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    • 76. 发明授权
    • Imaging apparatus and shake correcting method
    • 成像装置和抖动校正方法
    • US08466969B2
    • 2013-06-18
    • US12799812
    • 2010-04-30
    • Kenji Goto
    • Kenji Goto
    • H04N5/228H04N5/217G06K9/40
    • H04N5/23248
    • An imaging apparatus includes: an imaging unit that generates an image signal of a picked up image by performing photoelectric conversion for an optical image formed by an imaging optical system; a shake detecting unit that detects a shake; a correction amount setting unit that sets a shake correction amount used for correcting the shake based on the shake detected by the shake detecting unit; and a correction processing unit that performs correction of distortion aberration generated by the imaging optical system for the picked up image, movement of an extraction area for an image in which the distortion aberration is corrected in accordance with the shake correction amount, and extraction of an image of the extraction area.
    • 一种成像装置包括:成像单元,通过对由成像光学系统形成的光学图像进行光电转换来生成拾取图像的图像信号; 抖动检测单元,其检测抖动; 校正量设定单元,其基于由所述抖动检测单元检测到的抖动来设定用于校正所述抖动的抖动校正量; 以及校正处理单元,其对所拾取的图像执行由成像光学系统产生的畸变像差的校正,根据抖动校正量对其中校正了畸变像差的图像的提取区域的移动,以及 提取区域的图像。
    • 77. 发明授权
    • Light emitting element and manufacturing method thereof
    • 发光元件及其制造方法
    • US07683379B2
    • 2010-03-23
    • US11572547
    • 2005-07-27
    • Kenji GotoTakuya KawashimaNobuo TanabeTatsuya Ito
    • Kenji GotoTakuya KawashimaNobuo TanabeTatsuya Ito
    • H01L27/15
    • H01L33/42
    • A light emitting device having little variation in the intensity of light emitted from the light emitting surface is provided. The light emitting device of exemplary embodiments of the present invention includes a laminated body with a first conductivity type layer and a second conductivity type layer, with a light emitting portion therebetween. The light emitting device also includes a metal thin film layer on the second conductivity type layer of the laminated body, and a transparent conductor on the metal thin film layer. The transparent conductor includes a single layer of transparent conductive film. The grain size in the light emitting surface of the transparent conductive film is not less than 30 nm and not greater than 300 nm.
    • 提供了从发光面发射的光的强度变化小的发光装置。 本发明的示例性实施例的发光器件包括具有第一导电类型层和第二导电类型层的层叠体,其间具有发光部分。 发光装置还包括在层叠体的第二导电类型层上的金属薄膜层和在金属薄膜层上的透明导体。 透明导体包括单层透明导电膜。 透明导电膜的发光面的晶粒尺寸不小于30nm且不大于300nm。
    • 79. 发明申请
    • Surface acoustic wave element and manufacturing method thereof
    • 表面声波元件及其制造方法
    • US20060114081A1
    • 2006-06-01
    • US11282752
    • 2005-11-21
    • Makoto FuruhataKenji GotoHisakatsu Sato
    • Makoto FuruhataKenji GotoHisakatsu Sato
    • H03H9/00
    • H03H3/08H03H9/02566H03H9/02574
    • A surface acoustic wave (SAW) element including a semiconductor substrate on which a semiconductor wiring region and a SAW region are formed alongside in a same plane, a metal wiring formed in the semiconductor wiring region, an insulating layer including the metal wiring and formed throughout on surfaces of the semiconductor wiring region and the SAW region, a most upper layer of the insulating layer formed so as to have a one flat surface throughout the semiconductor wiring region and the SAW region and a uniform thickness from an upper face of the semiconductor substrate, a piezoelectric layer formed on the most upper layer of the insulating layer and an inter digital transducer (IDT) formed on the piezoelectric layer in the SAW region.
    • 一种表面声波(SAW)元件,包括其半导体布线区域和SAW区域沿着同一平面形成的半导体衬底,形成在半导体布线区域中的金属布线,包括金属布线的绝缘层,并且整个形成 在半导体布线区域和SAW区域的表面上,绝缘层的最上层形成为在整个半导体布线区域和SAW区域中具有一个平坦表面,并且从半导体衬底的上表面具有均匀的厚度 ,形成在绝缘层的最上层的压电层和形成在SAW区域中的压电层上的数字互感器(IDT)。