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71. 发明授权

US07627947B2 Method for making a multilayered circuitized substrate 失效
标题翻译：制造多层电路化基板的方法
公开(公告)号：US07627947B2
公开(公告)日：2009-12-08
申请号：US11797232
申请日：2007-05-02
申请人： Thomas J. Davis , Subahu D. Desai , John M. Lauffer , James J. McNamara, Jr. , Voya R. Markovich
发明人： Thomas J. Davis , Subahu D. Desai , John M. Lauffer , James J. McNamara, Jr. , Voya R. Markovich
IPC分类号： H05K3/10 , H01R12/04
CPC分类号： H05K3/429 , H05K3/0032 , H05K3/0038 , H05K3/427 , H05K3/445 , H05K3/4623 , H05K3/4641 , H05K2201/0355 , H05K2201/09536 , H05K2201/096 , H05K2203/0143 , H05K2203/0554 , H05K2203/1545 , H05K2203/1572 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are also aligned, the sub-composites are then bonded together, and a plurality of holes are then laser drilled through the entire thickness of the bonded structure. The dielectric layers used in the sub-composites do not include continuous or semi-continuous fibers therein, thus expediting hole formation there-through.
摘要翻译：制造多层电路化基板的方法，其中使用连续工艺来形成每个将形成子复合材料的一部分的导电层。然后对准次级复合材料，使得导电层内的开口也对准，然后将该次级复合材料结合在一起，然后在结合结构的整个厚度上激光钻出多个孔。在次级复合材料中使用的电介质层不包括其中的连续或半连续的纤维，因此加速了孔的形成。

72. 发明申请

US20090093073A1 Method of making circuitized substrate with internal optical pathway using photolithography 失效
标题翻译：使用光刻法制造具有内部光学路径的电路化衬底的方法
公开(公告)号：US20090093073A1
公开(公告)日：2009-04-09
申请号：US11907004
申请日：2007-10-09
申请人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
发明人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
IPC分类号： H01L21/77
CPC分类号： G02B6/43 , G02B6/132 , G02B6/136 , H05K1/0274
摘要： A method of making a circuitized substrate (e.g., PCB) including at least one and possibly several internal optical pathways as part thereof such that the resulting substrate will be capable of transmitting and/or receiving both electrical and optical signals. The method involves forming at least one opening between a side of the optical core and an adjacent upstanding member such that the opening is defined by at least one angular sidewall. Light passing through the optical core material (or into the core from above) is reflected off this angular sidewall. The medium (e.g., air) within the opening thus also serves as a reflecting medium due to its own reflective index in comparison to that of the adjacent optical core material. The method utilizes many processes used in conventional PCB manufacturing, thereby keeping costs to a minimum. The formed substrate is capable of being both optically and electrically coupled to one or more other substrates possessing similar capabilities, thereby forming an electro-optical assembly of such substrates.
摘要翻译：一种制造电路化衬底（例如，PCB）的方法，其包括至少一个可能的几个内部光学路径作为其一部分，使得所得到的衬底将能够传输和/或接收电信号和光信号。该方法包括在光学核心的一侧和相邻的直立构件之间形成至少一个开口，使得开口由至少一个角形侧壁限定。通过光学芯材料（或从上方进入芯体）的光从该角形侧壁反射。因此，开口内的介质（例如空气）由于其相对于相邻的光学芯材料的反射率而与反射介质一样起作用。该方法利用了常规PCB制造中使用的许多工艺，从而将成本降至最低。所形成的基底能够光学和电耦合到具有相似能力的一个或多个其它基底，从而形成这种基底的电光学组件。

73. 发明申请

US20090092353A1 Method of making circuitized substrate with internal optical pathway 有权
标题翻译：制造具有内部光通路的电路化基板的方法
公开(公告)号：US20090092353A1
公开(公告)日：2009-04-09
申请号：US11907006
申请日：2007-10-09
申请人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
发明人： Benson Chan , How T. Lin , Roy H. Magnuson , Voya R. Markovich , Mark D. Poliks
IPC分类号： G02B6/122
CPC分类号： G02B6/1221 , G02B6/132 , G02B6/136 , G02B6/4214 , G02B6/4246 , H05K1/0274
摘要： A circuitized substrate (e.g., PCB) including an internal optical pathway as part thereof such that the substrate is capable of transmitting and/or receiving both electrical and optical signals. The substrate includes an angular reflector on one of the cladding layers such that optical signals passing through the optical core will impinge on the angled reflecting surfaces of the angular reflector and be reflected up through an opening (including one with optically transparent material therein), e.g., to a second circuitized substrate also having at least one internal optical pathway as part thereof, to thus interconnect the two substrates optically. A method of making the substrate is also provided.
摘要翻译：包括作为其一部分的内部光学路径的电路化衬底（例如，PCB），使得衬底能够传输和/或接收电信号和光信号。衬底包括在一个包覆层上的角反射器，使得穿过光学核心的光信号将撞击角形反射器的成角度的反射表面，并通过开口（包括其中具有光学透明材料的一个）反射，例如涉及另外还具有至少一个内部光学路径作为其一部分的第二电路化基板，从而光学地连接两个基板。还提供了制造基板的方法。

74. 发明申请

US20080217050A1 MULTI-LAYERED INTERCONNECT STRUCTURE USING LIQUID CRYSTALLINE POLYMER DIELECTRIC 有权
标题翻译：使用液晶聚合物电介质的多层互连结构
公开(公告)号：US20080217050A1
公开(公告)日：2008-09-11
申请号：US11873435
申请日：2007-10-17
申请人： Frank D. Egitto , Donald S. Farquhar , Voya R. Markovich , Mark D. Poliks , Douglas O. Powell
发明人： Frank D. Egitto , Donald S. Farquhar , Voya R. Markovich , Mark D. Poliks , Douglas O. Powell
IPC分类号： H01R12/04 , B29C65/48
CPC分类号： H01L21/4853 , H01L23/3735 , H01L23/49822 , H01L2224/16225 , H01L2924/01004 , H01L2924/01019 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01322 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/114 , H05K3/429 , H05K3/4602 , H05K3/4608 , H05K3/462 , H05K3/4623 , H05K3/4626 , H05K3/4632 , H05K3/4641 , H05K3/4688 , H05K2201/0141 , H05K2201/0191 , H05K2201/068 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/0959 , H05K2201/096 , H05K2201/10378 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T156/1092
摘要： A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.
摘要翻译：多层互连结构和形成方法。在第一实施例中，第一和第二液晶聚合物（LCP）电介质层分别直接接合到导热层的第一和第二相对表面，没有外在粘合材料将导热层与第一或第二液晶聚合物 LCP电介质层。在第二实施例中，第一和第二2S1P子结构分别直接接合到LCP电介质接合层的第一和第二相对表面，没有外部粘合材料将LCP电介质接合层与第一或第二2S1P子结构结合。

75. 发明授权

US07377033B2 Method of making circuitized substrate with split conductive layer and information handling system utilizing same 有权
标题翻译：制造具有分裂导电层的电路化基板的方法和利用其的信息处理系统
公开(公告)号：US07377033B2
公开(公告)日：2008-05-27
申请号：US11641810
申请日：2006-12-20
申请人： John M. Lauffer , James M. Larnerd , Voya R. Markovich
发明人： John M. Lauffer , James M. Larnerd , Voya R. Markovich
IPC分类号： H01K3/10
CPC分类号： H01L23/49811 , H01L2224/16225 , H01L2224/32245 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H05K1/0216 , H05K1/0256 , H05K1/056 , H05K3/0047 , H05K3/429 , H05K3/44 , H05K3/4641 , H05K2201/093 , H05K2201/09345 , H05K2201/09481 , H05K2201/09663 , H05K2201/0969 , H05K2203/0323 , H05K2203/1476 , Y10T29/49126 , Y10T29/49155 , Y10T29/49162 , Y10T29/49165 , Y10T29/49176 , H01L2224/0401
摘要： A method of making circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. An information handling system, e.g., a mainframe computer, which represents one of the products in which the substrate may be utilized, is also provided.
摘要翻译：一种制造电路化衬底的方法，其包括多个邻接的开放段，其限定导电层内的相对边缘部分以隔离导电层的分离部分，使得该层可用于不同的功能，例如电力和地面元件，在包括基板作为其一部分的产品（例如，电气组件）内。还提供了代表其中可以使用衬底的产品之一的信息处理系统，例如主机计算机。

76. 发明申请

US20070275525A1 Capacitive substrate and method of making same 失效
标题翻译：电容衬底及其制作方法
公开(公告)号：US20070275525A1
公开(公告)日：2007-11-29
申请号：US11438424
申请日：2006-05-23
申请人： Rabindra N. Das , Frank D. Egitto , John M. Lauffer , How T. Lin , Voya R. Markovich
发明人： Rabindra N. Das , Frank D. Egitto , John M. Lauffer , How T. Lin , Voya R. Markovich
IPC分类号： H01L21/8242
CPC分类号： H05K1/162 , H01L27/12 , H01L28/40 , H05K1/0306 , H05K3/125 , H05K3/4667 , H05K2201/0187 , H05K2201/09509 , H05K2203/013
摘要： A capacitive substrate and method of making same in which first and second glass layers are used. A first conductor is formed on a first of the glass layers and a capacitive dielectric material is positioned over the conductor. The second conductor is then positioned on the capacitive dielectric and the second glass layer positioned over the second conductor. Conductive thru-holes are formed to couple to the first and second conductors, respectively, such that the conductors and capacitive dielectric material form a capacitor when the capacitive substrate is in operation.
摘要翻译：电容性基板及其制造方法，其中使用第一和第二玻璃层。第一导体形成在第一玻璃层上，并且电容电介质材料位于导体上方。然后将第二导体定位在电容电介质上，并且第二玻璃层位于第二导体上。形成导电通孔以分别耦合到第一和第二导体，使得当电容基板工作时，导体和电容电介质材料形成电容器。

77. 发明授权

US07301108B2 Multi-layered interconnect structure using liquid crystalline polymer dielectric 有权
标题翻译：使用液晶聚合物电介质的多层互连结构
公开(公告)号：US07301108B2
公开(公告)日：2007-11-27
申请号：US10959711
申请日：2004-10-05
申请人： Frank D. Egitto , Donald S. Farquhar , Voya R. Markovich , Mark D. Poliks , Douglas O. Powell
发明人： Frank D. Egitto , Donald S. Farquhar , Voya R. Markovich , Mark D. Poliks , Douglas O. Powell
IPC分类号： H05K1/11 , H01R12/04
CPC分类号： H01L21/4853 , H01L23/3735 , H01L23/49822 , H01L2224/16225 , H01L2924/01004 , H01L2924/01019 , H01L2924/01046 , H01L2924/01068 , H01L2924/01078 , H01L2924/01322 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/114 , H05K3/429 , H05K3/4602 , H05K3/4608 , H05K3/462 , H05K3/4623 , H05K3/4626 , H05K3/4632 , H05K3/4641 , H05K3/4688 , H05K2201/0141 , H05K2201/0191 , H05K2201/068 , H05K2201/09509 , H05K2201/09536 , H05K2201/09554 , H05K2201/0959 , H05K2201/096 , H05K2201/10378 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T156/1092
摘要： A multi-layered interconnect structure and method of formation. In a first embodiment, first and second liquid crystal polymer (LCP) dielectric layers are directly bonded, respectively, to first and second opposing surface of a thermally conductive layer, with no extrinsic adhesive material bonding the thermally conductive layer with either the first or second LCP dielectric layer. In a second embodiment, first and second 2S1P substructures are directly bonded, respectively, to first and second opposing surfaces of a LCP dielectric joining layer, with no extrinsic adhesive material bonding the LCP dielectric joining layer with either the first or second 2S1P substructures.
摘要翻译：多层互连结构和形成方法。在第一实施例中，第一和第二液晶聚合物（LCP）电介质层分别直接接合到导热层的第一和第二相对表面，没有外在粘合材料将导热层与第一或第二液晶聚合物 LCP电介质层。在第二实施例中，第一和第二2S1P子结构分别直接接合到LCP电介质接合层的第一和第二相对表面，没有外部粘合材料将LCP电介质接合层与第一或第二2S1P子结构结合。

78. 发明授权

US07211289B2 Method of making multilayered printed circuit board with filled conductive holes 有权
标题翻译：制造具有填充导电孔的多层印刷电路板的方法
公开(公告)号：US07211289B2
公开(公告)日：2007-05-01
申请号：US10737974
申请日：2003-12-18
申请人： James M. Larnerd , John M. Lauffer , Voya R. Markovich , Kostas I. Papathomas
发明人： James M. Larnerd , John M. Lauffer , Voya R. Markovich , Kostas I. Papathomas
IPC分类号： B05D5/12 , B28B19/00 , B29B15/10
CPC分类号： H05K3/429 , H01L2224/13 , H05K1/113 , H05K1/115 , H05K3/0032 , H05K3/0035 , H05K3/421 , H05K2201/0347 , H05K2201/09454 , H05K2201/09509 , H05K2201/09518 , H05K2201/09563 , H05K2201/0959 , H05K2201/0969 , H05K2201/09845
摘要： A method of making a printed circuit board in which conductive thru-holes are formed within two dielectric layers of the board's structure so as to connect designated conductive layers. One hole connects two adjacent layers and the other connects two adjacent layers, including one of the conductive layers connected by the other hole. It is also possible to connect all three conductive layers using one or more holes. The resulting holes may be filled, e.g., with metal plating, or conductive or non-conductive paste. In the case of the latter, it is also possible to provide a top covering conductive layer over the paste, e.g., to serve as a pad or the like on the board's external surface.
摘要翻译：一种制造印刷电路板的方法，其中导电通孔形成在板结构的两个电介质层内，以便连接指定的导电层。一个孔连接两个相邻的层，另一个连接两个相邻的层，包括通过另一个孔连接的一个导电层。也可以使用一个或多个孔连接所有三个导电层。所得到的孔可以例如用金属电镀或导电或不导电的糊料填充。在后者的情况下，也可以在浆料上方设置顶部覆盖导电层，例如在板的外表面上用作衬垫等。

79. 发明授权

US07176383B2 Printed circuit board with low cross-talk noise 失效
标题翻译：具有低串扰噪声的印刷电路板
公开(公告)号：US07176383B2
公开(公告)日：2007-02-13
申请号：US10740398
申请日：2003-12-22
申请人： John M. Lauffer , Voya R. Markovich , James J. McNamara, Jr. , David L. Thomas
发明人： John M. Lauffer , Voya R. Markovich , James J. McNamara, Jr. , David L. Thomas
IPC分类号： H05K1/03
CPC分类号： H05K1/0216 , H05K1/0228 , H05K2201/09236 , H05K2201/09672 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165
摘要： A printed circuit board and a method of making same in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.
摘要翻译：一种印刷电路板及其制造方法，其中所述板包括在其相对侧上具有电介质层的公共电源平面和每个所述电介质层上的信号层，每个信号层包括多条基本上平行的信号线，基本相似的方向跨越所述信号层。一个信号层中的信号线的预定部分相对于并且平行于另一个信号层中的相应的信号线，而功率平面位于这些部分之间。在两层中的选定信号线之间提供通孔连接，这些连接通过电源平面中的间隙而发生，从而与其隔离。

80. 发明授权

US07157647B2 Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same 失效
标题翻译：具有填充隔离边界的电路化基板，其制造方法，利用其组合的电气组件以及利用其的信息处理系统
公开(公告)号：US07157647B2
公开(公告)日：2007-01-02
申请号：US10882170
申请日：2004-07-02
申请人： John M. Lauffer , James M. Larnerd , Voya R. Markovich
发明人： John M. Lauffer , James M. Larnerd , Voya R. Markovich
IPC分类号： H05K1/11
CPC分类号： H05K3/44 , H05K1/056 , H05K3/0047 , H05K3/0052 , H05K3/429 , H05K3/4641 , H05K2203/0323 , H05K2203/1476 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155
摘要： A circuitized substrate which includes a plurality of contiguous open segments along a side edge portion of the at least one electrically conductive layer thereof, these open segments isolated by a barrier of dielectric material which substantially fills the open segments, e.g., during a lamination process which bonds two dielectric layers of the substrate to the conductive layer. A method of making the substrate, an electrical assembly utilizing the substrate, a multilayered circuitized assembly also utilizing the substrate and an information handling system, e.g., a mainframe computer, are also provided.
摘要翻译：电路化衬底，其包括沿其至少一个导电层的侧边缘部分的多个邻接的开放段，这些开放段通过电介质材料的屏障隔离，所述阻挡层基本上填充开放段，例如在层压过程期间将基板的两个电介质层粘合到导电层。还提供了制造衬底的方法，利用衬底的电组件，还利用衬底的多层电路化组件和诸如主机的信息处理系统。

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