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71. 发明申请

US20110097491A1 CONVEYANCE SYSTEM INCLUDING OPPOSED FLUID DISTRIBUTION MANIFOLDS 审中-公开
标题翻译：包括流体分配管理的输送系统
公开(公告)号：US20110097491A1
公开(公告)日：2011-04-28
申请号：US12606234
申请日：2009-10-27
申请人： David H. Levy , Roger S. Kerr , Todd M. Spath
发明人： David H. Levy , Roger S. Kerr , Todd M. Spath
IPC分类号： C23C16/00 , B65G53/40
CPC分类号： C23C16/54 , C23C16/45551 , C23C16/45565 , C23C16/45574 , C23C16/45589 , C23C16/545
摘要： A fluid conveyance system for thin film material deposition includes a first fluid distribution manifold and a second distribution manifold. The first fluid distribution manifold includes an output face that includes a plurality of elongated slots. The plurality of elongated slots includes a source slot and an exhaust slot. The second fluid distribution manifold includes an output face that includes a plurality of openings. The plurality of openings include a source opening and an exhaust opening. The second fluid distribution manifold is positioned spaced apart from and opposite the first fluid distribution manifold such that the source opening of the output face of the second fluid distribution manifold mirrors the source slot of the output face of the first fluid distribution manifold and the exhaust opening of the output face of the second fluid distribution manifold mirrors the exhaust slot of the output face of the first fluid distribution manifold.
摘要翻译：用于薄膜材料沉积的流体输送系统包括第一流体分配歧管和第二分配歧管。第一流体分配歧管包括包括多个细长槽的输出面。多个细长槽包括源槽和排气槽。第二流体分配歧管包括包括多个开口的输出面。多个开口包括源开口和排气口。第二流体分配歧管与第一流体分配歧管间隔开并相对设置，使得第二流体分配歧管的输出面的源开口反映第一流体分配歧管的输出面的源槽和排气口所述第二流体分配歧管的输出面与第一流体分配歧管的输出面的排气槽反映。

72. 发明申请

US20110097489A1 DISTRIBUTION MANIFOLD INCLUDING MULTIPLE FLUID COMMUNICATION PORTS 审中-公开
标题翻译：分布式分配包括多个流体通讯口
公开(公告)号：US20110097489A1
公开(公告)日：2011-04-28
申请号：US12606220
申请日：2009-10-27
申请人： Roger S. Kerr , David H. Levy , Shelby F. Nelson
发明人： Roger S. Kerr , David H. Levy , Shelby F. Nelson
IPC分类号： C23C16/44 , C23C16/00
CPC分类号： C23C16/45551 , C23C16/45563 , C23C16/45574 , C23C16/45591 , Y10T137/87571
摘要： A fluid conveyance device for thin film material deposition includes a fluid distribution manifold, a primary chamber, and a secondary fluid source. The fluid distribution manifold includes an output face that is connected in fluid communication to the primary chamber. The secondary fluid source is connected in fluid communication to the primary chamber through a plurality of conveyance ports.
摘要翻译：用于薄膜材料沉积的流体输送装置包括流体分配歧管，初级室和次级流体源。流体分配歧管包括与主室流体连通地连接的输出面。二次流体源通过多个输送口与主室流体连通。

73. 发明申请

US20110097488A1 FLUID DISTRIBUTION MANIFOLD INCLUDING MIRRORED FINISH PLATE 审中-公开
标题翻译：流体分配管，包括成型板
公开(公告)号：US20110097488A1
公开(公告)日：2011-04-28
申请号：US12606213
申请日：2009-10-27
申请人： Roger S. Kerr , David H. Levy
发明人： Roger S. Kerr , David H. Levy
IPC分类号： C23C16/44 , C23C16/00 , B23P17/00
CPC分类号： C23C16/45574 , C23C16/45551 , C23C16/545 , Y10T29/49428 , Y10T137/8593
摘要： A fluid distribution manifold includes a first plate and a second plate. At least a portion of at least the first plate and the second plate define a relief pattern. At least one of the first plate and the second plate include a mirrored surface finish. A bonding agent is disposed between the first plate and the second plate such that the first plate and the second plate form a fluid flow directing pattern defined by the relief pattern.
摘要翻译：流体分配歧管包括第一板和第二板。至少第一板和第二板的至少一部分限定浮雕图案。第一板和第二板中的至少一个包括镜面表面光洁度。粘合剂设置在第一板和第二板之间，使得第一板和第二板形成由浮雕图案限定的流体流动引导图案。

74. 发明申请

US20110097487A1 FLUID DISTRIBUTION MANIFOLD INCLUDING BONDED PLATES 审中-公开
标题翻译：流体分配管道包括粘结板
公开(公告)号：US20110097487A1
公开(公告)日：2011-04-28
申请号：US12606212
申请日：2009-10-27
申请人： Roger S. Kerr , David H. Levy
发明人： Roger S. Kerr , David H. Levy
IPC分类号： C23C16/44 , C23C16/00 , B32B37/12
CPC分类号： C23C16/45565 , C23C16/45551 , Y10T137/8593 , Y10T156/10
摘要： A fluid distribution manifold includes a first plate and a second plate. At least a portion of at least the first plate and the second plate define a relief pattern. A metal bonding agent is disposed between the first plate and the second plate such that the first plate and the second plate form a fluid flow directing pattern defined by the relief pattern.
摘要翻译：流体分配歧管包括第一板和第二板。至少第一板和第二板的至少一部分限定浮雕图案。金属粘合剂设置在第一板和第二板之间，使得第一板和第二板形成由浮雕图案限定的流体流动引导图案。

75. 发明申请

US20100072594A1 LOW COST DIE PLACEMENT 有权
标题翻译：低成本放置
公开(公告)号：US20100072594A1
公开(公告)日：2010-03-25
申请号：US12236972
申请日：2008-09-24
申请人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
发明人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
IPC分类号： H01L23/58 , H01L21/56 , H01L21/66 , H01L21/304
CPC分类号： H01L24/81 , H01L21/32055 , H01L21/56 , H01L2221/68322 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68372 , H01L2224/16 , H01L2224/7565 , H01L2224/81001 , H01L2224/812 , H01L2224/81201 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01075 , H01L2924/01077 , H01L2924/01079 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/0401
摘要： Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be flexible or rigid. In some embodiments, the release member can be used for a low cost placement of the IC elements in combination with an SOI (silicon on insulator) wafer and/or an intermediate transfer member. In other embodiments, the release member can be used for a low cost placement of the IC elements in combination with a release wafer.
摘要翻译：示例性实施例提供了使用具有相变材料的释放构件来组装诸如集成电路（IC）芯片的电子设备的方法和系统。具体地说，可以通过引入相变材料的相变来在IC芯片的组装过程中以可缩放的方式选择性地接收，存储，检查，检查和/或释放IC元件/部件。释放构件可以是柔性的或刚性的。在一些实施例中，释放构件可用于与SOI（绝缘体上硅）晶片和/或中间转印构件组合的IC元件的低成本放置。在其他实施例中，释放构件可用于与释放晶片组合的IC元件的低成本放置。

76. 发明申请

US20100072490A1 LOW COST FLEXIBLE DISPLAY SHEET 审中-公开
标题翻译：低成本灵活的显示表
公开(公告)号：US20100072490A1
公开(公告)日：2010-03-25
申请号：US12237073
申请日：2008-09-24
申请人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
发明人： Roger S. Kerr , Timothy J. Tredwell , Seung-Ho Baek
IPC分类号： H01L21/50 , H01L33/00
CPC分类号： H01L24/81 , H01L21/32055 , H01L21/56 , H01L2221/68322 , H01L2221/6835 , H01L2221/68354 , H01L2221/68368 , H01L2221/68372 , H01L2224/16 , H01L2224/7565 , H01L2224/81001 , H01L2224/812 , H01L2224/81201 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01052 , H01L2924/01057 , H01L2924/01077 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00 , H01L2224/0401
摘要： Exemplary embodiments provide methods and systems for assembling electronic devices, such as integrated circuit (IC) chips, onto a subsequent flexible surface using a release member having a phase change material. Specifically, IC elements/components can be selectively received, stored, inspected, repaired, and/or released in a scalable manner during the assembly of IC chips by inducing phase change of the phase change material. The release member can be flexible or rigid. In some embodiments, the release member can be used with an intermediate transfer member. In some embodiments the IC element can be incorporated into a subsequent flexible surface including components for a TV, radiographic detector, sensor array, or any similar product having a requirement to emit, detect, or collect energy. In addition, the IC elements can be RF emitting, or visually emitting.
摘要翻译：示例性实施例提供了使用具有相变材料的释放构件来将诸如集成电路（IC）芯片的电子装置组装到随后的柔性表面上的方法和系统。具体地说，可以通过引入相变材料的相变来在IC芯片的组装过程中以可缩放的方式选择性地接收，存储，检查，检查和/或释放IC元件/部件。释放构件可以是柔性的或刚性的。在一些实施例中，释放构件可与中间转印构件一起使用。在一些实施例中，IC元件可以并入到随后的柔性表面中，包括用于TV，射线照相检测器，传感器阵列或具有发射，检测或收集能量的要求的任何类似产品的组件。此外，IC元件可以是RF发射或视觉发射。

77. 发明申请

US20090217878A1 SYSTEM FOR THIN FILM DEPOSITION UTILIZING COMPENSATING FORCES 有权
标题翻译：用于薄膜沉积的系统利用补偿力
公开(公告)号：US20090217878A1
公开(公告)日：2009-09-03
申请号：US12464904
申请日：2009-05-13
申请人： David H. Levy , Roger S. Kerr , Jeffrey T. Carey
发明人： David H. Levy , Roger S. Kerr , Jeffrey T. Carey
IPC分类号： C23C16/455 , C23C16/458
CPC分类号： C23C16/45551 , B33Y80/00 , C23C16/458 , H01L29/4908 , Y10S438/908
摘要： A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material. A system capable of carrying out such a process is also disclosed.
摘要翻译：公开了一种在衬底上沉积薄膜材料的方法，包括同时引导一系列气体流从薄膜沉积系统的输送头的输出面朝向衬底的表面，并且其中一系列气体流动包括至少第一反应性气体材料，惰性吹扫气体和第二反应性气态材料，其中第一反应性气体材料能够与用第二反应性气态材料处理的基底表面反应。还公开了能够进行这种处理的系统。

78. 发明申请

US20090211791A1 SUBSTRATE FORMED ON CARRIER HAVING RETAINING FEATURES AND RESULTANT ELECTRONIC DEVICE 有权
标题翻译：具有保留功能和结果电子设备的载体上的基板
公开(公告)号：US20090211791A1
公开(公告)日：2009-08-27
申请号：US12394518
申请日：2009-02-27
申请人： Timothy J. Tredwell , Roger S. Kerr
发明人： Timothy J. Tredwell , Roger S. Kerr
IPC分类号： H05K1/00 , H05K3/30
CPC分类号： H05K3/007 , H05K1/0393 , H05K1/05 , H05K3/0052 , H05K3/303 , H05K2201/10166 , H05K2201/10598 , H05K2203/016 , H05K2203/0228 , Y10T29/4913
摘要： A method for forming an electronic device on a flexible substrate conditions at least one surface of a carrier to form at least one retaining feature on the surface for retaining a flexible substrate. The flexible substrate is provided by deposition or lamination f one or more layers of substrate material onto the carrier. A portion of the substrate is processed to form the electronic device on the processed portion of the substrate. At least the processed portion of the substrate is released from the carrier to provide the flexible substrate having electronic device formed thereon. An electronic device is formed on a flexible substrate in accordance with the method.
摘要翻译：在柔性基板上形成电子器件的方法条件是载体的至少一个表面在表面上形成用于保持柔性基底的至少一个保持特征。通过将一层或多层衬底材料沉积或层压到载体上来提供柔性基底。处理衬底的一部分以在衬底的经处理部分上形成电子器件。至少将基板的处理部分从载体上释放，以提供其上形成有电子器件的柔性基板。根据该方法在柔性基板上形成电子器件。

79. 发明申请

US20090081885A1 DEPOSITION SYSTEM FOR THIN FILM FORMATION 有权
标题翻译：薄膜形成沉积系统
公开(公告)号：US20090081885A1
公开(公告)日：2009-03-26
申请号：US11861359
申请日：2007-09-26
申请人： David H. Levy , Roger S. Kerr , Jeffrey T. Carey
发明人： David H. Levy , Roger S. Kerr , Jeffrey T. Carey
IPC分类号： H01L21/311 , C23C16/00
CPC分类号： C23C16/45551 , B33Y80/00 , C23C16/45519 , C23C16/545
摘要： A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film deposition system toward the surface of a substrate, and wherein the series of gas flows comprises at least a first reactive gaseous material, an inert purge gas, and a second reactive gaseous material, wherein the first reactive gaseous material is capable of reacting with a substrate surface treated with the second reactive gaseous material, wherein one or more of the gas flows provides a pressure that at least contributes to the separation of the surface of the substrate from the face of the delivery head. A system capable of carrying out such a process is also disclosed.
摘要翻译：公开了一种在衬底上沉积薄膜材料的方法，包括同时引导一系列气体流从薄膜沉积系统的输送头的输出面朝向衬底的表面，并且其中一系列气体流动包括至少第一反应性气体材料，惰性吹扫气体和第二反应性气体材料，其中第一反应性气体材料能够与用第二反应性气态材料处理的基底表面反应，其中一个或多个气体流动提供至少有助于将衬底的表面与输送头的表面分离的压力。还公开了能够进行这种处理的系统。

80. 发明申请

US20080026581A1 FLEXIBLE SUBSTRATE WITH ELECTRONIC DEVICES FORMED THEREON 失效
标题翻译：柔性基板与其形成的电子器件
公开(公告)号：US20080026581A1
公开(公告)日：2008-01-31
申请号：US11461080
申请日：2006-07-31
申请人： Timothy J. Tredwell , Roger S. Kerr
发明人： Timothy J. Tredwell , Roger S. Kerr
IPC分类号： H01L21/302
CPC分类号： H01L29/78603 , H01L27/1218 , H01L27/1262 , H01L51/0097 , Y02E10/549 , Y02P70/521
摘要： A method of manufacturing an electronic device (10) provides a substrate (20) that has a plastic material. A particulate material (16) is embedded in at least one surface of the substrate. A layer of thin-film semiconductor material is deposited onto the substrate (20).
摘要翻译：制造电子器件（10）的方法提供了具有塑料材料的基底（20）。颗粒材料（16）嵌入在基底的至少一个表面中。将一层薄膜半导体材料沉积在衬底（20）上。

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