2011-03-11
申请人： Akihiro Motoki , Syunsuke Takeuchi , Makoto Ogawa , Kenichi Kawasaki
发明人： Akihiro Motoki , Syunsuke Takeuchi , Makoto Ogawa , Kenichi Kawasaki
IPC分类号： H01G4/228
CPC分类号： H01G4/30 , H01G4/232 , H01G4/2325
摘要： A laminated electronic component includes a first plating film that defines a base for external terminal electrodes and that includes a plurality of layers including a first layer made of, for example, copper and a second layer provided on the first layer. The total thickness of the first plating film is about 3 μm to about 15 μm, and the thickness of the second layer is about 2 to 10 times as thick as the thickness of the first layer. The first layer is formed by electroless plating, and the second layer is formed by electrolytic plating. This formation results in a grain size of about 0.5 μm or more of a metal grain included in the second layer, and thus makes the film less susceptible to oxidation.
摘要翻译：层叠电子部件包括：第一镀膜，其限定外部端子电极的基部，并且包括多个层，所述多个层包括由例如铜制成的第一层和设置在第一层上的第二层。第一镀膜的总厚度为约3μm至约15μm，第二层的厚度为第一层的厚度的约2至10倍。第一层由无电镀形成，第二层通过电解电镀形成。这种形成导致包含在第二层中的约0.5μm或更多的金属颗粒的晶粒尺寸，因此使得膜不易氧化。

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